Patent classifications
G01J1/0271
Terahertz device module
The THz device module includes: a substrate; a THz device disposed on a front side surface of the substrate, and configured to oscillate or detect THz waves; a cap covering the THz device being separated from the THz device, and comprising an opening formed at a position opposite to the THz device in a vertical direction of the front side surface of the substrate; and a sealing member covering the opening of the cap so as to seal the THz device in conjunction with the substrate and the cap. A distance from the THz device to the sealing member is within a near-field pattern to which an electric field of the THz waves can be reached without interruption from a surface of the THz device to the sealing member. The THz device module efficiently emits or detects THz waves from the opening, thereby suppressing upsizing of the cap.
Systems and methods of tracking rotor blades
A blade tracking system including a detector having one or more sensors to detect radiation from at least one field of view of the detector, the one or more sensors generating signals based on changes in incident radiation to the one or more sensors as a rotor blade passes the field of view, and a processor to determine a pass time for the rotor blade to pass through the at least one field of view based on the generated signals.
CUSTOMIZABLE SENSOR APERTURE WITH COMMON LENS
A sensor cover for a rearview assembly includes a body configured for secure engagement with the rearview assembly. At least one engagement feature extends rearward and is configured for removably coupling the body with a first housing having a first predefined configuration and a second housing having a second predefined configuration.
METHOD FOR MEASURING LIGHT FOR LED REPLACEMENT
Methods for replacing conventional light fixtures with solid state light fixtures are disclosed that can comprise selecting a replacement area comprising a plurality of conventional lamps. A sample of the plurality of conventional lamps in the replacement area is selected. The emission characteristics for each of the sample plurality of conventional lamps is measured. The conventional lamp emission characteristics are matched to emission characteristics of replacement LED lamps. All of the conventional lamps within said light replacement area are replaced with the replacement LED lamps. The emission characteristics of the LED replacement lamps at each of said locations of the sample plurality of conventional lamps are measured. The sample conventional lamp emission characteristics are compared to the LED replacement lamp characteristics to confirm that they are the same or are within an acceptable deviation.
Eyewear with radiation detection system
Eyewear having radiation monitoring capability is disclosed. Radiation, such as ultraviolet (UV) radiation, infrared (IR) radiation or light, can be measured by a detector. The measured radiation can then be used in providing radiation-related information to a user of the eyewear. Advantageously, the user of the eyewear is able to easily monitor their exposure to radiation.
Systems and methods for monitoring physiological parameters
Described herein are systems and methods for mounting optical sensors in physiological monitoring devices worn by a user to sense, measure, and/or display physiological information. Optical sensors may be mounted in the rear face of the device, emit light proximate a targeted area of a user's body, and detect light reflected from the targeted area. The optical sensor may be mounted in a housing or caseback such that at least a portion of the optical sensor protrudes a distance from at least a portion of the housing. The protrusion distance may be adjustable such that a user may achieve a customized fit of the wearable device. Adjustment of the protrusion distance may also result in a customized level of contact and/or pressure between the optical sensor and the targeted area which may, in turn, result in more reliable and accurate sensing of physiological information.
Electronic device with high electrostatic protection
An electronic device including a substrate and an optoelectronic device package is provided. The optoelectronic device package includes a light source, an image sensor and a plurality of connecting pins. The light source is configured to emit light toward a direction of a bottom surface of the optoelectronic device package. The image sensor is configured to receive reflected light from the direction of the bottom surface. The connecting pins are bended toward an opposite direction of the direction of the bottom surface and electrically connected to the substrate thereby increasing a discharge path of the electrostatic discharge.
VEHICLE SENSOR ASSEMBLY FOR DETECTING SOLAR RADIATION AND AIR CONDITIONING SYSTEM HAVING THE SAME
A vehicle detector assembly for detecting solar radiation may include a housing, a fixed plate fixed to an upper surface of the housing in a flat form, a plurality of photo detectors bonded to a surface of the fixed plate, each being connected to a lead having a uniform one-directional inclination structure, and a detector cap fastened to the housing and transmitting sunlight.
Pyranometer
A pyranometer, comprises a thermal sensor, and a diffusing member positioned so as to be opposed to a receiving surface of the thermal sensor.
OPTO-ELECTRONIC MODULES AND METHODS OF MANUFACTURING THE SAME AND APPLIANCES AND DEVICES COMPRISING THE SAME
Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.