A daylight sensor for automated window-shading applications that incorporates at least one (and optionally more than one) of three aspects: an optimized Field-of-View (FOV), angle-diversity sensing (via at least two sub-sensors with different FOVs, whose outputs are processed in a particular way to yield the overall sensor output), and multi-spectral sensing (via at least two sub-sensors with differing spectral responses and, optionally, different FOVs, whose outputs are processed in a particular way to yield the sensor output). These aspects improve the correlation between the sensor output and the subjectively-perceived daylight level (especially under glare-inducing conditions, such as in the presence of low-angle direct sunlight), thereby enabling more effective automatic control of daylight admitted into a room.

A semiconductor light reception module is provided with a stem, a cap covering the stem, a holder superimposed on the cap, and a receptacle inserted into the holder. The holder has a main body section covering the lens in the cap. An opening passing from the opposite side of the cap through the main body section and reaching the lens is provided in the main body section of the holder. A fixing screw is inserted into a screw hole provided in the holder and a screw tip of a screw main body section of the fixing screw abuts against a side surface of the receptacle.

A photosensor of the present invention includes a circuit portion (34), a collective cable support portion (42), a pressure-welding portion (36a36d) and a cable end support portion (46a46d). The circuit portion (34) is configured to control the light projecting element and the light receiving element. The collective cable support portion (42) is configured to support a collective cable (10) including a plurality of cables (12a12d). The pressure-welding portion (36a36d) is configured to perform conduction with the circuit portion (34) by pressure-welding and fixing each of the plurality of cables (12a12d). The cable end support portion (46a46d) is configured to support an end of each of the plurality of cables (12a12d). In each of the plurality of cables (12a12d), a length from the pressure-welding portion (36a36d) to the cable end support portion (46a46d) is longer than that from the collective cable support portion (42) to the pressure-welding portion (36a36d).

An ultraviolet measurement system includes a measurement device that is configured to be portable by a user, and measures ultraviolet information regarding an ultraviolet ray, and a display device that can perform communication with the measurement device, in which one of the measurement device and the display device includes a position acquisition unit that acquires position information indicating a position of either of the user and the measurement device, and a storage unit that stores the ultraviolet information measured by the measurement device in correlation with measurement position information which is position information of when the ultraviolet information is measured by the measurement device among pieces of position information acquired by the position acquisition unit, and in which the display device displays information based on the ultraviolet information and the measurement position information.

There is disclosed a housing including a plurality of compartments for housing a plurality of LEDs or photo detectors. Each compartment has a number of control pads projecting inwardly and a number of protrusions. The control pads are configured to provide a contact surface for the LEDs or photo detectors to control the alignment and position of each of the plurality of LEDs or photodiodes within each of the plurality of compartments. Each of the protrusions urges each of the plurality of LEDs or photodiodes against the respective control pads to control the alignment of the LEDs or photodiodes in the housing. A detector array including a casing, an LED housing and a photodiode housing is also disclosed.

Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first pixel region and a second pixel region within a substrate. A first recess region is disposed along a back-side of the substrate within the first pixel region. The back-side of the substrate within the first pixel region is asymmetric about a center of the first pixel region in a cross-sectional view. A second recess region is disposed along the back-side of the substrate and within the second pixel region. The back-side of the substrate within the second pixel region is asymmetric about a center of the second pixel region in the cross-sectional view. The first recess region and the second recess region are substantially symmetric about a vertical line laterally between the first pixel region and the second pixel region.

The present application discloses an apparatus and method configured to measure characteristics of high power beams of laser energy used in material processing. In one embodiment, the apparatus includes a housing having a first compartment and a second compartment separated from each other to reduce the transfer of thermal energy between them. Optical modules having optical sensors configured to measure characteristics of the high power beam are mounted in the first compartment. A removable and replaceable beam dump configured to absorb most of the high power beam is positioned in the second compartment. The removability/replaceability of the beam dump enables operation of the apparatus without active cooling of the beam dump assembly, simplifying the apparatus and protecting the optical sensors in the first compartment.

An optical module is disclosed. The optical module includes a carrier, an optical emitter disposed over the carrier, and a monitor disposed over the carrier and configured to adjust a property of a first light emitted from the optical emitter.

A sensor device has a metal sensor housing with a housing base coupled to a frame base of a metal optical frame. A device mounting plate is orthogonal to the frame base. A securing device secures an optical communication device to the device mounting plate. A barrel mounting channel has first and second sidewalls, each extending obliquely to the frame base and defining a linear translation pathway along the frame base for a metal lens barrel. A fastener secures the metal lens barrel to the first and second sidewalls. A glass lens is in contact with three protrusions extending outward from an inner annular surface of the lens barrel. The optical communication device is configured to be in optical communication with the lens and is secured in a particular position in a translation plane mutually defined by the device mounting plate and the optical communication device.

Described are an apparatus and a method for manufacturing a three-dimensional body comprising mutually oriented devices. In accordance with the invention, a substrate having a first and a second substrate region is provided. A first device is provided in the first substrate region. A second device is provided in the first or in the second substrate region. The substrate is bent along at least one bending edge in order to obtain a three-dimensional body. In accordance with the invention, the first device and the second device are oriented to each other by the bending in order to provide a communications path between the same.