Patent classifications
G01J5/025
ELECTRONIC DEVICE INCLUDING SENSOR MODULE
An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.
MULTI-SPECTRAL FLAME DETECTOR WITH RADIANT ENERGY ESTIMATION
A flame detector configured for radiant energy monitoring, quantification, and information transmission. The system has at least one optical sensor channel, each including an optical sensor configured to receive optical energy from a surveilled scene within a field of view, the channel producing a signal providing a quantitative indication of the optical radiation energy received by the optical sensor within a sensor spectral bandwidth. A processor is responsive to the signal from the at least one optical sensor channel to provide a flame present indication of the presence of a flame, and a quantitative indication representing a magnitude of the optical radiation energy from the surveilled scene. An Artificial Neural Network may be used to provide an output corresponding to a flame condition.
Thermal monitoring system for temperature-sensitive storage containers
Example aspects of a thermal monitoring system are disclosed. The thermal monitoring system can comprise a cryogenic storage container comprising an external wall and an internal wall, wherein a cold cryogenic liquid is housed within the internal wall, and wherein a vacuum is formed between the external wall and the internal wall; a thermal imaging camera configured to measure temperatures within a region of interest, wherein the cryogenic storage container is oriented within the region of interest and the thermal imaging camera measures an external temperature of the outer wall of the cryogenic storage container, the thermal imaging camera further comprising camera software configured to generate a thermographic video of the external temperature; a display device displaying the thermographic video; and an alarm unit configured to activate an alert when the external temperature of the cryogenic storage container drops below a pre-selected trigger temperature.
Systems, methods, and computer program products for infrared imaging operations
Systems, methods, and computer program products for infrared (IR) image operations are provided. An example imaging system includes a first IR imaging device configured to generate first IR image data and a second IR imaging device configured to generate second IR image data. The system further includes a computing device that receives the first IR image data from the first IR imaging device and receives the second IR image data from the second IR imaging device. The computing device further determines a first feature representing a position of a gas plume based upon the first IR image data and a second feature representing a position of the gas plume based upon the second IR image data and determines a disparity between the first and second features. The computing device further determines a distance between the imaging system and the gas plume based upon the determined disparity.
Infrared thermometer with sighting device and method for measuring temperature of energy zone using same
An infrared thermometer measures a temperature of an energy zone. The infrared thermometer comprises a beam splitter for splitting an incident light beam from an energy zone into an infrared light beam and a visible light beam; an infrared detector for detecting the infrared light beam and generating a signal indicative of a temperature of the energy zone according to the detected infrared light beam; and a sighting device having an optical module for generating a reflective reticle image and transmitting the visible light beam to generate a target image at a sight window, wherein the sighting device is configured to superimpose the reflective reticle image over the target image at the sight window to align the infrared detector with the energy zone. The infrared thermometer and an associated measurement method facilitate the alignment of the energy zone by the users, thereby improving the accuracy of the measurement.
SYSTEMS, METHODS, AND COMPUTER PROGRAM PRODUCTS FOR DETECTION LIMIT DETERMINATIONS FOR HYPERSPECTRAL IMAGING
Systems, methods, and computer program products for thermal contrast determinations are provided. An example imaging system includes a first infrared (IR) imaging device that generates first IR image data of a field of view of the first IR imaging device and a computing device connected with the first IR imaging device. The computing device receives probe temperature data from a temperature probe indicative of an external environment of the imaging system and receives the first IR image data from the first IR imaging device. The computing device determines background temperature data based upon the first IR image data, determines gas temperature data based upon the probe temperature data, and determines a thermal contrast for each pixel based upon a comparison between the background temperature data and the gas temperature data. The computing device further determines a detection limit for each pixel as a function of thermal contrast.
System And Method To Monitor Semiconductor Workpiece Temperature Using Thermal Imaging
An improved system for measuring the temperature of a plurality of workpieces in a rotating semiconductor processing device is disclosed. Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. Further, by limiting the amount of coating applied to the workpiece, the effect of the coating on the intrinsic temperature of the workpiece and the surrounding semiconductor processing device may be minimized. The temperature of the workpieces is measured as the workpieces pass under an aperture by capturing a thermal image of a portion of the workpiece. In certain embodiments, a controller is used to process the plurality of thermal images into a single thermal image showing all of the workpieces disposed within the semiconductor processing device.
Motion detector with adjustable pattern direction
Aspects of the present disclosure include a PIR assembly including a dome comprising a plurality of optical components, a stationary circuit board, and a moveable PIR sensor moveably coupled to the stationary circuit board via a flexible cable, wherein the moveable PIR sensor is configured to move to a first position to monitor a first zone via a first optical component of the plurality of optical components and to a second position to monitor a second zone via a second optical component of the plurality of optical components.
PASSIVE INFRARED SENSOR DEVICE
Systems and techniques are provided for sensor device. A sensor device may include a housing, a lens inserted into a first opening of the housing, a metal mask covering a portion of the interior of the lens, a passive infrared (PIR) sensor underneath the lens and the metal mask, and a light pipe around the PIR sensor, the lens, and the metal mask. Part of the light pipe may be positioned above an activation mechanism for a button. An airflow gasket may be around the PIR sensor. A filter circuit board may be under the PIR sensor and connected to leads of the PIR sensor. A control circuit board may include the activation mechanism for the button. A backplate may include a slot for attachment to a snap of a magazine in the housing of the sensor device.
Thermal Radiation Detection Device and System, as Well as Electronic Device Comprising Such a Device or System
A thermal radiation detection device (1), said device comprising a sensor array (2) comprising a plurality of sensor elements (3) and an optical waveguide (4) having a radiation input end (5) and a radiation output end (6). The radiation input end (5) is configured to receive thermal5 radiation, and the radiation output end (6) is operatively connected to the sensor array (2). The optical waveguide (4) is configured to transmit the received thermal radiation as a plurality of simultaneous thermal radiation signals. By decoupling the sensor array from the radiation input end, the relatively large sensor array can be placed in a position optimal for electronic functionality and optimal in view of mechanical constraints, independent of the radiation input position.