The present invention relates to a method for operating a rotation sensor for detecting a plurality of rates of rotation about orthogonal axes (x,y,z). The rotation sensor comprises a substrate, driving masses, X-Y sensor masses, and Z sensor masses. The driving masses are driven by drive elements to oscillate in the X-direction. The X-Y sensor masses are coupled to the driving masses, and driven to oscillate in the X-Y direction radially to a center. When a rate of rotation of the substrate occurs about the X-axis or the Y-axis, the X-Y sensor masses are jointly deflected about the Y-axis or X-axis. When a rate of rotation of the substrate occurs about the Z-axis, the X-Y sensor masses are rotated about the Z-axis, and the Z sensor masses are deflected substantially in the X-direction.

Embodiments of the present disclosure are directed towards a micro-electromechanical system (MEMS) sensing apparatus, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output the light beam, and a second waveguide aligned endface to endface with the first waveguide. The second waveguide may be configured to receive at least a portion of the light beam from the first waveguide via optical coupling through the aligned endfaces. Either the first or second waveguide may be configured to be moveable in response to an inertial change of the apparatus, wherein movement of the first or second waveguide causes a corresponding change in light intensity of the portion of the light beam, the change in light intensity indicating a measure of the inertial change. Other embodiments may be described and/or claimed.

Embodiments of the present disclosure are directed towards a micro-electromechanical system (MEMS) sensing apparatus, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output the light beam, and a second waveguide aligned endface to endface with the first waveguide. The second waveguide may be configured to receive at least a portion of the light beam from the first waveguide via optical coupling through the aligned endfaces. Either the first or second waveguide may be configured to be moveable in response to an inertial change of the apparatus, wherein movement of the first or second waveguide causes a corresponding change in light intensity of the portion of the light beam, the change in light intensity indicating a measure of the inertial change. Other embodiments may be described and/or claimed.

A physical quantity sensor includes: a base substrate; a movable portion; a plurality of movable electrode fingers which are provided in the movable portion; a fixed electrode finger which is provided on the base substrate; and a fixing portion which fixes the movable portion to the base substrate. In the movable electrode fingers, a movable electrode finger which opposes the fixing portion in the first direction is included. A clearance between the movable electrode finger and the fixing portion is smaller than a clearance between the movable electrode finger and the fixed electrode finger. The width of the movable electrode finger is greater than the width of other movable electrode finger.

A physical quantity sensor includes: a base substrate; a movable portion; a plurality of movable electrode fingers which are provided in the movable portion; a fixed electrode finger which is provided on the base substrate; and a fixing portion which fixes the movable portion to the base substrate. In the movable electrode fingers, a movable electrode finger which opposes the fixing portion in the first direction is included. A clearance between the movable electrode finger and the fixing portion is smaller than a clearance between the movable electrode finger and the fixed electrode finger. The width of the movable electrode finger is greater than the width of other movable electrode finger.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A sensor system is described as including at least two micromechanical inertial sensors, which are movably connected to a substrate, each inertial sensor including a functional layer, the functional layers of the two inertial sensors varying in thickness, and the two inertial sensors being situated next to one another on the substrate.

A sensor system is described as including at least two micromechanical inertial sensors, which are movably connected to a substrate, each inertial sensor including a functional layer, the functional layers of the two inertial sensors varying in thickness, and the two inertial sensors being situated next to one another on the substrate.

A sensor is disclosed for detecting a rotational motion about a resulting sensitivity axis. The sensor includes at least two dual mass gyroscope units, each of the gyroscope units are adapted to detect a rotational motion about a sensitivity axis of the respective gyroscope unit. The sensitivity axes being parallel to each other and to the resulting sensitivity axis. The gyroscope units are interconnected at the inertial masses of the gyroscope units which cause the gyroscope unit to operate synchronously.