A sensor element for storing rotation or position information includes a substrate and a domain wall conductor arranged on the substrate. A course of the domain wall conductor is of a closed circumferential, continuous configuration without crossings. The domain wall conductor comprises a first region having a positive curvature and a second region having a negative curvature.

Positioner assemblies may be configured to sense at least one position of at least a portion of a valve assembly that is moved along a first axis of movement. A movable element of the positioner assembly is configured to rotate about a second axis of movement, where the first axis of movement is substantially parallel to the second axis of movement. Valve systems and methods of sensing a position of a component of a valve system may include such a positioner assembly.

Positioner assemblies may be configured to sense at least one position of at least a portion of a valve assembly that is moved along a first axis of movement. A movable element of the positioner assembly is configured to rotate about a second axis of movement, where the first axis of movement is substantially parallel to the second axis of movement. Valve systems and methods of sensing a position of a component of a valve system may include such a positioner assembly.

A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.

A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.

A MEMS sensor generates an output multiscale reading signal supplied to a full scale adjustment stage. The full scale adjustment stage includes a signal input configured to receive the reading signal, a saturation assessment block, and a full scale change block. The saturation assessment block is coupled to the signal input and configured to generate a scale increase request signal upon detection of a saturation condition. The full scale change block is coupled to the saturation assessment block and configured to generate a full scale change signal upon reception of the scale increase request signal.

A MEMS sensor generates an output multiscale reading signal supplied to a full scale adjustment stage. The full scale adjustment stage includes a signal input configured to receive the reading signal, a saturation assessment block, and a full scale change block. The saturation assessment block is coupled to the signal input and configured to generate a scale increase request signal upon detection of a saturation condition. The full scale change block is coupled to the saturation assessment block and configured to generate a full scale change signal upon reception of the scale increase request signal.

A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.

A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.

Positioner assemblies may be configured to sense at least one position of at least a portion of a valve assembly that is moved along a first axis of movement. A movable element of the positioner assembly is configured to rotate about a second axis of movement, where the first axis of movement is substantially parallel to the second axis of movement. Valve systems and methods of sensing a position of a component of a valve system may include such a positioner assembly