An electrode-misalignment detection device in a resistance welder that joins members together by holding them between opposing electrodes and applying pressure and electricity thereto includes an electrode misalignment detector that simultaneously approaches outer peripheries of both electrodes to detect misalignment thereof. The electrode misalignment detector includes a clamping member, a signal generator, a non-closed-state detector, and a misalignment determiner. The clamping member is movable toward the electrodes to clamp them from opposite radially outer sides and is settable in a predetermined closed state when the electrodes are located at appropriate positions. The signal generator outputs a movement state signal according to a movement state of the clamping member. The non-closed-state detector detects that the clamping member is in a state other than the predetermined closed state based on the movement state signal. The misalignment determiner determines electrode misalignment if the clamping member is not in the predetermined closed state.

An electrode-misalignment detection device in a resistance welder that joins members together by holding them between opposing electrodes and applying pressure and electricity thereto includes an electrode misalignment detector that simultaneously approaches outer peripheries of both electrodes to detect misalignment thereof. The electrode misalignment detector includes a clamping member, a signal generator, a non-closed-state detector, and a misalignment determiner. The clamping member is movable toward the electrodes to clamp them from opposite radially outer sides and is settable in a predetermined closed state when the electrodes are located at appropriate positions. The signal generator outputs a movement state signal according to a movement state of the clamping member. The non-closed-state detector detects that the clamping member is in a state other than the predetermined closed state based on the movement state signal. The misalignment determiner determines electrode misalignment if the clamping member is not in the predetermined closed state.

A method of detecting an occurrence of misassembled or misalignment of an inner tray during operation of a battery cell activation tray including an outer tray and the inner tray, the method includes installing a distance measuring sensor or an object detection sensor on the outer tray, and measuring a distance to one side surface of the inner tray in a longitudinal direction with the distance measuring sensor at two or more places spaced apart from each to compare the measured distance to a distance to a reference plane where the one side surface of the inner tray in the longitudinal direction is located in a normal state or determining that the misassembly of the inner tray or the misalignment of the inner tray during operation occurs depending on whether the inner tray is detected by the object detection sensor, respectively. A battery cell activation tray is also provided.

A method of detecting an occurrence of misassembled or misalignment of an inner tray during operation of a battery cell activation tray including an outer tray and the inner tray, the method includes installing a distance measuring sensor or an object detection sensor on the outer tray, and measuring a distance to one side surface of the inner tray in a longitudinal direction with the distance measuring sensor at two or more places spaced apart from each to compare the measured distance to a distance to a reference plane where the one side surface of the inner tray in the longitudinal direction is located in a normal state or determining that the misassembly of the inner tray or the misalignment of the inner tray during operation occurs depending on whether the inner tray is detected by the object detection sensor, respectively. A battery cell activation tray is also provided.

Devices, systems, and methods are provided for enhanced sensor alignment. A device may determine a first array of displacement sensors proximate to a first test structure. The device may determine a second array of displacement sensors proximate to a second test structure. The device may apply a test condition to the first array, the second array, the first test structure, and the second test structure. The device may collect a first output from applying the test condition to the first test structure. The device may collect a second output from applying the test condition to the second test structure. The device may generate a first deviation vector associated with the first output. The device may generate a second deviation vector associated with the second output. The device may determine a first design status of the first structure based on the first deviation vector. The device may determine a second design status of the second structure based on the second deviation vector.

An interlock system for an industrial inspection system. The interlock system includes a first interlock mechanism having a projection that has an internal thread extending into the projection; and a second interlock mechanism having a receiving member that receives the projection. The second interlock mechanism has a threaded shaft that extends into the internal thread of the first interlock mechanism when rotated. The second interlock mechanism moves toward the first interlock mechanism when the threaded shaft is rotated.

An interlock system for an industrial inspection system. The interlock system includes a first interlock mechanism having a projection that has an internal thread extending into the projection; and a second interlock mechanism having a receiving member that receives the projection. The second interlock mechanism has a threaded shaft that extends into the internal thread of the first interlock mechanism when rotated. The second interlock mechanism moves toward the first interlock mechanism when the threaded shaft is rotated.

Embodiments of present invention provide a multilayer printed circuit board. The printed circuit board includes a first conducting layer (CL) having a first measurement mark area (MMA) and a second CL having a second MMA. A first polygonal measurement mark (MM) in the first MMA and a second and a third polygonal MM in the second MMA, wherein the second polygonal MM is positioned along an extended first angle bisector bisecting a first vertex of the first polygonal MM and a first vertex of the second polygonal MM is substantially aligned with the first vertex of the first polygonal MM, and wherein the third polygonal MM is positioned along an extended second angle bisector bisecting a second vertex of the first polygonal MM and a first vertex of the third polygonal MM is substantially aligned with the second vertex of the first polygonal MM.

Embodiments of present invention provide a multilayer printed circuit board. The printed circuit board includes a first conducting layer (CL) having a first measurement mark area (MMA) and a second CL having a second MMA. A first polygonal measurement mark (MM) in the first MMA and a second and a third polygonal MM in the second MMA, wherein the second polygonal MM is positioned along an extended first angle bisector bisecting a first vertex of the first polygonal MM and a first vertex of the second polygonal MM is substantially aligned with the first vertex of the first polygonal MM, and wherein the third polygonal MM is positioned along an extended second angle bisector bisecting a second vertex of the first polygonal MM and a first vertex of the third polygonal MM is substantially aligned with the second vertex of the first polygonal MM.

A first harmonic runout simulation hub includes a measuring disc and a clamping portion detachably fixed together, in which the clamping portion is fixed in the middle of the measuring disc; the clamping portion includes a first positioning hole for positioning and clamping, the first positioning hole is a cylindrical hole, and the cylindricity of the first positioning hole is smaller than a preset value; the outer circumference of the measuring disc includes a measuring cylindrical surface having a preset axial length and a bus parallel to an axis of the first positioning hole, the radial distance between the axis of the measuring cylindrical surface and the axis of the first positioning hole is greater than a preset value, and circular runout test values on the measuring cylindrical surface are preset first harmonic runout values.