A light detection device includes an APD, a plurality of temperature compensation diodes, and a circuit unit. The plurality of temperature compensation diodes have different breakdown voltages lower than a breakdown voltage of the APD. The circuit unit puts any one of the plurality of temperature compensation diodes into a breakdown state. The circuit unit includes a plurality of terminals and a terminal. The plurality of terminals are respectively connected to electrodes of the mutually different temperature compensation diodes. The terminal is electrically connected to the APD and electrodes of the temperature compensation diodes.

Described are an apparatus and a method for manufacturing a three-dimensional body comprising mutually oriented devices. In accordance with the invention, a substrate having a first and a second substrate region is provided. A first device is provided in the first substrate region. A second device is provided in the first or in the second substrate region. The substrate is bent along at least one bending edge in order to obtain a three-dimensional body. In accordance with the invention, the first device and the second device are oriented to each other by the bending in order to provide a communications path between the same.

A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.

A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

The present invention relates to an optical energy meter. Illustrative embodiments of the present disclosure include a system controller, temperature sensing system, vibration sensing system, torque sensing system, graphical display system, climate control system, and vibration control system. The invention measures the radiation pressure of incident high power electromagnetic radiation. The measurement of radiation pressure can be used to determine the power of the radiation; that is, the purposes of the invention are to measure, with high precision and accuracy, and survive the power of an incident high power electromagnetic beam while minimizing size, weight, and power requirements.

An optical seeker assembly having an optical detector located within the wing or canards of a precision guided munition. The optical seeker provides on-wing processing that generates low bandwidth detection data that can be easily transferred to a primary CPU located within the main body or fuselage of the precision guided munition. The on-wing processing reduces or eliminates the need for optical fibers extending between an optical wedge and an optical detector to reduce the likelihood of optical fibers from impeding in the mechanical deployment of the wing and reduces losses. The reduction or elimination of optical fibers between the optical wedge and the optical detector further enables the optical detection assembly to have a higher pixel ratio or transmitting raw data between the wedge and the detector by sending sampled detection data across a low bandwidth link to a CPU in the main body.

A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

Described herein is a deterrence system for deterring animals from a vicinity of an environment monitoring apparatus, the system includes: a detector system having at least one sensor configured to generate a presence signal indicative of the presence of an object within a predefined vicinity of the environment monitoring apparatus; a deterrence processing system; and a repulsion system, wherein the deterrence processing system is configured to: monitor the presence signal; determine, from the presence signal, the presence of an object within the predefined vicinity of the environment monitoring apparatus; and communicate a command for the repulsion system to perform a sequence of one or more repulsion events actions in response to determining that an object is present, and wherein the repulsion system is configured to: perform one or more repulsion events responsive to receipt of the command from the deterrence processing system.

A vehicular camera includes a lens assembly and a circuit board having a first side and a second side opposite the first side. The circuit board has a first coefficient of thermal expansion (CTE). An imager is disposed at the first side of the circuit board and optically aligned with the lens assembly. A bend-countering element is disposed at the second side of the circuit board. The bend-countering element has a second CTE that is greater than the first CTE of the circuit board. The bend-countering element counters temperature-induced bending of the circuit board. With the camera disposed at the vehicle, temperature-induced bending of the bend-countering element is in an opposite direction from temperature-induced bending of the circuit board.