G01B15/025

X-RAY IMAGING METHOD AND SYSTEM THEREOF
20210278205 · 2021-09-09 ·

An X-ray imaging method includes the following steps: (a) performing a first object imaging and obtaining a first object intensity signal by detecting an X-ray passing through a first object; (b) performing baseline imaging process, obtaining a baseline intensity signal by detecting the X-ray when the first object is not in a FOV; and; (c) obtaining the first thickness of the first object by performing operations on the first object intensity signal, the baseline intensity signal, and the first attenuation coefficient of the first object.

X-RAY-BASED DETERMINING OF WEIGHTS FOR COATED SUBSTRATES

A measurement apparatus includes an x-ray sensor including an x-ray source having a high voltage power supply for emitting an x-ray spectrum and an x-ray detector for providing a measured x-ray signal value responsive to the x-rays received after transmission through a coated substrate including a sheet material having a coating material thereon. A second sensor is a beta gauge or infrared sensor for providing a second sensor signal that includes data for determining a total weight per unit area of the coated substrate or of the sheet material A computing device receives the measured x-ray signal value and the second sensor signal configured to implement an x-ray based calculation that utilizes absorption coefficients for the coating material and sheet material, the measured x-ray signal value, the x-ray spectrum, and the weight measure as a calculation constraint, for computing at least the weight per unit area of the coating material.

INSPECTING METHOD AND INSPECTION APPARATUS FOR MEMBRANEELECTRODE ASSEMBLY

A method of inspecting a membrane-electrode assembly includes obtaining an X-ray transmission image by applying X-rays to the membrane-electrode assembly, and determining whether a foreign matter having a size equal to or larger than a predetermined value is included in the membrane-electrode assembly, according to a brightness reduction amount in each pixel of the X-ray transmission image obtained, while referring to a correlative relationship between the size of the foreign matter measured in a planar direction of the membrane-electrode assembly, and the brightness reduction amount in the X-ray transmission image.

ASSISTED CORROSION AND EROSION RECOGNITION

Systems, methods, and computer readable medium are provided for determining a wall loss measurement associated with corrosion and/or erosion present within an insulated pipe. A inspection image is acquired for a pipe wall of an insulated pipe at a first location and used to determine an inspection thickness of the pipe wall at the first location. An amount of wall loss measurement can be determined based on a difference of a nominal thickness for the pipe wall at the first location and the determined inspection thickness. The wall loss measurement can characterize an amount of wall material lost due to corrosion and/or erosion present in the pipe wall at the first location. The wall loss measurement can be output for further processing and/or display.

METHOD FOR DETERMINING A MATERIAL COMPOSITION
20210148842 · 2021-05-20 · ·

A method comprises the steps of: (a) Obtaining a measured X-ray spectrum for the coated sample, for determining characteristics for the sample and for a coating material; (b) Determining a simulated X-ray spectrum for the sample based on an initial sample composition; (c) Determining an adapted sample composition that improves a match between the characteristics of the sample and an adapted simulated X ray spectrum; (d) Determining an adapted coating thickness for the coating material based on the adapted sample composition and characteristics of the coating; and (e) Repeating the steps (b) to (d) using the adapted sample composition and the adapted coating thickness of the coating material instead of the initial values, wherein the coating thickness is used for determining an absorption of X-rays.

System and Method for X-Ray Imaging Spherical Samples for Quality Inspection

An automatic x-ray inspection system and method for inspecting objects, containing a cabinet, a path for an object to roll within the cabinet, from an entry point to an exit point, wherein the path utilizes gravity to alter the position and orientation of the object as it travels along the path, an x-ray imaging system to image the object along the path within the cabinet, wherein the x-ray imaging system has a field of view that captures views of the object along the object's travel, and a computer algorithm to determine a thickness of at least one of a shell and center of the object, wherein if a uniform thickness is determined, the object is tagged as passed or non-passed.

COMPUTER-IMPLEMENTED METHOD FOR DETERMINING A LOCAL DEVIATION OF A GEOMETRY OF AN OBJECT FROM A TARGET GEOMETRY OF THE OBJECT
20210118164 · 2021-04-22 ·

Described is determining a local deviation of a geometry of an object from a target geometry of the object on the basis of a digital representation of the object that comprises image information items that each specify a value of a measurand for the object at a defined position of the object. This includes determining the object representation, determining a distance field from the image information items of the object representation that comprises distance values for a specific point of the distance field that specifies the shortest distance of the point from a closest material boundary of the geometry of the object, determining the target geometry of the object, and determining the local deviation of the geometry of the object from the target geometry of the object at a test point on a material boundary predefined by the target geometry.

X-ray analysis system, x-ray analysis device, and vapor phase decomposition device
10989678 · 2021-04-27 · ·

Provided is an X-ray analysis system with which it is possible to set appropriate conditions for vapor phase decomposition with ease. The X-ray analysis system includes an X-ray spectrometer and a vapor phase decomposition apparatus. The X-ray spectrometer includes: an X-ray source configured to irradiate a measurement sample having a thin film present on its surface with primary X-rays; a detector configured to measure an intensity of reflected X-rays, or an intensity of fluorescent X-rays; and a calculation unit configured to calculate a film thickness or a coating mass of the thin film based on the intensity of the reflected X-rays or the fluorescent X-rays. The vapor phase decomposition apparatus includes: a vapor phase decomposition portion configured to perform vapor phase decomposition on the thin film; and a control portion configured to determine a vapor phase decomposition time based on the film thickness or the coating mass.

Method for measuring amount of applied coating
10982956 · 2021-04-20 · ·

The method includes: a first profile generation step of generating a first profile of irregularities in a measurement range set on the substrate sheet (2), based on first measurement information acquired at a location upstream of the coating machine (30) and indicating a shape of irregularities of the substrate sheet (2); a second profile generation step of generating a second profile of irregularities in the measurement range, based on second measurement information acquired at a location downstream of the coating machine (30) and indicating the shape of the irregularities of the substrate sheet (2); and a coating amount calculation step of calculating the amount of the applied coating from a difference between the first measurement information and the second measurement information, based on a positional relationship in which the shape of the first profile of irregularities and the shape of the second profile of irregularities are matched to each other.

NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFACE MATERIAL ON SILICON PACKAGES

Aspects of the invention include a non-destructive bond line thickness measurement of thermal interface material on silicon packages. A non-limiting example computer-implemented method includes receiving a chip mounted on a laminate and depositing a high-density material on the chip. The computer-implemented method deposits a thermal interface material on the chip and lids the chip, and the laminate with a lid. The computer-implemented method X-rays the lid, the chip, and the laminate to produce an X-ray and measures, using a processor, from the X-ray a bond line thickness of the TIM as a distance from a bottom of the lid to a top surface of the high-density material.