An optical detector device includes a housing with a projecting neck that is closed off towards the outside by a light-transmissive pane, under which at least one optical waveguide that tapers in the direction of an optical sensor is disposed. An optical waveguide arrangement has a plurality of optical waveguides which are retained in the neck by a holding mechanism.

An ear thermometer includes a probe including an infrared sensor unit for measuring a temperature of an eardrum of an ear of a temperature measurement target parson in a non-contact manner, the probe attached to an ear hole of the temperature measurement target parson. The probe includes a probe body inserted into the ear hole of the temperature measurement target parson, a housing for supporting the probe body; and an in-ear type earpiece attached to the probe body and abutting on an inside of the ear hole of the temperature measurement target person. The infrared sensor unit includes a first sensor and a second sensor arranged in the probe body and spaced apart by a predetermined distance along a direction substantially orthogonal to the eardrum when the probe body is inserted into the ear hole of the temperature measurement target person.

The present invention relates to an externally mounted calibration device and a temperature measurement system using the same. The temperature measurement system calibrates the temperature of the thermal camera using an externally mounted temperature calibration device that is mounted on one side of the outside of the thermal camera unit and includes a temperature measurement substrate with a temperature sensor. The temperature measurement substrate of the externally mounted temperature calibration device is captured simultaneously with the subject to be measured on the screen of the thermal camera, and using the temperature of the temperature measurement substrate measured by the temperature sensor and the temperature of the temperature measurement substrate measured by the thermal camera, the temperature of the subject to be measured by the thermal camera is calibrated, thereby ensuring that the thermal camera always maintains a constant temperature measurement result regardless of the environmental temperature when used.

A film structural component is supported by a substrate. The film structural component includes a plurality of thermal infrared detectors arranged in an array. Each of the plurality of thermal infrared detectors includes a thermopile having a plurality of hot junctions and a plurality of cold junctions. An infrared sensor further includes a plurality of heaters and at least one thermometer. The plurality of heaters are provided on the first principal surface of the substrate. The at least one thermometer is provided on the first principal surface of the substrate and is configured to detect a temperature of the substrate. Each of the plurality of heaters faces another heater of the plurality of heaters via a region including the plurality of thermal infrared detectors in plan view in the thickness direction of the substrate.

The present disclosure discusses various systems and methods for screening individuals for an elevated skin temperature, including substantially reducing the footprint of conventional thermal imaging system. The footprint of the currently available thermal imaging system is reduced in part because rather than having a blackbody and a person being screened simultaneously located within the thermal camera's field of view, the present disclosure discusses a unique thermal imaging system that provides a reference temperature to the system for subsequent comparison to the thermal camera, using a blackbody, prior to the thermal scanning and imaging the person.

Disclosed herein is an apparatus for adjusting the installation location of a temperature sensor configured to measure the surface temperature of a wafer in a semiconductor wafer cleaning apparatus. The apparatus includes: a bracket which is disposed in the upper end of the side wall of each of multi-station processing chambers (MPCs); a first fastening member which fastens a cable; a second fastening member which fastens a temperature sensor; a location adjustment member which fastens and supports the temperature sensor; the temperature sensor which is fixedly coupled to an end of the location adjustment member; a jig which includes a location adjustment plate and a control substrate, and which adjusts the detection location of the temperature sensor; and a controller which is provided with a wafer surface monitoring system configured to separate the surface temperature into a plurality of channels and to display the surface temperature.

A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.

The present disclosure relates to optical systems, vehicles, and methods for providing improved mechanical performance of a camera and corresponding optical elements. An example optical system includes an outer housing and an inner support member. The optical system also includes an optical window coupled to the outer housing and the inner support member. The optical window is configured to be temperature-controllable. The optical system also includes a camera coupled to the inner support member. The camera is optically coupled to the optical window. Additionally, the outer housing, the optical window, and the camera are configured to be impact resistant.

An ultra-small thermal imaging core, or micro-core. The design of the micro-core may include substrates for mounting optics and electronic connectors that are thermally matched to the imaging Focal Plane Array (FPA). Test fixtures for test and adjustment that allow for operation and image acquisition of multiple cores may also be provided. Tooling may be included to position the optics to set the core focus, either by moving the lens and lens holder as one or by pushing and/or pulling the lens against a lens positioning element within the lens holder, while observing a scene. Test procedures and fixtures that allow for full temperature calibration of each individual core, as well as providing data useful for uniformity correction during operation may also be included as part of the test and manufacture of the core.

The present invention is an apparatus for collecting infrared temperature reading of concentrates. The proposed embodiment provides a unique approach for users to easily collect critical heat data. The embodiment may even be used for both medical and recreational purposes.