Methods, systems, and apparatus for a stray-light testing apparatus. In one aspect, the apparatus includes an optical assembly including a spatially extended light source and one or more optical elements arranged to direct light from the spatially extended light source along an optical path, a moveable frame supporting the optical assembly including one or more adjustable alignment features for guiding positioning of the stray-light testing apparatus relative to an onboard camera on a vehicle, and a shrouding mechanism attached to the frame and positioned on the frame such that, when the stray-light testing apparatus is aligned relative to the onboard camera on the vehicle and the optical path of the optical assembly is within the field of view of the onboard camera, ambient light exposure for the onboard camera is below a threshold.

An ambient-light intensity detector includes a light-uniforming component, a light-converging component and a photosensitive element, wherein the light-converging component defines a light-converging path. The light-uniforming component and the photosensitive surface of the photosensitive element are retained in the light-converging path. The light-uniforming component is configured to uniformly and evenly mix the reflection light to form a pending detection light while the reflection light passing through the light-uniforming component. The light-converging component is configured to converge the detection light to the light-converging path and the converged detection light is received by the photosensitive element at the photosensitive surface thereof, such that the intensity of the ambient light is obtained by detecting the detection light by the photosensitive element.

A display device is disclosed. The display device comprises: a logo member formed on one side of a display and comprising a logo area on one side thereof; and a sensor disposed inside the logo member, wherein the sensor senses light incident on one surface of the logo member.

Various implementations relate generally to a multi-sensor device. Some implementations more particularly relate to a multi-sensor device including a ring of radially-oriented photosensors. Some implementations more particularly relate to a multi-sensor device that is orientation-independent with respect to a central axis of the ring. Some implementations of the multi-sensor devices described herein also include one or more additional sensors. For example, some implementations include an axially-directed photosensor. Some implementations also can include one or more temperature sensors configured to sense an exterior temperature, for example, an ambient temperature of an outdoors environment around the multi-sensor. Additionally or alternatively, some implementations can include a temperature sensor configured to sense an interior temperature within the multi-sensor device. Particular implementations provide, characterize, or enable a compact form factor. Particular implementations provide, characterize, or enable a multi-sensor device requiring little or no wiring, and in some such instances, little or no invasion, perforation or reconstruction of a building or other structure on which the multi-sensor device is mounted.

A plant detection system includes a radiation module and a photodetector system. The photodetector system includes a photodetector housing, one or more photodetectors, a detector lens, and an aperture plate. The aperture plate is disposed within the photodetector housing between the detector lens and the one or more photodetectors and has an aperture extending therethrough. The detector lens and the aperture plate are configured so that stray radiation received by the detector lens is directed through the aperture in the aperture plate or onto a surface of the aperture plate without being directed onto sidewalls of the photodetector housing.

A dual sensor module includes a substrate, a light source, a first encapsulant, a second encapsulant, a photodetector, and an electrode. The light source is disposed on the substrate. The first encapsulant is formed over the light source. The photodetector is disposed on the substrate. The second encapsulant is formed over the photodetector. The electrode is electrically connected to the substrate and is entirely located between the light source and the photodetector. A dual sensing accessory and a dual sensing device having the dual sensor module for detecting optical and electrical properties are also provided.

The disclosure provides a photoelectric sensor that reliably guides light by a light guide member and is easy to be assembled. A light projecting side light guide part of a light guide member extends in the front-and-rear direction. A light receiving side light guide part extends with at least a part thereof inclined with respect to the front-and-rear direction. A light shielding member includes a fitting part, into which the light projecting side light guide part fits in the front-and-rear direction, and a contact part that is in contact with a base board in the front-and-rear direction.

The present invention maintains sealing of the housing over a long period of time. A multiple-optical-axis photoelectric sensor (100) includes a light projector (110) and a light receiver (120) whose external forms are each formed by a housing (1) including an outer case (10) constituted by a main body case (11) and a first cap member (12), a light-transmitting plate (15), a first pressing member (20A), second pressing members (20B), a first adhesive tape (17A), and second adhesive tapes (17B). The first cap member (12) has a supporting part (12a) provided on its inner side, and an elastic member (18) is provided between the second pressing member (20B) and a portion of the light-transmitting plate (15) supported by the supporting part (12a). The light-transmitting plate (15) is pressed toward the first cap member (12) via the elastic member (18).

A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.

The invention provides an illumination measuring module which includes a housing and a photo detector. The housing is molded with a plurality of surfaces. Each surface of the housing is affixed with respective side edges of the plurality of the surfaces to form a predetermined shape. Each surface includes an external surface and an inner surface. One surface of the plurality of surfaces is a glass surface. The glass surface transmits illumination collected from an external ambience of the housing to one or more inner surfaces corresponding to the plurality of surfaces. On an inner surface of the glass surface, a plane white sheet is positioned which homogenously scatters illumination collected from the external ambience into the one or more inner surfaces in the housing. The photo detector measures scattered illumination diffused from the one or more inner surfaces corresponding to the plurality of surfaces.