A method makes an electromagnetic radiation detecting device including at least one thermal detector with an absorbent membrane suspended above a substrate, intended to be located in a sealed cavity. The method includes depositing, on the substrate, a gettering metallic layer including a metallic material with a gettering effect; depositing a carbonaceous sacrificial layer of amorphous carbon on the gettering metallic layer; depositing at least one sacrificial mineral layer on the carbonaceous sacrificial layer; chemical-mechanical planarization of the sacrificial mineral layer; fabricating the thermal detector so that the absorbent membrane is produced on the sacrificial mineral layer; removing the sacrificial mineral layer; and removing the carbonaceous sacrificial layer.

A bolometric detection device includes a substrate having a read-out circuit. The device also includes an array of elementary detectors each including a membrane suspended above the substrate and connected to the read-out circuit by at least two electric conductors. The membrane has two electrically-conductive electrodes respectively connected to the two electric conductors, and a volume of transducer material electrically connecting the two electrodes. The read-out circuit is configured to apply an electrical stimulus between the two electrodes of the membrane and to form an electric signal as a response to said application. The volume includes a volume of a first transducer material electrically connecting the two electrodes of the membrane and forming walls of a closed enclosure having each of the electrodes at least partially housed therein; and a volume of a second transducer material, electrically connecting the two electrodes and housed in the enclosure, the electric resistivity of the second material being smaller than the electric resistivity of the first material; and the two transducer materials having a negative thermal coefficient of resistivity TCR.

A bolometric detection device includes a substrate having a read-out circuit. The device also includes an array of elementary detectors each including a membrane suspended above the substrate and connected to the read-out circuit by at least two electric conductors. The membrane has two electrically-conductive electrodes respectively connected to the two electric conductors, and a volume of transducer material electrically connecting the two electrodes. The read-out circuit is configured to apply an electrical stimulus between the two electrodes of the membrane and to form an electric signal as a response to said application. The volume includes a volume of a first transducer material electrically connecting the two electrodes of the membrane and forming walls of a closed enclosure having each of the electrodes at least partially housed therein; and a volume of a second transducer material, electrically connecting the two electrodes and housed in the enclosure, the electric resistivity of the second material being smaller than the electric resistivity of the first material; and the two transducer materials having a negative thermal coefficient of resistivity TCR.

Methods and systems for performing non-contact temperature measurements of optical elements with long wavelength infrared light are described herein. The optical elements under measurement exhibit low emissivity to long wavelength infrared light and are often highly reflective or highly transmissive to long wavelength infrared light. In one aspect, a material coating having high emissivity, low reflectivity, and low transmission at long wavelength IR wavelengths is disposed over selected portions of one or more optical elements of a metrology or inspection system. The locations of the material coating are outside the direct optical path of the primary measurement light employed by the metrology or inspection system to perform measurements of a specimen. Temperature measurements of the front and back surfaces of an IR-transparent optical element are performed with a single IR camera. Temperature measurements are performed through multiple optical elements in an optical path of a primary measurement beam.

Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.

A terahertz-wave detector having a thermal separation structure in which a temperature detection unit 14 including a bolometer thin film 7 connected to electrode wiring 9 is supported so as to be lifted above a substrate 2 by a support part 13 including the electrode wiring 9 connected to a reading circuit 2a formed on the substrate 2, wherein the terahertz-wave detector is provided with a reflective film 3 that is formed on the substrate 2 and reflects terahertz waves and an absorption film 11 that is formed on the temperature detection unit 14 and absorbs terahertz waves and the reflective film 3 is integrally formed with the reflective film of an adjacent terahertz-wave detector.

A bolometer includes a first electrode, a second electrode sandwiching a meandering interelectrode region with the first electrode, and a sensor portion including a carbon nanotube film that is electrically connected to the first electrode and the second electrode and is provided in the interelectrode region.

Disclosed is a thermal infrared detector including: an infrared detection unit provided on a surface of a substrate; a peripheral circuit provided in such a way as to surround the infrared detection unit on the surface of the substrate; a sealing part provided for the peripheral circuit in such a way as to surround the infrared detection unit; a sealing window provided on the sealing part, and forming an internal space in a sealed state for accommodating the infrared detection unit, together with the substrate, the peripheral circuit, and the sealing part; an infrared absorption film to cover at least surface portions inside the sealing part, out of surfaces of the peripheral circuit; and a heat waste wire provided inside the peripheral circuit, and thermally connecting between the substrate and the infrared absorption film.

An optical sensor includes a support film, a thermoelectric conversion material portion, a heat sink, a light absorption film, a first electrode, and a second electrode. The thermoelectric conversion material portion includes a plurality of first material layers and a plurality of second material layers. The support film includes a first layer arranged on the heat sink side in a thickness direction and configured with a phononic structure having a large number of holes, and an insulating second layer arranged on the first layer and in contact with the thermoelectric conversion material portion.

An electromagnetic wave sensor has electromagnetic wave absorbers disposed side by side in first and second directions, temperature detection portions held by the respective electromagnetic wave absorbers and sets of two arm portions connected to each of the electromagnetic wave absorbers at two connection portions. In a plan view, the arm portions have two first extending portions extending from the connection portions in directions of which components in the second direction are opposite to each other, and two second extending portions extending from the first extending portions in directions of which components in the first direction are opposite to each other. Four sides of a rectangle circumscribing each of the electromagnetic wave absorbers with a smallest area are inclined with respect to the first direction in directions in which each of the electromagnetic wave absorbers approaches the second extending portions with the connection portions as fulcrums.