Patent classifications
G01J1/0271
Optical sensor and image forming apparatus
An optical sensor includes a first light emitting diode (LED), a second LED, a first photodiode (PD), and a second PD. The first LED and the second LED are configured to irradiate an optical-axis center point of an intermediate transfer belt. The first PD is arranged at a position at which specularly reflected light of light emitted from the first LED and diffused reflected light of light emitted from the second LED are received. The second PD is arranged at a position at which diffused reflected light of the light emitted from the first LED is received.
FOLDABLE DISPLAY DEVICE
A foldable display device includes a display module in which a panel hole is defined, a sensor device disposed in the panel hole, and a panel lower cover which is disposed on a surface of the display module and in which a cover hole is defined such that the sensor device is disposed in the cover hole, the panel lower cover including a buffer member and a first adhesive member, which attaches the buffer member to the surface of the display module where a minimum distance between the first adhesive member and the sensor device is greater than a minimum distance between the buffer member and the sensor device.
LIGHT EXPOSURE MONITORING SYSTEM
The present disclosure relates to a light exposure monitoring system that includes a central control server; a plurality of indoor light exposure zones and a positioning system configured to communicate with the central control server to determine: a position (P) of an individual within the plurality of indoor light exposure zones, and a distance between a head of the individual and a floor within the plurality of indoor light exposure zones
Image sensor packages with tunable polarization layers
Imaging systems may include tunable polarization filters. A tunable polarization filter may be integrated directly into an image sensor package. For example, the tunable polarization filter may serve as cover glass for the image sensor package. Tunable polarization package glass may be incorporated into image sensor packages that have air gaps between the image sensor and the cover glass or that have transparent adhesive between the image sensor and the cover glass. The tunable polarization layer may be controlled at a global level, at a sub-array level, or at a pixel level. In some cases, the tunable polarization layer may be a tunable polarization filter. In this example, the direction of the polarization filter is tuned. In other cases, the tunable polarization layer may be a tunable polarization rotator. In this example, the tunable polarization layer selectively rotates the polarization of light that passes through the tunable polarization layer.
OPTICAL TEST INSTRUMENT WITH REMOVABLE CARTRIDGE
An optical test instrument, in combination with a removable connector cartridge is provided. A method of replacing a damaged or worn optic fiber interface is also provided. The optical test instrument has casing having a cartridge receiving cavity therein with an inner end provided with a test instrument optical port; and an outer end provided with a cartridge receiving opening. The connector cartridge is sized and configured to be inserted in the cartridge receiving cavity. The connector cartridge has a cartridge inner end for facing the test instrument optical port when in use, and a cartridge outer end for receiving an optic fiber from a device under test (DUT). The connector cartridge houses a fiber optic cable extending between the cartridge inner end and the cartridge outer end. The connector cartridge is removably connectable to the instrument casing to allow replacement of the connector cartridge when the cartridge outer end is worn or damaged.
OPTICAL INSPECTION SYSTEM
An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.
IMAGE SENSOR WITH IMPROVED NEAR-INFRARED (NIR) RADIATION PHASE-DETECTION AUTOFOCUS (PDAF) PERFORMANCE
Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC comprises a first phase detection autofocus (PDAF) photodetector and a second PDAF photodetector in a substrate. A first electromagnetic radiation (EMR) diffuser is disposed along a back-side of the substrate and within a perimeter of the first PDAF photodetector. The first EMR diffuser is spaced a first distance from a first side of the first PDAF photodetector and a second distance less than the first distance from a second side of the first PDAF photodetector. A second EMR diffuser is disposed along the back-side of the substrate and within a perimeter of the second PDAF photodetector. The second EMR diffuser is spaced a third distance from a first side of the second PDAF photodetector and a fourth distance less than the third distance from a second side of the second PDAF photodetector.
Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same
Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.
Housings and detector arrays
There is disclosed a housing including a plurality of compartments for housing a plurality of LEDs or photo detectors. Each compartment has a number of control pads projecting inwardly and a number of protrusions. The control pads are configured to provide a contact surface for the LEDs or photo detectors to control the alignment and position of each of the plurality of LEDs or photodiodes within each of the plurality of compartments. Each of the protrusions urges each of the plurality of LEDs or photodiodes against the respective control pads to control the alignment of the LEDs or photodiodes in the housing. A detector array including a casing, an LED housing and a photodiode housing is also disclosed.
Light detection system and method of using same
Various embodiments of a light detection device and a method of using such device are disclosed. In one or more embodiments, the light detection device can include a housing including a top surface and a bottom surface, where the housing extends along a housing axis between the top surface and the bottom surface; and a support member connected to the housing and adapted to be selectively moved from a closed position to an open position. The support member is further adapted to maintain the light detection device in an upright position when the bottom surface and the support member are in contact with a working surface and the support member is in the open position.