Systems and methods according to one or more embodiments are provided for determining an emitted radiation intensity of an object in a thermal image. In one example, a system includes a memory component configured to store a plurality of captured thermal images of a scene and a processor. The processor is configured to select a pixel on a thermal image corresponding to a measured radiation intensity associated with an object in the scene. Real world coordinates of the object are determined. An emitted radiation intensity of the object is calculated using the determined real world coordinates and the measured radiation intensity. Additional systems and methods are also provided.

The invention discloses a temperature measuring device adopting a plurality of infrared sensors and its method. The temperature measuring device consists of a housing, a main control circuit board unit set in the housing, a power supply unit and an infrared sensor set at the head of the housing, wherein the main control circuit board unit is a main control circuit board, and a main control Microcontroller Unit, a signal acquisition circuit, a display screen, a power supply and a control key integrated in the main control circuit board. The method is to calculate and output the accurate target temperature through infrared sensors combined with Microcontroller Unit, at the same time, it can effectively identify such as abnormality of measurement area, abnormality of user measurement method and so as to improve the effectiveness of measurement results.

A non-contact infrared thermometer is used to measure the temperature of a target area of an object to be measured. The non-contact infrared thermometer comprises an infrared sensor, time-of-flight sensor, a microprocessor, and storage. The time-of-flight sensor is configured for measuring an actual temperature measurement distance from the target area. The microprocessor is electrically connected to the infrared sensor and the time-of-flight sensor. The storage is electrically connected to the microprocessor and configured to store the range of a predetermined distance for temperature measurement. If the actual temperature measurement distance falls within the range of the predetermined distance for temperature measurement, the infrared sensor measures the temperature of the target area of the object to be measured.

A thermometer includes one or more temperature sensors mounted on a housing. The one or more temperature sensors determine a temperature of at least one measurement site without contact. The non-contact thermometer displays an indicator to assist alignment of the one or more temperature sensors with the at least one measurement site, receives at least one measurement reading from the at least one measurement site, determines a temperature based on the at least one measurement reading, and displays the temperature on a display unit.

Apparatus and methods are disclosed for highly accurate remote measurement of sea surface skin temperature. Thermal band 8 to 14 micron images of the surface of the ocean taken by a downward looking infrared camera are processed to determine the optimum segments of the image to utilize. The influence of contaminating reflection of the downwelling flux from the sky and other error sources are removed and from the data and/or otherwise corrected for making sea surface temperature accuracy within several tenths of a degree possible.

Disclosed is an error correction unit enabling constant accurate measurement of a moving object by correcting an error attributable to a change in sensitivity of a thermal image sensor, a change in distance between a thermal image sensor and an object, or an ambient environment. Further disclosed is an object temperature detection device equipped with the same. The error correction unit includes a first arm member rotatably coupled to a thermal imaging camera unit, a heating element holder rotatably coupled to the first arm member, the heating element fixed to the heating element holder, and a temperature sensor configured to measure a temperature of the heating element. The heating element is positioned within an angle of view of the thermal imaging camera unit through rotational motion of the first arm member and the heating element holder. The temperature sensor measures the temperature of the heating element at a first time and a second time different from the first time so that the controller can use a temperature change value of the heating element. Data of the temperatures of the heating element, which are measured respectively at the first time and the second time, are transmitted to the controller.

Systems and methods are provided for logging temperatures of food products using a temperature assembly including a housing and one or more temperature sensors, e.g., an infrared sensor for surface temperatures and an elongate probe for acquiring a temperature within a food product, and a mobile electronic device including a camera, a communication interface for communicating with the temperature assembly, a processor configured to acquire a temperature reading from the temperature assembly and an image from the camera when the temperature reading is acquired, and memory for storing the temperature reading and image.

Systems and methods are provided for logging temperatures of food products using a temperature assembly including a housing and one or more temperature sensors, e.g., an infrared sensor for surface temperatures and an elongate probe for acquiring a temperature within a food product, and a mobile electronic device including a camera, a communication interface for communicating with the temperature assembly, a processor configured to acquire a temperature reading from the temperature assembly and an image from the camera when the temperature reading is acquired, and memory for storing the temperature reading and image.

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.

In a method of determining a critical temperature of a semiconductor package, heat is applied to at least one semiconductor package. Temperatures of the semiconductor package are measured during the heating. Heights of the semiconductor package are also measured during the heating. A temperature of the semiconductor package measured at a point at which a height from among the measured heights of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs is determined as the critical temperature of the semiconductor package. Thus, the critical temperature of the semiconductor package may be accurately determined.