A process for producing an optical element, which may be suitable for use in an infrared camera with sharp surface features and low emissivity surfaces, including the steps of casting the element in the desired shape in a zinc alloy, deburring the zinc alloy element with a thermal deburring operation, and coating the deburred zinc alloy element with an electrocoating operation.

The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.

The present invention proposes a multi-featured miniature camera. The components of the camera mainly comprise of an image capturing means, multiple activating means, an infrared radiating means, a microphone, multiple Bluetooth connection means, an identification chip means, a wireless power charging means, a wireless data transfer means, an image processing means and a location determination means. The camera provides wireless power and data transfer, image recognition, Push-To-Talk (PTT) function, multiple Bluetooth communication etc. This multi-featured camera is mounted on different application areas such as on the helmet of police officers, sport players, firefighters etc. The camera body is designed in such a way, that it easily fits on the helmet.

A method for manufacturing a thermal sensor, the method may include forming, using ion etching, one or more first holes that pass through (a) an initial layer, (a) a first oxide layer, (c) a first semiconductor substrate; filling the one or more first holes with oxide to form supporting elements; fabricating one or more thermal semiconductor sensing elements; forming one or more second holes in the one or more upper layers and the first oxide layer; applying an isotropic etching process to remove the first semiconductor substrate and expose the supporting elements to provide a suspended first oxide layer.

An electronic device is provided, which includes an enclosure, an output component, a display screen and an optical sensor. The output component and the display screen are mounted on the enclosure. The output component includes a packaging shell, an infrared supplementary lighting lamp and a proximity infrared lamp; the packaging shell includes a packaging substrate; the infrared supplementary lighting lamp and the proximity infrared lamp are packaged in the packaging shell and born on the packaging substrate. The display screen is provided with a non-opaque entity region and includes a front surface capable of displaying a picture and a back surface back on to the front surface. The optical sensor is arranged on a side, where the back surface is positioned, of the display screen and corresponds to the non-opaque entity region.

A method of displaying an object temperature includes capturing an image and a thermal image; presetting a basis temperature; calculating temperature value of each point of the thermal image; comparing the temperature value with the basis temperature; displaying the temperature value exceeding the basis temperature.

A camera apparatus. The camera apparatus includes a housing having a front end and a back end; a lens, wherein the lens is disposed in the front end of the housing; and a thermal core, wherein the thermal core is disposed between the lens and the back end of the housing, the thermal core further comprising: at least one substrate; at least one thermally conductive member configured to remove heat from the thermal core; and an infrared imager affixed to one of the at least one substrate, the infrared imager configured to capture an infrared video stream.

A near-field probe (and associated method) compatible with near-infrared electromagnetic radiation and high temperature applications above 300? C. (or 500? C. in some applications) includes an optical waveguide and a photonic thermal emitting structure comprising a near-field thermally emissive material coupled to or part of the optical waveguide. The photonic thermal emitting structure is structured and configured to emit near-field energy responsive to at least one environmental parameter of interest, and the near-field probe is structured and configured to enable extraction of the near-field energy to a far-field by coupling the near-field energy into one or more guided modes of the optical waveguide.

An object of the present invention is to provide a bolometer having a high TCR value and a low resistance, and a method for manufacturing the same. According to the present invention, a bolometer manufacturing method including: fabricating an interlayer having a function that enhances binding between a substrate and a carbon nanotube, in a predetermined shape on the substrate; and, making a semiconducting carbon nanotube dispersion liquid move on the interlayer in one direction relative to the fabricated interlayer is provided.

A method is provided. The method comprises: transmitting a periodic chirp to at least two pixels of a MEMS sensor array; determining a resonant frequency of each MEMS resonant sensor receiving the periodic chirp; determining the change in resonant frequency of each MEMS resonant sensor receiving the periodic chirp; determining a power level incident upon each pixel receiving the periodic chirp. In one embodiment, the method further comprises calibrating the MEMS sensor array. In another embodiment, calibrating comprises generating a reference resonant frequency for each MEMS resonant sensor. In a further embodiment, determining the power level comprises determining a difference between the determined resonant frequency and the reference resonant frequency.