Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

A light sensor assembly includes a base configured to be fixedly mounted to a housing of a light fixture. The base holds contacts configured to be electrically connected to terminals of the light fixture. A photocell module is provided on the base and includes a photocell electrically connected to the contacts. A sensor lid is coupled to the base. The sensor lid has a lightpipe directing light from an exterior of the sensor lid to the photocell. The sensor lid is variably positionable at different angular positions relative to the base to change an orientation of the lightpipe relative to the photocell.

A sensor is disclosed that can include a light component in support of a first light source operable to direct a first beam of light, and a second light source operable to direct a second beam of light. The sensor can also include an imaging device positioned proximate the light component and operable to directly receive the first beam of light and the second beam of light, and convert these into electric signals. The imaging device and the light component can be movable relative to one another. The sensor can further include a light location module configured to receive the electric signals and determine locations of the first beam of light and the second. beam of light on the imaging device. In addition, the sensor can include a position. module configured to determine a relative position of the imaging device and the light component based on the locations of the first beam of light and the second beam of light on the imaging device.

The present disclosure relates to a proximity illuminance sensor and a mobile terminal using the same, and disclosed is the mobile terminal of which an upper bezel can be shortened by using: the proximity illuminance (IR) sensor disposed on the rear surface of a front case and disposed to be perpendicular to a display unit; and a light reflector disposed at one side of the proximity illuminance sensor, such that light is incident to the proximity illuminance sensor or emitted from the proximity illuminance sensor to the outside.

A non-contact method of measuring an insertion loss of a DUT connector is disclosed. The DUT connector has a first ferrule with a first optical fiber and a first end face. The method utilizes a reference connector having a second ferrule with a second optical fiber and a second end face. The method includes: axially aligning the first and second ferrules so that the first and second end faces are confronting and spaced apart to define a gap with an axial gap distance d; measuring values of the insertion loss between the first and second optical fibers for different gap distances d>0; and estimating a value for the insertion loss for a gap distance of d=0 based on the measured values of the insertion loss when d>0.

The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

There is disclosed a housing including a plurality of compartments for housing a plurality of LEDs or photo detectors. Each compartment has a number of control pads projecting inwardly and a number of protrusions. The control pads are configured to provide a contact surface for the LEDs or photo detectors to control the alignment and position of each of the plurality of LEDs or photodiodes within each of the plurality of compartments. Each of the protrusions urges each of the plurality of LEDs or photodiodes against the respective control pads to control the alignment of the LEDs or photodiodes in the housing. A detector array including a casing, an LED housing and a photodiode housing is also disclosed.

The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

Various implementations relate generally to multi-sensor devices. Some implementations more particularly relate to a multi-sensor device including a ring of radially-oriented photosensors. Some implementations more particularly relate to a multi-sensor device that is orientation-independent with respect to a central axis of the ring. Some implementations of the multi-sensor devices described herein further include one or more additional sensors. For example, some implementations include an axially-directed photosensor. Some implementations also can include one or more temperature sensors configured to sense an exterior temperature, for example, an ambient temperature of an outdoors environment around the multi-sensor. Additionally or alternatively, some implementations include one or more of an infrared sensor or infrared sensors, a cellular communication circuit, and a GPS module.

An optical detecting device capable of preventing environmental pollution includes a casing, an optical detecting component and a transparent component. The casing includes a light through unit and at least one accommodating structure. The optical detecting component is disposed inside the accommodating structure. The transparent component is disposed inside the accommodating structure and located above the optical detecting component, to partly fill the accommodating structure at least and block between the light through unit and the optical detecting component.