A temperature detection system includes a housing, a thermal imaging system at least partially disposed within the housing, and a data correction system communicatively coupled with the thermal imaging system. The thermal imaging system is configured to capture at least one thermal image of a subject. The data correction system is configured to correct at least one error associated with the at least one thermal image of the subject.

There may be provided a machining monitor that may include (i) a sensing unit that comprises a thermal sensor, (ii) a processor, (iii) a communication unit, and (iv) a housing. The thermal sensor is configured to (a) thermally sense a sensed region related to the machining during a machining, and while being rotated by a mechanical coupling to a rotation of a cutting tool, and (b) generate thermal detection signals. The processor is configured to determine a temperature parameter related of the sensed region based on the thermal detection signals.

The present invention relates to a light guiding arrangement (1) for transmitting electromagnetic radiation, in particular ultraviolet and/or infrared radiation, and a spark and/or flame detector that uses same. The light guiding arrangement (1) comprises a housing (10) and a light guiding rod (20), wherein the housing (10) has a light entrance opening (12) and a light exit opening (14) situated opposite, wherein the light guiding rod (20) is arranged in the housing (10) between the light entrance opening (12) and the light exit opening (14), wherein the light guiding rod (20) is mounted resiliently on at least one side in the housing (10).

A thermopile sensor including a uniform substrate having a first surface with a first section and a second section at an elevation varying relative to the first section by between about 5 micrometers and about 500 micrometers. The sensor further includes a plurality of thermopile junctions, with each junction having (i) a first strip of a first conductive material, extending from the first section to the second section, (ii) a second strip of a second conductive material, forming an electrical junction with the first strip on the second section and extending to the first section, and (iii) with the thermopile junctions being connected in series. A first contact pad on the substrate is connected to an initial thermopile junction and a second contact pad on the substrate is connected to a last thermopile junction, with conductors connecting to the first and second contact pads and extending off of the substrate.

An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.

Embodiments disclosed herein generally relate to a substrate temperature monitoring system in a substrate support assembly. In one embodiment, the substrate support assembly includes a support plate and a substrate temperature monitoring system. The support plate has a top surface configured to support a substrate. The substrate temperature monitoring system is disposed in the substrate support plate. The substrate temperature monitoring system is configured to measure a temperature of the substrate from a bottom surface of the substrate. The substrate temperature monitoring system includes a window, a body, and a temperature sensor. The window is integrally formed in a top surface of the support plate. The body is embedded in the support plate, through the bottom surface. The body defines an interior passage. The temperature sensor is disposed in the interior passage beneath the window. The temperature sensor is configured to measure the temperature of the substrate.

A temperature-regulating unit includes a base, a resonant tank, and a controller. The base is configured to support a pan. The resonant tank includes a coil and a capacitor. The resonant tank has a resonant frequency that is affected by a material of the pan and a temperature of the pan. The controller is configured to receive a temperature setting, monitor the resonant frequency, determine the material of the pan based on the resonant frequency, determine the temperature of the pan based on the resonant frequency, and adaptively control a thermal element based on the temperature of the pan, the material of the pan, and the temperature setting.

An improved system for measuring the temperature of a plurality of workpieces in a rotating semiconductor processing device is disclosed. Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. Further, by limiting the amount of coating applied to the workpiece, the effect of the coating on the intrinsic temperature of the workpiece and the surrounding semiconductor processing device may be minimized. The temperature of the workpieces is measured as the workpieces pass under an aperture by capturing a thermal image of a portion of the workpiece. In certain embodiments, a controller is used to process the plurality of thermal images into a single thermal image showing all of the workpieces disposed within the semiconductor processing device.

Disclosed are a sensor module and a method for operating the same. The sensor module includes a module unit including a first body having a cavity and a module substrate received in the first body; and a sensor unit including a second body detachable from the cavity of the module unit and a sensor received in the second body, wherein the module unit reads an output signal from the sensor unit to generate sensing information and wirelessly outputs the sensing information.

Disclosed is an error correction unit enabling constant accurate measurement of a moving object by correcting an error attributable to a change in sensitivity of a thermal image sensor, a change in distance between a thermal image sensor and an object, or an ambient environment. Further disclosed is an object temperature detection device equipped with the same. The error correction unit includes a first arm member rotatably coupled to a thermal imaging camera unit, a heating element holder rotatably coupled to the first arm member, the heating element fixed to the heating element holder, and a temperature sensor configured to measure a temperature of the heating element. The heating element is positioned within an angle of view of the thermal imaging camera unit through rotational motion of the first arm member and the heating element holder. The temperature sensor measures the temperature of the heating element at a first time and a second time different from the first time so that the controller can use a temperature change value of the heating element. Data of the temperatures of the heating element, which are measured respectively at the first time and the second time, are transmitted to the controller.