An electronic device may include an ambient light sensor. An angular-response controller may overlap the ambient light sensor and may have regions with adjustable transparency to control an angular response of the ambient light sensor. In particular, the angular-response controller may include two light modulator layers, such as liquid crystal layers. Each of the light modulator layers may have transparent portions and opaque portions. To allow on-axis light to pass through to the ambient light sensor while blocking off-axis light, the transparent portions of the two layers may be aligned, and the opaque portions of the two layers may be aligned. In contrast, to allow off-axis light while blocking on-axis light, the opaque portions of the two layers may be offset. The light modulator layers may be adjusted in response to measurements from the ambient light sensor or other sensors in the device, such as motion or orientation sensors.

An antenna for a smart sensor device includes a generally circular, substantially rigid substrate and a radiative antenna element integrated with the substrate. According to one embodiment, the antenna element is a primary cellular antenna arranged to pass signals at frequencies between 600 MHz and 3 GHz. According to another embodiment, a second radiative antenna element may be integrated with the substrate. In such a case, the second antenna element may be arranged to receive location-based signals from satellites or operate as a cellular diversity antenna arranged to receive cellular signals present in proximity to the antenna. The substrate may include at least one interruption (e.g., aperture or lens) arranged to permit light to reach an area inside the sensor device that would otherwise be shielded by the substrate. In such a case, the radiative antenna element(s) may be integrated with the substrate so as to avoid the interruption.

An apparatus is provided for measuring far-field luminous intensity and color characteristics of a light source that includes a lamp test location for receiving a lamp for testing and a mirror positioned in a fixed light receiving position relative to the lamp test location and positioned in a fixed light transmitting position for reflecting a light beam from the lamp at a predetermined angle relative to the light receiving position. A measurement screen is positioned in a location relative to the mirror to receive the parabolically-condensed light image reflected from the mirror at the predetermined angle and a light detector is positioned to capture a light image reflected from the measurement screen. The light detector is configured to convert the reflected light image on the measurement screen to a digital signal and output the digital signal. A computer is configured for receiving and processing the digital signal corresponding to the reflected light image and calibrated for measuring luminous intensity according to an algorithm programmed in the computer.

A photoelectric sensor includes an indicator lamp that is easily visible in any direction. A photoelectric sensor (1) includes a housing (10) having a first surface (e.g., a top surface 15) and a second surface (e.g., a bottom surface 16) opposite to the first surface, and a first indicator lamp (31) and a second indicator lamp (32) that redundantly indicate information about a state of the photoelectric sensor (1). The first indicator lamp (31) is located on the first surface, and the second indicator lamp (32) is located on the second surface. The first surface and the second surface are parallel to each other. The information indicated redundantly is at least one of an on-off state of a power supply or a workpiece detection state.

An optical detecting device includes a light source, an optical detecting component, a package structure and a light tight component. The light source outputs a sampling signal to project onto an external object. The optical detecting component is disposed by the light source and has an interval relative to the light source. The optical detecting component receives the sampling signal reflected from the external object. The package structure covers the optical detecting component and the light source, and includes an illuminating surface unit and an incident surface unit respectively corresponding to the light source and the optical detecting component, and further includes an isolation component disposed between the illuminating surface unit and the emerging surface unit. The light tight component is disposed on the isolation component to obstruct transmission path of the sampling signal from the illuminating surface unit to the incident surface without reflection by the external object.

A downpipe sensor detects single grains in a downpipe. A transmitting unit and a receiving unit are spaced apart across a measurement field. Light beams emitted by the transmitting unit are guided in the case of free beam path through the downpipe interior to the receiving unit and are attenuated during a passage of a grain. The receiving unit is a line element with a predefined number of receiving elements. The transmitting unit has light-emitting diodes with perforated screens and a reflector element in the form of a right triangular prism. Light is emitted from the diodes transversely to a receiving axis of the receiving unit, bundled via the perforated screens, guided into the reflector element, deflected by total reflection toward a exit surface to form a light band of parallel light beams. The light band illuminates the entire measurement field with even intensity.

A filter member includes a first lead terminal, an optical filter, and a first mold member, and a light incidence surface and a light emission surface of the optical filter is exposed from the first mold member. A sensor member includes an IR sensor element, a second lead terminal and a second mold member. A light-receiving surface of the IR sensor element is exposed from the second mole member. The filter member is disposed on the sensor member so that the light emission surface of the optical filter faces the light-receiving surface of the IR sensor element in the sensor member.

The present application discloses various embodiments of an apparatus configured to measure characteristics of a beam of laser energy. In one embodiment, the apparatus includes a housing having a first compartment and a second compartment formed therein. Optical modules having optical sensors configured to measure characteristics of the beam of laser energy are mounted in the first compartment. A removable and replaceable beam dump configured to absorb most of the beam is positioned in the second compartment. The housing may include a housing member positioned between the first and second compartments, to reduce the transfer of thermal energy between them. The removability/replaceability of the beam dump enables operation of the apparatus without active cooling of the beam dump assembly, simplifying the apparatus and protecting the optical sensors in the first compartment.

A sensor adapted to be mounted to a surface has a rotatable enclosure that may be used, for example, to direct a lens of the sensor towards a window. The daylight sensor includes a photosensitive circuit for measuring a light intensity in the space, a cover portion, and a base portion adapted to be mounted to the surface. The cover portion is rotatable with respect to the base portion, for example, to direct the lens towards the window after the base portion is mounted to the surface. The base portion may also include a cylindrical wall having a channel adapted to capture a snap of the cover portion, such that the snap may move angularly through the channel to allow for rotation of the cover portion with respect to the base portion to a plurality of discrete positions.

A photoelectric converting module includes a circuit board and an optical coupling member. The circuit board includes a substrate defining a plurality of heat-conducting through holes and a hot-curable adhesive layer covering the heat-conducting through holes. The optical coupling member is fixed to the substrate via the hot-curable adhesive layer.