A testing device for multi-caloric effects in the solid-state cooling technology includes a dynamic magnetic field application assembly, a stress application assembly, a pulse voltage application assembly, and an infrared thermal imaging temperature acquisition assembly. In the dynamic magnetic field application assembly, permanent magnetic holding devices hold permanent magnets, which are slidably mounted on the first guide rail, with two permanent magnets positioned parallel to each other at a distance. The stress application assembly is located between the two first guide rails. The sample is clamped between the first and second sample clamps, and the pulse voltage application assembly is connected to the electrode plates of the sample clamps via wires. The advantages are that it allows for the application of stress, electric fields, and magnetic fields to solid materials, individually or simultaneously, and enables the non-destructive collection of temperature changes in the sample.

A device for determining the temperature conductivity, the heat capacity and/or the thermal conductivity of a material sample. The device has a light emitter for exposing a front side of the sample to a light energy beam and a radiation detector for determining the temperature rise at a rear side of the sample facing away from the front side by detecting the radiation emitted there as a function of temperature, and a sample holder for holding the sample in a defined position.