Patent classifications
G01C19/5719
Angular velocity detection device and angular velocity sensor including the same
An angular velocity detection device includes an outer frame including fixed portions, outer beam portions connected to the fixed portions, a sensing part surrounded by the outer frame with first slit therebetween, and a joint connecting the outer frame and the sensing part. The sensing part includes an inner beam portion, a flexible portion, and a detector. The inner beam portion has a hollow region inside and is square-shaped when viewed from above. The flexible portion is formed in the hollow region of the inner beam portion, and is connected to the inner edge of the inner beam portion. The detector is disposed in the flexible portion. The first slit is formed to surround the sensing part excluding the joint.
High-Q MEMS gyroscope
A system and/or method for efficiently operating a MEMS gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the MEMS gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off. Rotational velocity may be sensed while the proof mass is being driven to a desired oscillating amplitude, while the proof mass is being maintained at a desired oscillating amplitude, and/or while the proof mass amplitude decays.
High-Q MEMS gyroscope
A system and/or method for efficiently operating a MEMS gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the MEMS gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off. Rotational velocity may be sensed while the proof mass is being driven to a desired oscillating amplitude, while the proof mass is being maintained at a desired oscillating amplitude, and/or while the proof mass amplitude decays.
Multi-mass MEMS motion sensor
A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.
Multi-mass MEMS motion sensor
A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.
MEMS gyroscope and electronic device using same
The present invention provides a MEMS gyroscope having internal coupling beam, an external coupling beam, a drive structure and a detection structure. The drive structure includes multiple driving weights, and the detection structure includes multiple testing weights. The drive structure further includes a first decoupling structure and a first transducer. The first decoupling structure is arranged on the side of the driving weight far away from the internal coupling beam, and the first transducer excites the driving weight to vibrate. The MEMS gyroscope of the present invention can fully increase the layout area of the first transducer, thereby realizing a larger vibration amplitude under a small driving voltage, thereby increasing the sensitivity.
METHOD AND STRUCTURE OF MEMS PLCSP FABRICATION
A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.
3-AXIS GYROSCOPE WITH ROTATIONAL VIBRATION REJECTION
Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.
3-AXIS GYROSCOPE WITH ROTATIONAL VIBRATION REJECTION
Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.
GYRO SENSOR APPARATUS
A gyro sensor apparatus includes a driving section that supplies a driving signal, which is for vibrating a sensing element of a vibration-type gyro sensor in a drive axis direction, to the sensing element, and a processing unit that receives a first vibration signal having an amplitude proportional to a driving vibration amplitude, which is an amplitude of vibration in the drive axis direction of the sensing element and a second vibration signal having an amplitude proportional to Coriolis force generated in the sensing element due to an angular velocity of the sensing element. The processing unit is configured to calculate a ratio of Coriolis force to the driving vibration amplitude based on the first vibration signal and the second vibration signal and output a result of the calculation as a result of detection of the angular velocity of the sensing element.