A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

An electronic device includes an accommodation space formed between a first base material and a second base material so as to seal a space therebetween, and a functional element in the accommodation space. The accommodation space is formed in an inner region of a bonding portion between the first base material and the second base material. The electronic device includes wirings extending from the inner region through the bonding portion to the outside of the accommodation space. The bonding portion includes a first bonding region and a second bonding region. The wiring includes a first wiring portion having a first direction toward the outside through the first bonding region from the inner region and a second wiring portion having a second direction toward the outside through the second bonding region from the inner region. The first and the second directions are different.

An electronic device includes an accommodation space formed between a first base material and a second base material so as to seal a space therebetween, and a functional element in the accommodation space. The accommodation space is formed in an inner region of a bonding portion between the first base material and the second base material. The electronic device includes wirings extending from the inner region through the bonding portion to the outside of the accommodation space. The bonding portion includes a first bonding region and a second bonding region. The wiring includes a first wiring portion having a first direction toward the outside through the first bonding region from the inner region and a second wiring portion having a second direction toward the outside through the second bonding region from the inner region. The first and the second directions are different.

A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.

A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

A bendable apparatus is provided. The flexible material has a first-surface spanned by a first direction and a second direction. The bendable apparatus also includes a first-constraining surface one of: formed in the first-surface of the flexible material; or attached to the first-surface of the flexible material; and a piezo-electric element including a first-edge surface and a second-edge surface opposing the first-edge surface. The piezo-electric element is fixedly attached on the first-surface of the flexible material, so that: the first-edge surface and the second-edge surface are at least approximately perpendicular to the first-surface of the flexible material, and the first-constraining surface is adjacent to the first-edge surface of the piezo-electric element. When a voltage is applied to the piezo-electric element, the piezo-electric element expands in length, the first-edge surface of the piezo-electric element applies a force on the first-constraining surface, and the flexible material bends.