G01J1/0214

Proximity sensor with infrared ink coating

A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector filled with an infrared ink. In some embodiments, an infrared ink can cover at least a portion of a top surface of the sensor and define apertures above the light detector and/or light emitter.

Light Detection using an Aperture
20210255033 · 2021-08-19 ·

The present disclosure relates to limitation of noise on light detectors using an aperture. One example implementation includes a system. The system includes a lens disposed relative to a scene. The lens focuses light from the scene. The system also includes an aperture defined within an opaque material. The system also includes a waveguide having a first side that receives light focused by the lens and transmitted through the aperture. The waveguide guides the received light toward a second side of the waveguide opposite to the first side. The waveguide has a third side extending between the first side and the second side. The system also includes an array of light detectors that intercepts and detects light propagating out of the third side of the waveguide.

Display device

A display device includes: a display panel including a display region where a user image is displayed and a measurement region; a transparent front panel disposed on a front side of the display panel; a bonding layer provided between the display panel and the front panel to avoid a first space and cover the display region, and bonding the display panel and the front panel together; and a component placed in the first space, the component including a detector configured to detect a physical property of the measurement region in the first space and flexible print circuits with the detector mounted thereon, and the flexible print circuits extending from the first space to an outside of an interspace between the display panel and the front panel.

IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE
20210258517 · 2021-08-19 ·

An artifact caused by secondary reflection is reduced. An imaging device according to an embodiment includes: a diffuser (110) that converts incident light into scattered light whose diameter is expanded in accordance with a propagation distance and outputs the scattered light; and a light receiver (132) that converts light diffused by the diffuser into an electric signal.

ISOLATION OF WAVEGUIDE-INTEGRATED DETECTORS USING A BACK END OF LINE PROCESS

An optical device includes a substrate, a dielectric layer on the substrate, a waveguide within the dielectric layer, a light sensitive component (e.g., a photodetector) in the dielectric layer and coupled to the waveguide, and a plurality of light isolation structures in at least one of the substrate or the dielectric layer and configured to prevent stray light from reaching the light sensitive component. In some embodiments, a light isolation structure in the plurality of light isolation structures includes two opposing sidewalls and a filling material between the two opposing sidewalls. The two opposing sidewalls include an optical isolation layer. The filling material is characterized by a coefficient of thermal expansion (CTE) matching a CTE of at least one of the substrate or the dielectric layer.

SPAD PIXEL CIRCUITS AND METHODS THEREOF FOR DIRECT TIME OF FLIGHT SENSORS
20210296377 · 2021-09-23 ·

The present invention relates generally to sensing devices. In a specific embodiment, the present invention provides a SPAD pixel device that include a p-type material that partially encloses an n-type material. The junction between the p-type material and the n-type material is three dimensional and includes both a horizontal area and lateral areas. The SPAD pixel device also includes isolation structures that separate the SPAD pixel device from others. There are other embodiments as well.

Optical sensor package assembly, manufacturing method thereof and electronic devices

An optical package assembly can include: a first circuit board; a second circuit board and a first structure arranged on the first circuit board, where the second circuit board is adjacent to the first structure; and a second structure arranged on the second circuit board, where a thickness of the first structure is equal to a combined thickness of the second circuit board and the second structure.

Light detection using an aperture
11041753 · 2021-06-22 · ·

The present disclosure relates to limitation of noise on light detectors using an aperture. One example implementation includes a system. The system includes a lens disposed relative to a scene. The lens focuses light from the scene. The system also includes an aperture defined within an opaque material. The system also includes a waveguide having a first side that receives light focused by the lens and transmitted through the aperture. The waveguide guides the received light toward a second side of the waveguide opposite to the first side. The waveguide has a third side extending between the first side and the second side. The system also includes an array of light detectors that intercepts and detects light propagating out of the third side of the waveguide.

Electromagnetic wave detection device
11047732 · 2021-06-29 · ·

An electromagnetic wave detection device comprising a support body having one surface to be irradiated with an electromagnetic wave, at least one electromagnetic wave detection element provided on the support body, and at least one waveguide structure each of which is supported on the support body, has a first aperture opened to a side of the one surface of the support body, and forms a waveguide that narrows in a direction away from the one surface.

METHOD AND APPARATUS FOR FOCUS CORRECTION OF MULTI-IMAGE LASER BEAM QUALITY MEASUREMENTS
20210199495 · 2021-07-01 · ·

The present application discloses a method and apparatus for compensation of focal errors in laser beam measurement instruments that characterize beam parameters by analyzing images of Rayleigh scatter taken at multiple angles around the beam axis. If the laser beam is not precisely positioned, these images may not be in focus, and the instrument will not report accurate results. This method and apparatus finds the longitudinal axis of the beam by analyzing the beam location in at least two images. All images are subdivided into slices and distances from the beam axis to the focal plane for each slice are calculated and used to find an out-of-focus transfer function for each slice, which is used in combination with the modulation transfer function of the system to deconvolve the slice. Images formed by reassembling the deconvolved slices can then be analyzed to obtain the correct beam parameters.