One variation of a method for detecting a fire includes: during a first time period: detecting an increase in ambient light intensity and detecting an increase in ambient humidity; responsive to the increase in ambient light intensity and the increase in ambient humidity, detecting a fire event; during a second time period: correlating a decrease in ambient light intensity with an increase in visual obscuration; detecting an increase in ambient air temperature; in response to a magnitude of the increase in visual obscuration remaining below a high obscuration threshold and a magnitude of the increase in ambient temperature remaining below a high temperature threshold, classifying the fire as an incipient fire; and, in response to the magnitude of the increase in visual obscuration exceeding the high obscuration threshold and the magnitude of the increase in ambient temperature exceeding the high temperature threshold, classifying the fire as a developed fire.

A three-dimensional displacement compensation method is provided. The method includes an obtaining step, a transforming step, a first determining step, a first calculating step and a compensating step. The obtaining step includes obtaining a current image of a measured element captured by a microscopic thermoreflectance thermography device. The transforming step includes two sub-steps. One sub-step uses Fourier transform to calculate a reference image to obtain a first result, and the other sub-step uses Fourier transform to calculate the current image to obtain a second result. The first determining step includes determining a peak point coordinate and a fitting diameter of a point spread function of an optical system of the device. The first calculating step includes calculating a three-dimensional displacement of the position to be compensated relative to the reference position. The compensating step compensates the position to be compensated.

A photonic bolometer includes: a photonic chip; a weak thermal link; a thermally-isolated member, and the weak thermal link thermally isolates the thermally-isolated member from the photonic chip; a photonic temperature sensor; a chip waveguide in optical communication with the photonic temperature sensor; and a photon absorber that receives incident radiation light, increases temperature due to absorption of the incident radiation light, heats the photonic temperature sensor in response to receipt of the incident radiation light, and changes the resonance frequency of the photonic temperature sensor in response to receiving the incident radiation light.

A long-wave infrared detecting element includes a magnetic field generator configured to generate a magnetic field; a substrate on the magnetic field generator; a superparamagnetic material layer disposed to be separated from the substrate and magnetized by the magnetic field generated by the magnetic field generator; a support unit on the substrate to support the superparamagnetic material layer such that the superparamagnetic material layer separated from the substrate, such that the support unit and the superparamagnetic material layer generate heat by absorbing infrared radiation from the outside; and a magneto-electric conversion unit that generates an electrical signal proportional to both a strength of the magnetic field generated by the magnetic field generator and the magnetization of the superparamagnetic material layer.

An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

In a plasma processing apparatus, an additional viewing window is disposed between an infrared temperature sensor and a view window, and the additional viewing window is cooled to be retained at room temperature (20° C. to 25° C.), to reduce and to stabilize electromagnetic waves emitted from the viewing window. By correcting the value of the electromagnetic waves, the measurement precision of the temperature monitor is increased and it is possible to measure and to control the dielectric window temperature in a stable state.

Systems and methods include an infrared camera configured to capture an infrared image of a scene, a display configured to display a portion of the captured infrared image and at least one graphic indicia to guide a person being scanned, and a logic device configured to scan a region of interest using an infrared camera, detect a person in the region of interest, instruct the person to move into a scanning position, initiate temperature scanning of person if scanning criteria is satisfied, determine temperature of the person and compare to at least one temperature threshold, and perform a task associated with determined temperature. The system may further comprise a dual-image camera comprising the infrared camera and a visible image camera, wherein the dual-image camera comprises a beamsplitter arranged to reflect visible light towards the visible image camera and pass through an infrared image to the infrared camera.

A method for determining a set point for a thermal sensor. The method includes: (a) distributing a layer of particulate material forming a build bed surface; (b) optionally, preheating the layer to a temperature below its melting temperature; (c) measuring a first temperature value with a primary or secondary thermal sensor; (d) depositing absorption modifier over the test region and/or surrounding area; (e) heating the test region; (f) measuring a second temperature value with the primary sensor; (g) distributing another layer of material over the preceding layer; repeating steps (b) to (g), such that the test region of each layer reaches a higher temperature than that of the preceding layer, at least until the test region starts to melt; determining a set point for the primary sensor from a characteristic in the evolution of the measured temperature values; and applying the set point to subsequent measurements of the primary sensor.

An example object of the present invention is to provide a bolometer-type detector capable of reducing heat transfer between pixels. A bolometer-type detector according to an example aspect of the present invention includes a plurality of pixels, and at least includes: a substrate, a heat insulating layer provided on the substrate, bolometer films provided on individual pixels on the heat insulating layer, and a wiring for signal output connected to contact electrodes provided in contact with the bolometer films, wherein the wiring for signal output is disposed in a layer different from the bolometer films, and the heat insulating layer between adjacent pixels is removed at least partially in the depth direction and in a region of a length of 50% or longer and a width of 100 nm or wider of a closed curve that surrounds each bolometer film.

A floating bridge structure includes a substrate, a floating bridge layer, and at least one support. The floating bridge layer is on the substrate and substantially parallel to an upper surface of the substrate. The support extends on a vertical surface from the substrate to the floating bridge layer, in which the vertical surface is substantially perpendicular to the upper surface of the substrate.