A method of grinding a workpiece is carried out by a grinding apparatus including a spindle for rotating a grinding wheel, a servomotor for moving the spindle, and a servo driver for sending signals to the servomotor. The method includes a depth-of-cut command issuing step of issuing a command representing a projected depth of cut to the servo driver and a grinding step of grinding the workpiece. In the grinding step, the servo driver finishes movement of the spindle when the spindle has moved by a target distance corresponding to the projected depth of cut.

A system for in-situ measurement of a curvature of a surface of a wafer comprises: a multiwavelength light source module, adapted to emit incident light comprising a plurality of wavelengths; an optical setup configured to combine the incident light into a single beam and to guide the single beam towards a surface of a wafer such that the single beam hits the surface at a single measuring spot on the surface; and a curvature determining unit, configured to determine a curvature of the surface of the wafer from reflected light corresponding to the single beam being reflected on the surface at the single measuring spot.

The optical displacement meter generates, from each position of a plurality of pixel rows in a U direction and a peak position in a V direction, a plurality of profiles of the X-Z cross section, and measures a three-dimensional shape of the measuring object based on the plurality of profiles acquired at different positions in the Y direction. The optical displacement meter determines, based on whether a profile exists in a blind spot region in which it is impossible to measure a height which occurs in a Y-Z cross section corresponding to an angle formed between a light projecting axis of a light projecting section and a light receiving axis of an image sensor based on a principle of triangulation, a part of the three-dimensional shape generated by a measuring unit as an erroneous detection value.

A production system for measuring product thickness in tortilla and tortilla chip production includes a production line, including a cooker/grinder, a sheeter/cutter, and a conveyor belt; and a displacement measurement unit, including a processor, non-transitory memory, an input/output component, a laser sensor for measuring vertical displacement of the conveyor belt and objects thereon, a laser controller, and a displacement calculator. Also disclosed is a method for thickness measurement, including capturing samples, calculating a vertical displacement probability density function, and calculating average product thickness.

A tunable acoustic gradient (TAG) lens includes an acoustic wave generating element and a refractive fluid in a casing cavity surrounded by a lens casing. The lens casing includes case ends which each include a window configuration, a case end rim portion and an enhanced axial compliance portion. The window configuration includes a window and a window mounting portion having an overall window mount dimension along the axial direction. The enhanced axial compliance portion is coupled between the window mounting portion and the case end rim portion and includes a reduced thickness region characterized by a material thickness that is at most 75% of the associated window mount dimension. The axial compliance portion is configured to enhance the axial deflection of the window mounting portion compared to the case end rim portion, when a periodic drive signal is applied to the acoustic wave generating element.

The present subject matter at least provides an apparatus for characterization of a slab of a material. The apparatus comprises two or more frequency-domain optical-coherence tomography (FD-OCT) probes configured for irradiating the slab of material, and detecting radiation reflected from the slab of material or transmitted there-through. Further, a centralized actuation-mechanism is connected to the OCT probes for simultaneously actuating elements in each of the OCT probes to cause a synchronized detection of the radiation from the slab of material. A spectral-analysis module is provided for analyzing at least an interference pattern with respect to each of the OCT probes to thereby determine at least one of thickness and topography of the slab of the material. Further, in some embodiments, the slab of material may include a passivation layer. The apparatus may be configured to determine a thickness of the passivation layer.

A method, an apparatus, and a non-transitory computer-readable medium for measuring a height of a sample includes: receiving, by an optical sensor having pixels, an optical grating image of an illuminated optical grating reflected by a surface of the sample; determining, by a processor, a digital grating image by keeping values of first pixels of the optical grating image and resetting values of second pixels of the optical grating image; and determining the height based on a relationship between an integrated intensity of a portion of the digital grating image and the height.

The thickness of accumulated fiber can be appropriately measured when accumulating and processing fiber. A measuring device includes a distributor 60 that disperses material containing fiber; a mesh belt 72 that accumulates material dispersed by the distributor 60; a roller unit 650 that compresses a second web W2 accumulated on the mesh belt 72; and a measurement device 400 that measures the thickness of the second web W2 after compression by the roller unit 650.

an optical measurement apparatus includes: a probe including a transmissive optical member having a reference surface, the probe being configured to irradiate a sample with light through the reference surface, and receive a first reflected light from the reference surface, a second reflected light from a front side of the sample, and a third reflected light from a back side of the sample; and a calculator configured to calculate a first distance from the reference surface to the front side of the sample with use of a first reflection interference light to be generated by the first reflected light and the second reflected light, and to calculate a thickness of the sample with use of a second reflection interference light to be generated by the second reflected light and the third reflected light.

An optical measurement apparatus includes: a probe including a transmissive optical member having a reference surface, the probe being configured to irradiate a sample with light through the reference surface, and receive a first reflected light from the reference surface, a second reflected light from a front side of the sample, and a third reflected light from a back side of the sample; and a calculator configured to calculate a first distance from the reference surface to the front side of the sample with use of a first reflection interference light to be generated by the first reflected light and the second reflected light, and to calculate a thickness of the sample with use of a second reflection interference light to be generated by the second reflected light and the third reflected light.