A system is provided for determining personal ultra-violet (UV) radiation measurements. The system may include a measurement device configured to measure UV irradiation; and a terminal device configured to receive an output of the measured UV irradiation from the measurement device and to display a specific user's personal UV exposure risk level based on at least the measured sun irradiation.

In one aspect, luminaires are described herein having sensor modules integrated therein. In one aspect, a luminaire described herein comprises a light emitting face including a LED assembly. A sensor module is integrated into the luminaire at a position at least partially overlapping the light emitting face. In another aspect, a luminaire described herein comprises a LED assembly and a driver assembly. A sensor module is integrated into the luminaire along or more convective air current pathways cooling the LED assembly or driver assembly.

A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

A sensor support for use with a lighting refractor includes a housing defining an interior cavity configured to receive and support a sensor for sensing at least one of motion or light. The sensor support further includes a locking structure operatively associated with the housing and configured to selectively attach the housing to a peripheral portion of a lighting refractor, and an aperture in the housing and arranged to expose the sensor to an environment around the lighting refractor. Sensor and lighting unit assemblies are also disclosed. A sensor assembly includes the sensor support and a sensor configured to sense at least one of motion or light. A lighting unit assembly includes the sensor support and a lighting unit having a refractor with a peripheral portion.

An earphone includes an audio transmitter, a housing, a sound passage pipe, a radiator, and a light receiver. The audio transmitter transmits sound. The housing has an internal space for containing the audio transmitter. The sound passage pipe guides sound produced at the audio transmitter into an external auditory canal. The radiator radiates light into the external auditory canal. The light receiver is disposed in the internal space of the housing. The light receiver converts the light into a signal, the light having been reflected off the external auditory canal and passed through an internal space of the sound passage pipe. The housing, the sound passage pipe, and the radiator are disposed in this order.

A mail screening apparatus is provided to perform the inspection of mail or similar objects. Terahertz inspection is used to localize potential suspicious areas by imaging the contents inside the envelope or small parcel. The mail screening apparatus includes a primary and a secondary inspection zone, preferably allowing inspection of the mail in a normal and a zoomed mode, respectively. The same light source, image capture device and intervening optical components are used in both normal and zoomed modes. Metal detection may optionally be used to enhance awareness in the presence of metallic content. In one implementation, metal detection zones are provided in an orthogonal configuration with respect to the primary inspection zone used for terahertz imaging to accommodate for both manual and automatic inspection of mail.

An electronic device is provided, which includes an enclosure, an output component, a display screen and an optical sensor. The output component and the display screen are mounted on the enclosure. The output component includes a packaging shell, an infrared supplementary lighting lamp and a proximity infrared lamp; the packaging shell includes a packaging substrate; the infrared supplementary lighting lamp and the proximity infrared lamp are packaged in the packaging shell and born on the packaging substrate. The display screen is provided with a non-opaque entity region and includes a front surface capable of displaying a picture and a back surface back on to the front surface. The optical sensor is arranged on a side, where the back surface is positioned, of the display screen and corresponds to the non-opaque entity region.

A system is provided for testing a flash emitter is disclosed. The system may include a mounting panel comprising a plurality of mount points at a center point and at positions that correspond to vertices of at least two different field-of-view configurations. The system may include a device holder separated from the mounting panel by a predetermined distance of a platform. The system may include an adjustment rack coupled to the device holder and the platform, the adjustment rack configured to change a position of the device holder relative to the center point of the mounting panel such that the flash emitter of a device in the device holder is aligned the center point of the mounting panel.

One or more embodiments are directed to ambient light sensor packages, and methods of making ambient light sensor packages. One embodiment is directed to an ambient light sensor package that includes an ambient light sensor die having opposing first and second surfaces, a light sensor on the first surface of the ambient light sensor die, one or more conductive bumps on the second surface of the ambient light sensor die, and a light shielding layer on at least the first surface and the second surface of the ambient light sensor die. The light shielding layer defines an opening over the light sensor. The ambient light sensor package may further include a transparent cover between the first surface of the ambient light sensor die and the light shielding layer, and an adhesive that secures the transparent cover to the ambient light sensor die.

A package structure and a method for manufacturing the same are disclosed. The package structure includes a first plastic body which covers a first light sensor and a light emitter, and a second plastic body which is made of infrared cutoff materials and fills inner pins of a lead frame or is formed below the lead frame. A trench is formed in the first plastic body so that a light-blocking layer is located on a side surface of the first plastic body. The second plastic body and the light-blocking layer are used to avoid influence of infrared light on a first light sensor.