A method for quantifying sensitivity of metrology to process variation including performing metrology, by a metrology tool, on at least one metrology target located at at least one site on a semiconductor wafer, thereby generating a metrology landscape, and calculating a sensitivity metric directly based on the metrology landscape, the sensitivity metric quantifying a sensitivity of the metrology landscape to process variation involved in manufacture of the semiconductor wafer.

A trailer having a kingpin or having a drawbar for coupling a tractor unit on a coupling side of the trailer, wherein the trailer has a detectable pattern on its coupling side, and a tractor unit for coupling to a kingpin or a drawbar of a trailer, wherein the tractor unit has, for the identification of a trailer and/or for assisting a coupling process, in particular on a coupling side of the drawbar, a detection unit for detecting a detectable pattern.

A trailer having a kingpin or having a drawbar for coupling a tractor unit on a coupling side of the trailer, wherein the trailer has a detectable pattern on its coupling side, and a tractor unit for coupling to a kingpin or a drawbar of a trailer, wherein the tractor unit has, for the identification of a trailer and/or for assisting a coupling process, in particular on a coupling side of the drawbar, a detection unit for detecting a detectable pattern.

An axis deviation detection device includes: a first detection unit that detects a first object from pickup information acquired by a camera disposed in an interior of a vehicle cabin of a vehicle; a second detection unit that detects a second object from point information acquired by a LIDAR disposed in an exterior of the vehicle cabin of the vehicle; and an axis deviation angle estimation unit that estimates an axis deviation angle of the LIDAR to the camera, and that estimates that the axis deviation angle of the LIDAR to the camera is a predetermined angle, in a case where a result of comparison between a detection result of the first detection unit and an after-rotation detection result from rotating a detection result of the second detection unit by the predetermined angle about an attachment position of the LIDAR on the vehicle satisfies a predetermined condition.

A device for detecting whether a wafer is present on a clamping jaw and detecting whether the wafer is parallel to a bottom of the clamping jaw. The device for detecting a wafer comprises: a wafer parallel measuring unit arranged in a CMP cleaning and drying device, and used for emitting a parallel measuring laser beam parallel to the bottom of the clamping jaw and receiving the parallel measuring laser beam; a wafer detection unit used for emitting a wafer detecting laser beam to the wafer and receiving the wafer detecting laser beam; and a detection processing unit electrically connected to the wafer parallel measuring unit and the wafer detection unit, and used for determining whether the wafer is present on the clamping jaw and whether the wafer is parallel to the bottom of the clamping jaw according to the received wafer detecting laser beam and parallel measuring laser beam.

The present invention relates to a normal incidence ellipsometer and a method for measuring the optical properties of a sample by using same. The purpose of the present invention is to provide: a normal incidence ellipsometer in which a wavelength-dependent compensator is replaced with a wavelength-independent linear polarizer such that equipment calibration procedures are simplified while a measurement wavelength range expansion can be easily implemented; and a method for measuring the optical properties of a sample by using same.

Methods and apparatus for determining a parameter of a structure fabricated in or on a substrate and compensated for a drift error. The methods comprising: illuminating, at a plurality of times, at least part of the structure with electromagnetic radiation, the at least part of the structure being at a first orientation; sensing, at the plurality of times, a plurality of average reflectances of the at least part of the structure; and determining, based on the plurality of average reflectances, an estimation of the parameter at one or more further times.

Methods and apparatus for determining a parameter of a structure fabricated in or on a substrate and compensated for a drift error. The methods comprising: illuminating, at a plurality of times, at least part of the structure with electromagnetic radiation, the at least part of the structure being at a first orientation; sensing, at the plurality of times, a plurality of average reflectances of the at least part of the structure; and determining, based on the plurality of average reflectances, an estimation of the parameter at one or more further times.

A method and system for measuring signal loss in a fiber optic cable. The tail ends of reference and test fiber optic cables are illuminated with a diffuse light. The head end of each of the reference and test fiber optic cables are positioned in a measurement area. A core imager captures an image of the core of each head-end while it is in the measurement area. Reference and test radiant fluxes emitted from the reference and test head-ends are determined from the respective core images. The relative signal loss of the test fiber optic cable is then determined by comparing the test radiant flux to the reference radiant flux.

A method and system for measuring signal loss in a fiber optic cable. The tail ends of reference and test fiber optic cables are illuminated with a diffuse light. The head end of each of the reference and test fiber optic cables are positioned in a measurement area. A core imager captures an image of the core of each head-end while it is in the measurement area. Reference and test radiant fluxes emitted from the reference and test head-ends are determined from the respective core images. The relative signal loss of the test fiber optic cable is then determined by comparing the test radiant flux to the reference radiant flux.