A near-infrared sensor cover includes a cover body having transmissiveness to near-infrared rays. The cover body includes a base and a heater unit. The heater unit is arranged rearward of the base in a transmission direction of the near-infrared rays and includes a wire-like heating element. The heating element is configured to generate heat when energized. The base includes a rear portion that includes a rear surface of the base in the transmission direction. In the rear portion of the base, at least part of a section that is different from a section in which the heater unit is provided is formed by a reflection suppression structure including asperities. The asperities include a reflection suppression surface that is inclined relative to the transmission direction and reduces reflection of the near-infrared rays.

A near-infrared sensor cover includes a cover body having transmissiveness to near-infrared rays. The cover body includes a base and a heater unit. The heater unit is arranged rearward of the base in a transmission direction of the near-infrared rays and includes a wire-like heating element. The heating element is configured to generate heat when energized. The base includes a rear portion that includes a rear surface of the base in the transmission direction. In the rear portion of the base, at least part of a section that is different from a section in which the heater unit is provided is formed by a reflection suppression structure including asperities. The asperities include a reflection suppression surface that is inclined relative to the transmission direction and reduces reflection of the near-infrared rays.

The present invention relates to a light guiding arrangement (1) for transmitting electromagnetic radiation, in particular ultraviolet and/or infrared radiation, and a spark and/or flame detector that uses same. The light guiding arrangement (1) comprises a housing (10) and a light guiding rod (20), wherein the housing (10) has a light entrance opening (12) and a light exit opening (14) situated opposite, wherein the light guiding rod (20) is arranged in the housing (10) between the light entrance opening (12) and the light exit opening (14), wherein the light guiding rod (20) is mounted resiliently on at least one side in the housing (10).

The present invention relates to a light guiding arrangement (1) for transmitting electromagnetic radiation, in particular ultraviolet and/or infrared radiation, and a spark and/or flame detector that uses same. The light guiding arrangement (1) comprises a housing (10) and a light guiding rod (20), wherein the housing (10) has a light entrance opening (12) and a light exit opening (14) situated opposite, wherein the light guiding rod (20) is arranged in the housing (10) between the light entrance opening (12) and the light exit opening (14), wherein the light guiding rod (20) is mounted resiliently on at least one side in the housing (10).

A device including a sensor is disclosed. In one embodiment, the sensor includes a thermal infrared sensor or a sensor based on CMOS-SOI-MEMS technology (also referred to as “TMOS”). The sensor is capable of performing at least two functions at the same time. The first is remote temperature measurement and the second is presence detection. The sensor passively collects infrared information and a microprocessor coupled to the sensor determines the temperature as well as presence.

Embodiments disclosed herein facilitates the monitoring of direct ultraviolet B (UVB) radiation exposure by a person via a system having a sensor (such as Lanthanum doped lead zirconate titanate (PLZT) thin-film sensors or other ferroelectric-based sensors) sensitive to UVB radiation. The system beneficially provides current real-time dosage information associated with Vitamin D production by the person as well as real-time indication of safe exposure and/or harmful exposure to current UVB radiation conditions while also, in some embodiments, takes into consideration a person's age, skin type and sensitivity, body surface area exposed.

A thermopile sensor including a uniform substrate having a first surface with a first section and a second section at an elevation varying relative to the first section by between about 5 micrometers and about 500 micrometers. The sensor further includes a plurality of thermopile junctions, with each junction having (i) a first strip of a first conductive material, extending from the first section to the second section, (ii) a second strip of a second conductive material, forming an electrical junction with the first strip on the second section and extending to the first section, and (iii) with the thermopile junctions being connected in series. A first contact pad on the substrate is connected to an initial thermopile junction and a second contact pad on the substrate is connected to a last thermopile junction, with conductors connecting to the first and second contact pads and extending off of the substrate.

A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

There is disclosed a structure and the manufacturing method for packaging for thermopile or equivalent thermal sensing elements of single orientation, 1D arrays and 2D arrays used for thermal or equivalent media sensing. The sensing core has a primary use as a detection core, and accessory use for improved thermal stability through maximizing the flow of heat energy, through the various packaging constituents to achieve a zero thermal gradient effect. The core package comprises of a substrate, a heat spreader for the thermal sensor, an external housing material manufactured from a wafer fabrication process, and an optics of a silicon wafer and other optical components that is attached to the external housing enclosure using wafer level processing. The external housing enclosure can be scaled to a layered architecture into distinct layers that are stacked vertically on top of each other to make for a multi-lens package.

Systems and methods are provided for logging temperatures of food products using a temperature assembly including a housing and one or more temperature sensors, e.g., an infrared sensor for surface temperatures and an elongate probe for acquiring a temperature within a food product, and a mobile electronic device including a camera, a communication interface for communicating with the temperature assembly, a processor configured to acquire a temperature reading from the temperature assembly and an image from the camera when the temperature reading is acquired, and memory for storing the temperature reading and image.