Described are an apparatus and a method for manufacturing a three-dimensional body comprising mutually oriented devices. In accordance with the invention, a substrate having a first and a second substrate region is provided. A first device is provided in the first substrate region. A second device is provided in the first or in the second substrate region. The substrate is bent along at least one bending edge in order to obtain a three-dimensional body. In accordance with the invention, the first device and the second device are oriented to each other by the bending in order to provide a communications path between the same.

An optical filter including a base member having a layer containing near-infrared absorbing fine particles and a dielectric multilayer film, the optical filter satisfying a requirement that, in a wavelength range of 400 nm to 650 nm, an average of transmittance of any of light incident from a direction perpendicular to the optical filter, light obliquely incident at an angle of 30 degrees, and light obliquely incident at an angle of 60 degrees is 45% or higher and lower than 85%; and a requirement that, in a wavelength range of 800 nm to 1,200 nm, an average of optical density (OD value) of any of light incident from the direction perpendicular to the optical filter, light obliquely incident at an angle of 30 degrees with respect to the perpendicular direction, and light obliquely incident at an angle of 60 degrees with respect to the perpendicular direction is 1.7 or higher.

A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.

An electronic device may be provided with input-output devices and other components such as optical components that emit light and optical components that detect light. An optical component covering structure may be interposed between an interior region of the electronic device and an exterior region that surrounds the electronic device. The optical components may be formed in the interior region of the electronic device. The optical component covering structure may overlap the optical components. The optical component covering structure may be configured to exhibit a flat visible light transmission spectrum. This neutral light transmission characteristic allows the overlapped optical components to emit and/or receive light through the optical component covering structure without imposing an undesired color cast. The optical component covering structure may include first and second layers with complementary light transmission characteristics. When viewed from the exterior region, the optical component covering structure may exhibit a non-neutral color.

Various implementations relate generally to a multi-sensor device. Some implementations more particularly relate to a multi-sensor device including a ring of radially-oriented photosensors. Some implementations more particularly relate to a multi-sensor device that is orientation-independent with respect to a central axis of the ring. Some implementations of the multi-sensor devices described herein also include one or more additional sensors. For example, some implementations include an axially-directed photosensor. Some implementations also can include one or more temperature sensors configured to sense an exterior temperature, for example, an ambient temperature of an outdoors environment around the multi-sensor. Additionally or alternatively, some implementations can include a temperature sensor configured to sense an interior temperature within the multi-sensor device. Particular implementations provide, characterize, or enable a compact form factor. Particular implementations provide, characterize, or enable a multi-sensor device requiring little or no wiring, and in some such instances, little or no invasion, perforation or reconstruction of a building or other structure on which the multi-sensor device is mounted.

To enable a simple mounting and alignment of an optoelectronic measuring device in its operating position, a fastening system is provided for fastening the optoelectronic measuring device. The fastening system includes a fastening section provided at a surface of a housing of the measuring device. An adjustment adapter has a first element for connection to the fastening section and is provided for the alignment of the measuring device in the operating position. The fastening section rises from the surface of the housing and forms a platform having a groove and a latch cutout at at least one side located perpendicular to the surface of the housing. The first element of the adjustment adapter has a tongue element formed with shape matching the groove and a latching protrusion formed with shape matching the latch cutout. The fastening section and the adjustment adapter are latchinigly connectable to one another without tools.

The present invention maintains sealing of the housing over a long period of time. A multiple-optical-axis photoelectric sensor (100) includes a light projector (110) and a light receiver (120) whose external forms are each formed by a housing (1) including an outer case (10) constituted by a main body case (11) and a first cap member (12), a light-transmitting plate (15), a first pressing member (20A), second pressing members (20B), a first adhesive tape (17A), and second adhesive tapes (17B). The first cap member (12) has a supporting part (12a) provided on its inner side, and an elastic member (18) is provided between the second pressing member (20B) and a portion of the light-transmitting plate (15) supported by the supporting part (12a). The light-transmitting plate (15) is pressed toward the first cap member (12) via the elastic member (18).

A rotating shadowband for shading a pyranometer includes a cylindrical ring and a semicircular shadowband held within the cylindrical ring, a motor configured for rotating the shadowband, at least one solar panel, a rechargeable battery, and a controller having circuitry configured to power the first motor to rotate the semicircular shadowband. The semicircular shadowband may include a window opening, wherein the window opening substantially extends from a center of the band to a first end. The controller rotates the shadowband 0 to 360 degrees about the central axis of the cylindrical ring to alternately shade the pyranometer for making diffuse radiation measurements and expose the pyranometer to direct solar radiation for making global radiation measurements. Alternatively, the shadowband may be solid and rotate pivotally 0 to 180 degrees or 0 to 360 degrees within the cylindrical ring to alternately shade and expose a pyranometer head to and from direct sunlight respectively.

The present disclosure disclosures a sensor and a control method of the sensor. The sensor may include a protective housing, an optical component, a control component, an interface component, and a circuit board mounted within the protective housing. The circuit board may include a plurality of detection components, including a photosensitive detection component and a tilt angle detection component. The control method of the sensor may include determining whether the photovoltaic module operates in an angle detection range of the photosensitive detection component, and determining whether an actuation condition of the photosensitive detection component is satisfied. In response to a determination that the actuation condition of the photosensitive detection component is satisfied, the photosensitive detection component may be actuated. In response to a determination that the actuation condition of the photosensitive detection component is not satisfied, the tilt angle detection component may be actuated.

Various implementations relate generally to a multi-sensor device. Some implementations more particularly relate to a multi-sensor device including a ring of radially-oriented photosensors. Some implementations more particularly relate to a multi-sensor device that is orientation-independent with respect to a central axis of the ring. Some implementations of the multi-sensor devices described herein also include one or more additional sensors. For example, some implementations include an axially-directed photosensor. Some implementations also can include one or more temperature sensors configured to sense an exterior temperature, for example, an ambient temperature of an outdoors environment around the multi-sensor. Additionally or alternatively, some implementations can include a temperature sensor configured to sense an interior temperature within the multi-sensor device. Particular implementations provide, characterize, or enable a compact form factor. Particular implementations provide, characterize, or enable a multi-sensor device requiring little or no wiring, and in some such instances, little or no invasion, perforation or reconstruction of a building or other structure on which the multi-sensor device is mounted.