A thermal and environmental noise suppressing interface circuit which is configured to operate cold and is configured to perform biasing with suppression of noise currents from room temperature noise voltages and dc coupled rf readout of a superconducting device under test with a single coaxial cable or equivalent conductor pair. The circuit is configured to suppress the propagation of thermal and environmental noises to/from sensors operating at a different temperature from its operating and control equipment while maintaining a single input-output channel, and provides for the placement of a local grounding impedance on an intercept board.

A sterilization system consisting of a mobile emitter, a sensing subsystem and a data logging subsystem is described. The emitter has one or more UV emitting lamps or devices. The sensing system comprises at least one remote UV sensor and at least one door sensor. The door sensor comprises a safety shut off door detector and may contain an emergency stop detector and arming detector to protect people from being exposed to UV energy. The system has a remote control for starting, stopping and setting system parameters which include but are not limited to: treatment time, dosage, room size, room number, unit number, floor, facility name, operator name, operator identification number, password, default dosage values, dosage, and patient identification number. The number of treatments per unit of time can be maximized because of the use of incident light measurement.

A package component includes a base layer, a sensing layer, a photo-curable adhesive, a cover layer and a first filter structure. The photo-curable adhesive and the sensing layer are disposed on the base layer. The sensing layer includes a sensing unit surrounded by the photo-curable adhesive. The cover layer is disposed on the sensing layer. The first filter structure faces the photo-curable adhesive and is disposed on the cover layer. The first filter structure is configured for transmitting a curing light which is used to cure the photo-curable adhesive, and for reflecting a detectable light which is to be sensed by the sensing unit, where the wavelength of the curing light is different from the wavelength of the detectable light.

A plant detection system includes a radiation module and a photodetector system. The photodetector system includes a photodetector housing, one or more photodetectors, a detector lens, and an aperture plate. The aperture plate is disposed within the photodetector housing between the detector lens and the one or more photodetectors and has an aperture extending therethrough. The detector lens and the aperture plate are configured so that stray radiation received by the detector lens is directed through the aperture in the aperture plate or onto a surface of the aperture plate without being directed onto sidewalls of the photodetector housing.

An optical sensor includes a light receiving unit and a calculating unit. The light receiving unit includes a plurality of light receiving elements and a plurality of color filters. The plurality of light receiving elements include a first light receiving element and a second light receiving element through which a photocurrent flows when receiving light. The plurality of color filters include a yellow filter that covers a light receiving surface of the first light receiving element and a red filter that covers a light receiving surface of the second light receiving element. The calculating unit calculates an intensity of a yellow wavelength band based on a difference between a first output signal obtained from the photocurrent of the first light receiving element and a second output signal obtained from the photocurrent of the second light receiving element.

A photoelectric sensor including at least any one of a light projecting unit for emitting light and a light receiving unit for detecting light includes a substrate on which at least any one of the light projecting unit and the light receiving unit is mounted, a cover which has a protecting portion facing the substrate and for protecting the substrate and a side wall extending from a periphery of the protecting portion, and a sealing member which seals at least any one of the light projecting unit and the light receiving unit that is mounted on the substrate, in which the cover has a protruding portion on a surface which is positioned outside a side surface of the substrate and intersects an extending direction of the side wall, and the protruding portion is in contact with the sealing member.

A measuring apparatus includes a light receiving device, a housing, an optical window, an electrical connection line, and a line enclosure. The light receiving device receives light and output a signal. The housing, made of a conductive material, covers the light receiving device. The optical window transmits the light. The optical window includes a conductive part having conductivity. The electrical connection line transmits the signal. The line enclosure is disposed around the electrical connection line and electrically connected to the conductive part and the housing.

Optical apparatus includes a primary radiation source, which emits first optical radiation along a first optical axis. A DOE includes at least an entrance surface, upon which the first optical radiation from the primary radiation source is incident, and an exit surface, through which one or more primary diffraction orders of the first optical radiation are emitted from the DOE. At least one secondary radiation source is configured to direct second optical radiation to impinge on the DOE along a second optical axis, which is non-parallel to the first optical axis, causing at least a part of the second optical radiation to be diffracted by the DOE such that one or more secondary diffraction orders of the second optical radiation are emitted through the entrance face of the DOE. At least one detector is configured to sense at least one of the secondary diffraction orders of the second optical radiation.

An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.

To provide a solid-state light-receiving device for ultraviolet light which can measure the amount of irradiation with ultraviolet light harmful to the human body using a simplified structure and properly and accurately, which can be readily integrated with a sensor of a peripheral circuit, which is small, light-weight, and low-cost, and which is suitable for mobile or wearable purposes. One solution is a solid-state light-receiving device for ultraviolet light which is provided with a first photodiode (1), a second photodiode (2), and a differential circuit which receives respective signals based on outputs from these photodiodes, wherein a position of the maximum concentration of a semiconductor impurity is provided in each of the photodiodes (1,2) and in a semiconductor layer region formed on each photodiode, and an optically transparent layer having a different wavelength selectivity is provided on a light-receiving surface of each photodiode.