Patent classifications
G01J3/45
MIRROR UNIT AND OPTICAL MODULE
A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The mirror device 20 is provided with a light passage portion 24 that constitutes a first portion of an optical path between the beam splitter unit 3 and the fixed mirror 16. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a second portion of the optical path between the beam splitter unit 3 and the fixed mirror 16. A second surface 21b of the base 21 and a third surface 13a of the optical function member 13 are joined to each other.
MIRROR UNIT AND OPTICAL MODULE
A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The mirror device 20 is provided with a light passage portion 24 that constitutes a first portion of an optical path between the beam splitter unit 3 and the fixed mirror 16. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a second portion of the optical path between the beam splitter unit 3 and the fixed mirror 16. A second surface 21b of the base 21 and a third surface 13a of the optical function member 13 are joined to each other.
Light module
A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.
Light module
A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.
Systems and methods for semiconductor chip surface topography metrology
Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals and a plurality of spectrum signals are received by at least one processor. Each of the interference signals and spectrum signals corresponds to a respective one of a plurality of positions on a surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.
SELF-CALIBRATED SPECTROSCOPIC AND AI-BASED GAS ANALYZER
Aspects relate to a compact and low-cost gas analyzer that can be used for different types of gas analysis, such as air quality analysis. The gas analyzer can include a light source, a gas cell configured to receive a sample (e.g., a gas under test), a spectral sensor including a spectrometer and a detector, and an artificial intelligence (AI) engine. Light can enter the gas cell and interact with the sample to produce output light that may be measured by the spectral sensor. The resulting spectrum produced by the spectral sensor may be analyzed by the AI engine to produce a result. The gas analyzer further includes a self-calibration component configured to enable calibration of the sample spectrum to compensate for spectral drift of the spectral sensor.
OPTICAL DEVICE
In an optical device, a base and a movable unit are constituted by a semiconductor substrate including a first semiconductor layer, an insulating layer, and a second semiconductor layer in this order from one side in a predetermined direction. The base is constituted by the first semiconductor layer, the insulating layer, and the second semiconductor layer. The movable unit includes an arrangement portion that is constituted by the second semiconductor layer. The optical function unit is disposed on a surface of the arrangement portion on the one side. The first semiconductor layer that constitutes the base is thicker than the second semiconductor layer that constitutes the base. A surface of the base on the one side is located more to the one side than the optical function unit.
OPTICAL DEVICE
In an optical device, a base and a movable unit are constituted by a semiconductor substrate including a first semiconductor layer, an insulating layer, and a second semiconductor layer in this order from one side in a predetermined direction. The base is constituted by the first semiconductor layer, the insulating layer, and the second semiconductor layer. The movable unit includes an arrangement portion that is constituted by the second semiconductor layer. The optical function unit is disposed on a surface of the arrangement portion on the one side. The first semiconductor layer that constitutes the base is thicker than the second semiconductor layer that constitutes the base. A surface of the base on the one side is located more to the one side than the optical function unit.
Method and system for analysing a chemical composition of a target using a Fabry-Perot interferometer
According to an example aspect of the present invention, there is provided a method for analysing a chemical composition of a target, the method comprising placing an electrically tunable Fabry-Perot interferometer in a path of radiation emitted by a radiation source, and detecting the radiation, which has passed the Fabry-Perot interferometer and which has passed or was reflected by the target, by means of a detector, and wherein detection is made such that multiple pass bands are allowed to be detected simultaneously.
Method and system for analysing a chemical composition of a target using a Fabry-Perot interferometer
According to an example aspect of the present invention, there is provided a method for analysing a chemical composition of a target, the method comprising placing an electrically tunable Fabry-Perot interferometer in a path of radiation emitted by a radiation source, and detecting the radiation, which has passed the Fabry-Perot interferometer and which has passed or was reflected by the target, by means of a detector, and wherein detection is made such that multiple pass bands are allowed to be detected simultaneously.