A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.

A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.

A physical quantity detection circuit includes a signal conversion circuit configured to output a first differential signal based on an output signal of a physical quantity detection element, an active filter to which a second differential signal based on the first differential signal is input, and an analog/digital conversion circuit configured to sample a third differential signal based on an output signal of the active filter to convert the third differential signal into a digital signal, wherein the active filter includes an operational amplifier, a first chopping circuit disposed in a signal path between the signal conversion circuit and the operational amplifier, and a second chopping circuit disposed in a signal path between the operational amplifier and the analog/digital conversion circuit, and fch<fs/2, the sampling frequency is fs, and the chopping frequency is fch.

A physical quantity detection circuit includes a signal conversion circuit configured to output a first differential signal based on an output signal of a physical quantity detection element, an active filter to which a second differential signal based on the first differential signal is input, and an analog/digital conversion circuit configured to sample a third differential signal based on an output signal of the active filter to convert the third differential signal into a digital signal, wherein the active filter includes an operational amplifier, a first chopping circuit disposed in a signal path between the signal conversion circuit and the operational amplifier, and a second chopping circuit disposed in a signal path between the operational amplifier and the analog/digital conversion circuit, and fch<fs/2, the sampling frequency is fs, and the chopping frequency is fch.

There are provided an excitation electrode, a quartz crystal vibrator element, a quartz crystal vibrator, a sensor, an oscillator, and a method of manufacturing a quartz crystal vibrator element which are not affected by heat in a process or a use environment to surely prevent a frequency fluctuation from occurring, reduction in size of which can be achieved, and which are low in cost and excellent in productivity. The excitation electrodes are disposed on an outer surface of a quartz crystal plate, apply an electrical field for exciting the quartz crystal plate to the quartz crystal plate, have a single layer structure formed of a two-dimensional layered substance, and are used when arranged as a pair so as to be opposed to each other via the quartz crystal plate.

Provided is a dielectric thin film including a metal oxide. The metal oxide includes bismuth, sodium, barium, and titanium, at least a part of the metal oxide is a tetragonal crystal having a perovskite structure, and a (100) plane of at least a part of the tetragonal crystal is oriented in a normal direction do of a surface of the dielectric thin film 3.

Provided is a dielectric thin film including a metal oxide. The metal oxide includes bismuth, sodium, barium, and titanium, at least a part of the metal oxide is a tetragonal crystal having a perovskite structure, and a (100) plane of at least a part of the tetragonal crystal is oriented in a normal direction do of a surface of the dielectric thin film 3.

To improve durability against impact, a quartz crystal resonator element includes a recess in a plan view. The quartz crystal resonator element further includes a first principal surface and a second principal surface that are front and rear surfaces facing away from each other and a side surface disposed between the first principal surface and the second principal surface, and the side surface is formed of flat surfaces and curved surfaces formed by dry etching and alternately arranged. The quartz crystal resonator element preferably has a base and at least one resonating arm extending from the base.

An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).