Patent classifications
G01B7/18
Resistive bridge sensor with temperature compensation
A bridge driver circuit applies a bias voltage across first and second input nodes of a resistive bridge circuit configured to measure a physical property such as pressure or movement. A sensing circuit senses drive current, bias current and common mode current for the bridge driver and sums the sensed currents to generate a source current. The source current is processed to determine a normalized resistance and temperature of the resistive bridge circuit and from which a temperature dependent sensitivity of the resistive bridge circuit is determined. A voltage output at first and second output nodes of the resistive bridge circuit is processed to determine a value of the physical property. This processing further involves applying a temperature correction in response to the determined temperature dependent sensitivity.
CONTROL SYSTEM AND CONTROL METHOD
A control system includes: a piezoelectric element having a deformation amount that varies according to a magnitude of a drive voltage applied to the piezoelectric element; a base on which the piezoelectric element is arranged; a deformation sensor configured to detect a displacement of the base caused by deformation of the piezoelectric element and output the displacement as a displacement signal; and a drive device configured to apply the drive voltage to the piezoelectric element while adjusting the magnitude of the drive voltage so as to reduce a difference between a value of the displacement signal and a value of a setting signal.
METHOD AND APPARATUS FOR LIMB CIRCUMFERENCE MEASUREMENT
Aspects of the subject disclosure may include, for example, obtaining a first plurality of circumference measurements, each of the first plurality of circumference measurements corresponding to a first circumference around a limb of a person at a respective one of a plurality of locations of the limb, each of the first plurality of circumference measurements being obtained from a respective one of a plurality of elastic measurement elements that is positioned at a respective one of the locations; determining, based upon the first plurality of circumference measurements, a first geometric profile along a length of the limb; and outputting data representing the first geometric profile. Other embodiments are disclosed.
Piezoresponsive textile incorporating graphene
An electrically conductive textile containing graphene that undergoes a change in electrical resistance when deformed.
Actuator with backup component failure detection
An actuator includes a ball screw, a rod provided at least partially within the ball screw, a ball nut, a ball nut restraint, a first biasing member disposed at least partially between a proximate end of the rod and a proximate end of the ball screw, and a second biasing member disposed at least partially between a distal end of the ball nut and an inner surface of the ball nut restraint.
STRAIN MONITOR
A strain monitor (1) for attachment to part of a submerged structure (100), the strain monitor comprises: a main body (5), the main body comprising an attachment assembly which is arranged to secure the strain monitor to the submerged structure, a plurality of strain gauge assemblies (3), carried by the main body, arranged in a spaced apart relationship, each strain gauge assembly comprising a strain gauge and a carrier (6), and the strain gauge attached to the carrier, and the strain gauge assembly arranged to selectively adopt a stowed condition and a deployed condition.
METHOD AND APPARATUS FOR ON-CHIP STRESS DETECTION
A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSSs) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.
Flexible display panel, flexible display apparatus, and display control method thereof
The present disclosure is related to a flexible display panel. The flexible display panel may include a display substrate, a plurality of pixel units arranged in an array on the display substrate, and at least a strain sensor on the display substrate. The strain sensor may be arranged corresponding to a region comprising at least one of the plurality of pixel units. The strain sensor may be configured to detect deformation in the region comprising at least one of the plurality of pixel units and to generate a detection signal.
Strain gauge with improved distortion of measured object
A strain gauge includes a flexible substrate, resistors each formed of a film that includes Cr, CrN, and Cr.sub.2N, and a functional layer formed of a metal, an alloy, or a metal compound, the functional layer being in a lower surface of the resistors. The resistors include a first resistor formed on or above a predetermined surface of the substrate; a second resistor of which a grid direction faces a different direction from the first resistor, the second resistor formed on or above the predetermined surface of the substrate or a surface parallel to the predetermined surface; and a third resistor formed on or above a surface adjacent to the predetermined surface of the substrate.
SENSOR DEVICE
Provided is a sensor device in which the sensitivity of a strain sensor is hardly inhibited despite the fact that a glass material is used as a protective material, and in which the glass material hardly breaks. The sensor device of the present invention includes: an optical laminate including a glass film, an adhesive layer, a resin layer, and a pressure-sensitive adhesive layer in the stated order; and a strain-sensing unit, wherein the glass film has a thickness of from 20 μm to 150 μm. In one embodiment, the strain-sensing unit is arranged on a pressure-sensitive adhesive layer side of the optical laminate.