In order to provide a fluid device that makes it possible for operation command signals other than existing operation command signals to be received without a software modification having to be implemented in an already constructed system, in a fluid device that measures or controls physical quantities of a fluid, there are provided a command signal receiving unit that receives a predetermined plurality of types of operation command signals, and also command signal modes, which are values thereof or time series variations of the values thereof, and a command signal recognition unit that, when the command signal mode of a predetermined operation command signal received by the command signal receiving unit falls outside predetermined conditions that have been set in advance, recognizes the predetermined operation command signal that contains the command signal mode as being a different type of operation command signal.

An open dynamic flux chamber (10) comprising: a cylindrical box-like body having a bottom opening designed to be rested on an emitting surface; an inlet (15) for a vector gas, positioned on said box-like body; a hole (16) for taking measurements, positioned on said box-like body; at least one vent hole (17) positioned on said box like body to place the mixture of gas present in said box like body in contact with the outside environment; characterized in that said flux chamber (10) has an flat upper base (1) and comprises a tubular shaped windbreak (40) positioned above said upper base (11) to protect said at least one vent hole (17) and having a length greater than 30 cm and a width greater than 5 cm.

An open dynamic flux chamber (10) comprising: a cylindrical box-like body having a bottom opening designed to be rested on an emitting surface; an inlet (15) for a vector gas, positioned on said box-like body; a hole (16) for taking measurements, positioned on said box-like body; at least one vent hole (17) positioned on said box like body to place the mixture of gas present in said box like body in contact with the outside environment; characterized in that said flux chamber (10) has an flat upper base (1) and comprises a tubular shaped windbreak (40) positioned above said upper base (11) to protect said at least one vent hole (17) and having a length greater than 30 cm and a width greater than 5 cm.

The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710. Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.

The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710. Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.

An airflow velocity measuring apparatus that includes a fixed-temperature heat generating device. The fixed-temperature heat generating device includes a power supply, a positive-temperature-coefficient thermistor element, a switching element, a comparator element, a first negative-temperature-coefficient thermistor element, a second negative-temperature-coefficient thermistor element, and plural resistor elements. The positive-temperature-coefficient thermistor element is disposed at a measuring point at which the velocity of airflow is measured. The switching element is repeatedly turned ON and OFF so as to cause the positive-temperature-coefficient thermistor element to generate heat at a preset temperature, thereby applying a pulse voltage from the power supply to the positive-temperature-coefficient thermistor element. The airflow velocity measuring apparatus measures the velocity of airflow at the measuring point based on the waveform of this pulse voltage. Adding of a second switch makes it possible to correct measurement errors caused by a rise or a fall in the temperature of subject airflow.

Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector provided in a thermal flow meter. The thermal flow meter includes a bypass passage through which a measurement target gas 30 flowing through a main passage flows, and a circuit package 400 which includes a measurement circuit for measuring a flow rate of the measurement target gas 30 flowing through the bypass passage and a temperature detecting portion 452 for detecting a temperature of the measurement target gas. The circuit package 400 includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion 424 molded by the resin. The temperature detecting portion 452 is provided in the leading end portion of the protrusion 424, and at least the leading end portion of the protrusion protrudes to the outside from a housing 302.

Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector provided in a thermal flow meter. The thermal flow meter includes a bypass passage through which a measurement target gas 30 flowing through a main passage flows, and a circuit package 400 which includes a measurement circuit for measuring a flow rate of the measurement target gas 30 flowing through the bypass passage and a temperature detecting portion 452 for detecting a temperature of the measurement target gas. The circuit package 400 includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion 424 molded by the resin. The temperature detecting portion 452 is provided in the leading end portion of the protrusion 424, and at least the leading end portion of the protrusion protrudes to the outside from a housing 302.

Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512, sealing with a mold resin, and cutting off the support frame 512, wherein cut end portions 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.

Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512, sealing with a mold resin, and cutting off the support frame 512, wherein cut end portions 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.