Systems and methods are provided for logging temperatures of food products using a temperature assembly including a housing and one or more temperature sensors, e.g., an infrared sensor for surface temperatures and an elongate probe for acquiring a temperature within a food product, and a mobile electronic device including a camera, a communication interface for communicating with the temperature assembly, a processor configured to acquire a temperature reading from the temperature assembly and an image from the camera when the temperature reading is acquired, and memory for storing the temperature reading and image.

A lens allows infrared light to pass therethrough. An infrared sensor includes infrared detection elements arranged in two or more columns. The infrared sensor is rotated around a scan rotation axis that passes through part of the lens to scan a detection range, and outputs an output signal indicating a thermal image of the detection range. At least two infrared detection elements in the infrared sensor are located at positions displaced from each other with respect to the scan rotation axis. Among the infrared detection elements, the number of first infrared detection elements having a smaller half-width of a point spread function in a scan direction than that in the direction of the scan rotation axis is larger than the number of second infrared detection elements having a larger half-width of a point spread function in the scan direction than that in the direction of the scan rotation axis.

An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.

An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.

Systems, methods, and apparatus for providing electromagnetic radiation sensing. The apparatus includes a radiation detection sensor including a plurality of micromechanical radiation sensing pixels having a reflecting top surface and configured to deflect light incident on the reflective surface as a function of an intensity of sensed radiation. In some implementations, the apparatus has equal sensitivities for at least some of the sensing pixels. In some implementations, the apparatus can provide adjustable sensitivity and measurement range. The apparatus can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

A windowless microbolometer for use in terrestrial applications and non-terrestrial applications is provided. The windowless microbolometer array may interact with a flow of gas such that a pixel-based image of the gas is generated when the flow of gas impinges upon the windowless microbolometer array. The windowless microbolometer array may also interact with a molecular beam to provide information related to density, shape, and propagation of the molecular beam.

A windowless microbolometer for use in terrestrial applications and non-terrestrial applications is provided. The windowless microbolometer array may interact with a flow of gas such that a pixel-based image of the gas is generated when the flow of gas impinges upon the windowless microbolometer array. The windowless microbolometer array may also interact with a molecular beam to provide information related to density, shape, and propagation of the molecular beam.

A MEMS device includes a bolometer attached to a silicon wafer by a base portion of at least one anchor structure. The base portion comprises a layer stack having a metal-insulator-metal (MIM) configuration such that the base portion acts as a resistive switch such that, when the first DC voltage is applied to the patterned conductive layer, the base portion transitions from a high resistive state to a low resistive state, and, when the second DC voltage is applied to the patterned conductive layer, the base portion transitions from a high resistive state to a low resistive state.

A method for aligning a projected beam on a reflector in a reflective-type beam detector, the method including adjusting the projected beam so as to: project on to substantially all, if not all, of a reflective surface of the reflector; or project on to at least a portion of a reflective surface of the reflector until a constant, or within a predetermined threshold of a constant, signal is received from the reflector; and detecting one or more edges of the reflective surface of the reflector and thereby: centering the projected beam, so as to align an approximate center of the projected beam on, or within a predetermined threshold of, an approximate center of the reflective surface of the reflector; and/or determining a shape or profile of the reflector.

Embodiments disclosed herein generally relate to a substrate temperature monitoring system in a substrate support assembly. In one embodiment, the substrate support assembly includes a support plate and a substrate temperature monitoring system. The support plate has a top surface configured to support a substrate. The substrate temperature monitoring system is disposed in the substrate support plate. The substrate temperature monitoring system is configured to measure a temperature of the substrate from a bottom surface of the substrate. The substrate temperature monitoring system includes a window, a body, and a temperature sensor. The window is integrally formed in a top surface of the support plate. The body is embedded in the support plate, through the bottom surface. The body defines an interior passage. The temperature sensor is disposed in the interior passage beneath the window. The temperature sensor is configured to measure the temperature of the substrate.