An operator is able to easily perform down-tuning while still achieving superior responsiveness and, in some cases, obtain an equivalent responsiveness as that obtained from the flow rate control device currently being used. In a flow rate control device that performs feedback control of a fluid control valve such that a measured flow rate closely approximates a target flow rate, there are provided a response lag input section that inputs a response lag set value, which is a value showing a response lag that an operator wishes to set, and a response lag generating section that generates response lags used in the feedback control in accordance with the response lag set values.

A circuit arrangement (1) for monitoring the temperature of an electronic component (2), which, in particular, can be impinged with an electric current and can be connected to at least one voltage source (3). The circuit arrangement is able to guarantee safe monitoring of the temperature of an electronic component impinged with electric current by the electronic component (2) being part of at least one Wheatstone bridge (7) and by at least one switching device (8) being provided that influences the impingement of the electronic component (2) with electric current on the basis of a bridge transverse voltage of the Wheatstone bridge (7). Additionally, circuit arrangement (1) is well suited for use in a calorimetric mass flowmeter (18).

A circuit arrangement (1) for monitoring the temperature of an electronic component (2), which, in particular, can be impinged with an electric current and can be connected to at least one voltage source (3). The circuit arrangement is able to guarantee safe monitoring of the temperature of an electronic component impinged with electric current by the electronic component (2) being part of at least one Wheatstone bridge (7) and by at least one switching device (8) being provided that influences the impingement of the electronic component (2) with electric current on the basis of a bridge transverse voltage of the Wheatstone bridge (7). Additionally, circuit arrangement (1) is well suited for use in a calorimetric mass flowmeter (18).

The present invention provides a thermal flow meter which can suppress a degradation of measurement accuracy caused by deformation of a diaphragm and a stained rear surface thereof even in a case where a gap is provided in order to form the diaphragm in an air flow sensing element. The present invention relates to a thermal flow meter 300 which includes a bypass passage through which a measurement target gas 30 received from a main passage 124 flows, and an air flow sensing element which measures a flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30 flowing through the bypass passage. The thermal flow meter 300 includes at least a circuit package 400 which contains the air flow sensing element 602. A gap 674 is formed in a rear surface of the air flow sensing element 602 to form a diaphragm 672 in an air flow sensing area 437 of the air flow sensing element 602, and the gap 674 becomes a sealed space reduced in pressure compared to an atmospheric pressure.

A flow measurement probe includes an elongate probe having an averaging pitot tube with a plurality of upstream and downstream openings arranged along a length of the elongate probe, and a thermal flow measurement sensor coupled to the elongate probe. A method of measuring fluid flow rate in a process includes calculating a flow rate of the fluid using differential pressure in upstream and downstream openings of an averaging pitot tube in an elongate probe when the differential pressure is at least a defined measurement threshold, and calculating the flow rate of the fluid with a thermal mass flow sensor coupled to the flow measurement probe when the differential pressure is less than the defined measurement threshold.

A flow measurement probe includes an elongate probe having an averaging pitot tube with a plurality of upstream and downstream openings arranged along a length of the elongate probe, and a thermal flow measurement sensor coupled to the elongate probe. A method of measuring fluid flow rate in a process includes calculating a flow rate of the fluid using differential pressure in upstream and downstream openings of an averaging pitot tube in an elongate probe when the differential pressure is at least a defined measurement threshold, and calculating the flow rate of the fluid with a thermal mass flow sensor coupled to the flow measurement probe when the differential pressure is less than the defined measurement threshold.

In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.

In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.

The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flowmeter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

A method for determining at least one gas parameter, of a flowing gas, by means of a flow meter, comprising a measurement section having a heating element and at least three temperature sensors, over which the gas is fed, at least one first temperature sensor being arranged upstream of the heating element, at least one second temperature sensor being arranged in the region of the heating element, and at least one third temperature sensor being arranged downstream of the heating element, wherein a calculation unit determines the at least one gas parameter as a function of the temperature measurement values at the first, second and third temperature sensors, and/or at least two separate gas parameters as a function of the temperature measurement values of individual different temperature sensors and/or the combinations of temperature measurement values of different temperature sensors.