An electrical receptacle assemblies and methods for assembling and mounting toolless receptacle assemblies to a housing of a luminaire. The receptacle assembly includes a rotatable receptacle that has an insert portion with an electrical face configured to mate with a photoelectric device and includes an outer ring portion that has a mounting face opposite the electrical face. The mounting face is configured to mount on the housing. A locating mechanism of the receptacle assembly is configured to orient the rotatable receptacle on the housing in a desired direction for optimal positioning of the photoelectric device. A locking base is configured to receive at least a portion of the insert portion. A releasable retention member if configured to couple to the locking base and the insert portion of the rotatable receptacle for securing the receptacle assembly to the housing.

One or more embodiments are directed to ambient light sensor packages, and methods of making ambient light sensor packages. One embodiment is directed to an ambient light sensor package that includes an ambient light sensor die having opposing first and second surfaces, a light sensor on the first surface of the ambient light sensor die, one or more conductive bumps on the second surface of the ambient light sensor die, and a light shielding layer on at least the first surface and the second surface of the ambient light sensor die. The light shielding layer defines an opening over the light sensor. The ambient light sensor package may further include a transparent cover between the first surface of the ambient light sensor die and the light shielding layer, and an adhesive that secures the transparent cover to the ambient light sensor die.

An apparatus includes a substrate, a light emitter mounted on the substrate, and a light receiver, including a light sensitive region, mounted on the substrate. The substrate includes one or more light blocking vias arranged to prevent at least some light produced by the light emitter from traveling through the substrate and thereby generating optical cross-talk in the light receiver.

One embodiment provides a pyranometer, including: a pyranometer housing; and at least one radiation sensor; wherein the at least one radiation sensor is electrically isolated from the pyranometer housing and thermally coupled to the pyranometer housing by at least one supporting element, wherein the supporting element is connected to the pyranometer housing and is configured to support the at least one radiation sensor. Other aspects are described and claimed.

One embodiment provides a pyranometer, including: a dome; a thermopile-based sensor comprising a receiving surface; a diffusor configured to diffuse radiation external to the pyranometer and passing through the dome, toward the receiving surface of thermopile-based sensor; and at least one optical filter arranged in an optical path of the radiation in front of the receiving surface of the thermopile-based sensor so as to modify the spectral composition of the radiation measured by the thermopile-based sensor. Other aspects are described and claimed.

One embodiment provides a pyranometer, including: a dome enclosing a cavity; at least one light emitting source arranged such that light exterior to the dome does not directly impinge on the at least one light emitting source; a diffusor; wherein the at least one light emitting source is configured to emit light substantially directed to a portion of the diffusor, and wherein the diffusor is configured to diffuse the light emitted from the at least one light emitting source on an inner surface of the dome; and one or more first light detecting sensors arranged in the cavity and configured to measure an intensity of the light reflected from the dome and impinging on the one or more first light detecting sensors. Other aspects are described and claimed.

An ultraviolet light radiation sensing device to be wearable by a human being is provided, the device including a front part and a rear part, an ultraviolet light radiation sensor with associated microprocessor on a printed circuit board, a battery, and a wireless communication unit, e.g. for Bluetooth communication. If the front and rear part are made from a metal or metal alloy, and are interconnected by a middle member made from electrically insulating polymer material, the front and rear parts constitute antenna elements of the wireless communication unit. The device is intended to enable interaction with application data of a smartphone, a method being provided to establish recommended UV-dose and related exposure time by the sun onto the skin of the human being.

An electronic device according to various embodiments of the present disclosure may comprise: a housing including a front plate facing forward and a rear plate facing rearward; a display assembly comprising a display visible through at least a portion of the front plate and which includes an upper portion, a lower portion overlapping at least a partial region of the upper assembly and that includes a first opening, and a flexible circuit board overlapping at least a partial region of the lower portion and that includes a second opening corresponding to at least a portion of the first opening; a photosensor module including a sensing unit comprising a sensor corresponding to at least a portion of the second opening, and a plurality of pads arranged to be adjacent to the sensing unit and electrically coupled to the flexible circuit board; and an electrical component and/or mechanical structure arranged between the photosensor module and the rear plate and spaced from the photosensor module at a first distance.

A device for sensing infrared radiation is provided. The device for sensing infrared radiation includes a shell, a bottom cover, a Fresnel lens, an upper wire outlet hole, a lower wire outlet hole, a side wire outlet hole and an infrared probe. The infrared probe is arranged inside the shell, the shell is provided with an arc-shaped notch configured for arranging the Fresnel lens. The upper wire outlet hole is arranged on the shell and configured for leading wires, the lower wire outlet hole is provided on the bottom cover of the shell and configured for leading wires, and the side wire outlet hole is provided on the shell and configured for leading wires.

Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC comprises a first phase detection autofocus (PDAF) photodetector and a second PDAF photodetector in a substrate. A first electromagnetic radiation (EMR) diffuser is disposed along a back-side of the substrate and within a perimeter of the first PDAF photodetector. The first EMR diffuser is spaced a first distance from a first side of the first PDAF photodetector and a second distance less than the first distance from a second side of the first PDAF photodetector. A second EMR diffuser is disposed along the back-side of the substrate and within a perimeter of the second PDAF photodetector. The second EMR diffuser is spaced a third distance from a first side of the second PDAF photodetector and a fourth distance less than the third distance from a second side of the second PDAF photodetector.