A structure of a mobile terminal for visible light communication is disclosed. The mobile terminal, according to one embodiment of the present invention, comprises: a light reception unit for receiving visible light; and a control unit for extracting, from the received visible light, data corresponding to the turning on/off of an external lighting, wherein the light reception unit comprises at least one among an illuminance sensor, a first image sensor disposed on the front of the mobile terminal, and a second image sensor disposed on the back of the mobile terminal, and comprises a guide member for guiding the traveling direction of visible light outputted from the lighting.

A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.

System and methods for accurate measurement and real-time feedback of solar ultraviolet exposure for management of ultraviolet dose. The systems can include a wearable device and a mobile device, the system performing accurate measurement of UV exposure.

An optical sensor arrangement comprises an emitting device (E) and a detection device (D) configured to emit and detect, respectively, electromagnetic radiation and a cover (C) arranged to cover the emitting and the detection device (E, D). The sensor arrangement comprises a first cover layer (C1) partially covering an inner surface of the cover (C) and having a first and a second opening located above the emitting and the detection device (E, D), respectively. The sensor arrangement comprises a second and a third cover layer (C2, C3) covering the inner surface at areas of the first and the second opening. A reflection and/or an absorption characteristics of at least one of the second and third cover layer (C2, C3) is adapted to a reflection and/or an absorption characteristics of the first cover layer (C1) for incident light within the specified spectrum.

An illumination system includes a light source device configured by an excitation light source, a light guiding member and a wavelength converter that are connected in order, and an operation check device. The system further includes: a connector configured to directly and physically connect the operation check device to a light signal emitting end which includes the wavelength converter; a detector configured to detect a light signal emitted from the light signal emitting end when the light signal emitting end and the operation check device are connected by the connector; and an operation determiner configured to determine the operations of the excitation light source, the light guiding member, and the wavelength converter by a detection result in the detector.

A system for transporting high luminous intensity light from at least one luminaire to a destination area is disclosed. The system may include a light guide that carries light from the luminaire to a plurality of sensors located on a Printed Circuit Board (PCB). The PCB may be attachable anywhere the luminaire is located. While collecting light rays originating from the luminaire and delivering them to the light sensors, the light guide may perform a plurality of operations to modify the characteristics of the collected light rays. The plurality of operations performed by the light guide on the light rays may support the accuracy and longevity of the light sensors on the PCB. Further, the light guide allows the sensor subsystem to be proximal to or distant from the luminaire.

A photosensor of the present invention includes a circuit portion (34), a collective cable support portion (42), a pressure-welding portion (36a36d) and a cable end support portion (46a46d). The circuit portion (34) is configured to control the light projecting element and the light receiving element. The collective cable support portion (42) is configured to support a collective cable (10) including a plurality of cables (12a12d). The pressure-welding portion (36a36d) is configured to perform conduction with the circuit portion (34) by pressure-welding and fixing each of the plurality of cables (12a12d). The cable end support portion (46a46d) is configured to support an end of each of the plurality of cables (12a12d). In each of the plurality of cables (12a12d), a length from the pressure-welding portion (36a36d) to the cable end support portion (46a46d) is longer than that from the collective cable support portion (42) to the pressure-welding portion (36a36d).

The present disclosure relates to a proximity illuminance sensor and a mobile terminal using the same, and disclosed is the mobile terminal of which an upper bezel can be shortened by using: the proximity illuminance (IR) sensor disposed on the rear surface of a front case and disposed to be perpendicular to a display unit; and a light reflector disposed at one side of the proximity illuminance sensor, such that light is incident to the proximity illuminance sensor or emitted from the proximity illuminance sensor to the outside.

A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.

A rotatable receptacle and method of assembling and mounting a rotatable receptacle. The receptacle includes an outer ring that has a mounting surface for mounting to a housing, and a rotatable insert that is received in the outer ring. An inner surface of the outer ring surrounds an outer surface of the rotatable insert. The rotatable insert has an electrical face configured to mate with a photoelectric device and an opposite mounting face for mounting to the housing. The rotatable insert is rotatable with respect to the outer ring to orient the rotatable insert in a desired direction for optimal positioning of the photoelectric device. The outer ring and the rotatable insert have corresponding interlocking features configured to fix the rotatable insert in the desired direction.