A combined optical system for determining temperature of the surface of an object or material and its distance with respect to a predetermined reference point associated with the system includes an optical radiation source emitting optical probe radiation at a predetermined wavelength or in a predetermined wavelength range, a source control unit controlling switching of the source from an operative condition, in which it emits optical probe radiation, to an inoperative condition, in which it does not emit optical probe radiation, optical detectors acquiring scattered optical radiation and thermally emitted optical radiation from the surface of the object or material, and a processing unit determining the distance of the surface of the object/material based on scattered optical probe radiation when the source is operative, and the local temperature of the surface of the object/material on the basis of thermally emitted optical radiation when the source is inoperative.

Systems, methods, and apparatuses to detect persons having fever. For example, A fever scanner can have a thermal camera to capture a thermal image of a person, a distance sensor to measure a distance between the person and the fever scanner, and a processor to determine a first temperature from the thermal image and calculate a second temperature of the person based on the first temperature and the distance. When the second temperature is above a threshold, the fever scanner can generate an alert.

A method for detecting differences in surface properties of one or more components is provided wherein the infrared radiation emitted by the component at a specific temperature of the component is detected as irradiance on a selected receiver surface relative to the component. When detecting at different positions or on a plurality of components, the solid angle covered by the receiver surface and the distance from the component surface is almost unchanged and differences in the detected irradiance can then be equated with differences in the surface properties of the components. The invention further relates to use of such methods for monitoring and optionally adjusting the surface quality of a component, as well as to a device for adjusting the surface properties in the series production of components.

A temperature measuring device includes at least one first distance sensing unit and a second distance sensing unit for outputting first and second distance sensing signals, respectively; a temperature sensing unit for outputting a temperature sensing signal; a display unit for displaying the temperature measurement value; and a micro processing unit for receiving the first and the second distance sensing signals, and then determining, according to the first and the second distance sensing signals, whether the display unit displays the temperature measurement value calculated according to the temperature sensing signal. As a result, the at least two distance sensing units are used to prevent the temperature measuring device from executing the temperature measurement when the sensing unit of the thermometer obliquely points to a to-be-sensed part of a to-be-measured target to cause a large measurement angle.

A temperature measurement device having a thermopile temperature sensor and a proximity sensor, a mobile temperature measurement device, and a method for determining a corrected temperature with a temperature measurement device are described. In an implementation, a temperature measurement device includes a semiconductor device; a thermopile temperature sensor disposed on the semiconductor device, where the thermopile temperature sensor is configured to receive radiation from an object; a proximity sensor disposed on the semiconductor device, the proximity sensor configured to detect a distance between the thermopile temperature sensor and the object; and a controller configured determine a corrected temperature measurement using at least an indication of received radiation and an indication of distance between the thermopile temperature sensor and the object.

An infrared camera captures a subject to generate a thermal image thereof. A distance sensor detects distances from an information processing apparatus to points on the subject. A storage device stores a temperature-to-color conversion table indicative of correspondences between temperatures and pixel colors. A control device processes the thermal image based on the conversion table, to display the processed thermal image on a display device. The control device identifies a region of interest within a range of a predetermined distance from a reference point of the subject based on the distances detected by the distance sensor, sets lower and upper limits of a temperature range based on temperatures of points within the region of interest, updates the conversion table based on the lower and upper limits, and regenerates the thermal image based on the updated conversion table, to display the regenerated thermal image on the display device.

One or more apparatuses comprising at least two thermal image data capture and measuring devices that measure long wave infrared radiation intensity of energy flux on a per pixel basis wherein pixels provide dynamic image data that is transmitted and received between two or more digital devices so that the image data provides at least one captured dynamic image which is correlated with specific exact geographic locations and positions data and facial recognition data and correlated local air quality monitoring index atmospheric data is provided by sensors, and the devices include a lens, an optical system, a photodetector, one or more computerized micro-processors, and a gate that provides a constrained targeted pathway through which at least one person must travel so that dynamic thermal data, position and location data, facial recognition data, and local atmospheric data is measured, transmitted, and received for at least one person moving through the gate.

A security sensor device includes: a plurality of sensor units each of which includes an infrared ray detection element having a visual field in a predetermined target direction, the plurality of sensor units aligned in a predetermined arrangement direction; a plurality of optical systems through which detection rays transmit from a corresponding detection area to each infrared ray detection element, the plurality of optical systems aligned in the predetermined arrangement direction; a target object detection circuit into which an output signal is input from each infrared ray detection element; and a switching unit which is configured to change a configuration between each of the plurality of sensor units and the plurality of optical systems according to a user operation, so that two detections of low-place mounting detection and high-place mounting detection are respectively performed.

A depth thermal imaging module, including a thermal imager array, which includes a plurality of at least two thermal imagers that capture thermal radiation of a wavelength of a scene from different viewpoints. Each thermal imager includes a thermal imager chip, a lens stack, and a focal plane with focal length f. The thermal imagers are separated by a baseline distance of 2h and depth measurement Z is performed on an object of interest based on Z=2hf/Δ where Δ is the difference in location of the object of interest between its location in the thermal image captured by a first thermal imager and the location of the object of interest in the thermal image captured by a second thermal imager and represents as an offset of the point on the focal plane of the first thermal imager and the second thermal imagers relative to their optical axis.

A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.