Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Arsenide (InAs)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Arsenide (InAs)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

A method for measuring furnace temperatures. The method includes obtaining radiance measurements from a plurality of regions of interest (ROIs) using a plurality of thermal imaging cameras, and measuring a surface temperature using a radiance measurement obtained from an ROI selected from the plurality of ROIs. Measuring the surface temperature includes determining an effective background radiance affecting the selected ROI using radiance measurements obtained from ROIs different from the selected ROI, obtaining a compensated radiance by removing the effective background radiance from the radiance measurement obtained from the selected ROI, and converting the compensated radiance to the measured surface temperature.

Imaging devices including dielectric metamaterial absorbers and related methods are disclosed. According to an aspect, an imaging device includes a support. The imaging device also includes multiple dielectric metamaterial absorbers attached to the support. Each absorber includes one or more dielectric resonators configured to generate and emit thermal heat upon receipt of electromagnetic energy.

A method for measuring furnace temperatures. The method includes obtaining radiance measurements from a plurality of regions of interest (ROIs) using a plurality of thermal imaging cameras, and measuring a surface temperature using a radiance measurement obtained from an ROI selected from the plurality of ROIs. Measuring the surface temperature includes determining an effective background radiance affecting the selected ROI using radiance measurements obtained from ROIs different from the selected ROI, obtaining a compensated radiance by removing the effective background radiance from the radiance measurement obtained from the selected ROI, and converting the compensated radiance to the measured surface temperature.

Disclosed is an interactive thermographic presentation system and associated methods. The exemplary thermographic presentation system captures residual heat from human touch and/or breath on a surface over time and generates a visual representation of the captured heat pattern. The visual representation may be generated in real time using a visual light projector or stored for subsequent presentation, which may include generating a physical print of the visual representation. In one embodiment the system may be deployed as an art or science exhibit. In general, the system may be deployed in any setting in which individuals gather, including, but not limited to, art galleries, schools, science fairs, trade shows, music venues, dance clubs, restaurants, homes, and public spaces.

The present application discloses a smart device comprising a temperature sensor, and a method for controlling the same. The present application relates to a smart device comprising a temperature sensor for measuring the temperature of a certain object at a position spaced a certain distance from the object and having a measurement range varying according to the distance from the object. The present application provides a method for controlling a smart device comprising the steps of: measuring a distance from the smart device to the object for measuring the temperature of the object; if the measurement range of the temperature sensor at the measured position is not placed within the object, notifying a user that the temperature of the object cannot be measured; and directing the user to place the measurement range within the object.

An element array circuit includes first wirings including respective first parts, second wirings including respective second parts, and impedance elements each coupled to both one of the first wirings and one of the second wirings. The second parts extend in a direction different from that in which the first parts extend. Each of the second wirings includes a readout line through which signals flow, the signals indicating states of multiple ones of the impedance elements coupled to relevant one of the second wirings. Each of the first parts is a part, of relevant one of the first wirings, to which multiple ones of the impedance elements are coupled. Each of the second parts is a part, of relevant one of the second wirings, to which multiple ones of the impedance elements are coupled. The first parts are smaller than the second parts in electrical resistance value per unit length.

An element array circuit includes first wirings including respective first parts, second wirings including respective second parts, and impedance elements each coupled to both one of the first wirings and one of the second wirings. The second parts extend in a direction different from that in which the first parts extend. Each of the second wirings includes a readout line through which signals flow, the signals indicating states of multiple ones of the impedance elements coupled to relevant one of the second wirings. Each of the first parts is a part, of relevant one of the first wirings, to which multiple ones of the impedance elements are coupled. Each of the second parts is a part, of relevant one of the second wirings, to which multiple ones of the impedance elements are coupled. The first parts are smaller than the second parts in electrical resistance value per unit length.

Wide spectrum optical systems and devices are provided for use in multispectral imaging systems and applications, and in particular, wide spectrum optical assemblies are provided which are implemented using low cost, first surface mirrors in an optical framework that enables real-time viewing of an image in multiple spectral bands simultaneously over the same optical centerline with one main optical element.