An illumination device and method is provided herein for calibrating individual LEDs in the illumination device, so as to obtain a desired luminous flux and a desired chromaticity of the device over changes in drive current, temperature, and over time as the LEDs age. The calibration method may include subjecting the illumination device to a first ambient temperature, successively applying at least three different drive currents to a first LED to produce illumination at three or more different levels of brightness, obtaining a plurality of optical measurements from the illumination produced by the first LED at each of the at least three different drive currents, obtaining a plurality of electrical measurements from the photodetector and storing results of the obtaining steps within the illumination device to calibrate the first LED at the first ambient temperature. The plurality of optical measurements may generally include luminous flux and chromaticity, the plurality of electrical measurements may generally include induced photocurrents and forward voltages, and the calibration method steps may be repeated for each LED included within the illumination device and upon subjecting the illumination device to a second ambient temperature.

An optical detecting device has gas emission and pressure reduction function and includes a holder, a light penetrating component, a light detecting component, a hole structure, and a. The light penetrating component is disposed on the holder to form an accommodating space whereinside the light detecting component is disposed. The hole structure is formed on the holder to connect with the accommodating space. The waterproofing and ventilating component is disposed on the holder and covers the hole structure to prevent liquid from leaking into the accommodating space via the hole structure. While an inner gas pressure of the accommodating space is decreased, part of the gas is exhausted from the accommodating space via the hole structure and the waterproofing and ventilating component.

An apparatus and method of assembly are described that provide improved mechanisms for cooling an optoelectronic transducer in a fiber optic system. The apparatus includes a thermoelectric cooler (TEC) secured to the optoelectronic transducer for removing heat from the optoelectronic transducer in response to instructions from a TEC driver, as well as a microcontroller electrically connected to the TEC driver for monitoring temperature and communicating with the TEC driver to selectively activate and deactivate the TEC at least partially based on the monitored temperature and/or other measured/detected data to effect a more efficient cooling mechanism for optoelectronic transducers, such as VCSELs. In addition, the user may be able to configure the system to maintain the optoelectronic transducer within a user-defined range of temperatures. In this way, a longer life and better performance of the optoelectronic transducer may be achieved, and datacenter costs related to cooling and/or maintenance may be minimized.

A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.

An optical measurement apparatus includes a thermal insulation housing, a first light-transmissive plate, a second light-transmissive plate, a heat-conductive layer, a cooling source and a photosensor. The thermal insulation housing, the first light-transmissive plate and the second light-transmissive plate define a chamber. The heat-conductive layer is disposed in the chamber, the cooling source is coupled to the heat-conductive layer, and the photosensor is disposed outside the chamber and on one side of the second light-transmissive plate facing away from the first light-transmissive plate.

An infrared imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

One embodiment provides a pyranometer, including: a pyranometer housing; and at least one radiation sensor; wherein the at least one radiation sensor is electrically isolated from the pyranometer housing and thermally coupled to the pyranometer housing by at least one supporting element, wherein the supporting element is connected to the pyranometer housing and is configured to support the at least one radiation sensor. Other aspects are described and claimed.

One embodiment provides a pyranometer, including: a dome; a thermopile-based sensor comprising a receiving surface; a diffusor configured to diffuse radiation external to the pyranometer and passing through the dome, toward the receiving surface of thermopile-based sensor; and at least one optical filter arranged in an optical path of the radiation in front of the receiving surface of the thermopile-based sensor so as to modify the spectral composition of the radiation measured by the thermopile-based sensor. Other aspects are described and claimed.

A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

An electromagnetic wave module comprising a chip and a lens unit. The chip has a first face, a second face opposed to the first face, and a third face connecting the first face and the second face. The lens unit has a curved face forming a lens, a fourth face opposed to the curved face, and a recessed portion encompassed in an outer edge of the curved face on a projected plane in an optical axis of the lens. The recessed portion has a fifth face disposed at a position closer to the curved face than the fourth face, and a sixth face connecting the fifth face and the fourth face. At least a part of the sixth face of the recessed portion is in contact with at least a part of the third face of the chip.