A method of manufacturing 3D objects with an apparatus having first and second heat sources and a thermal sensor. The method includes carrying out a build process after a thermal calibration process for a thermal control component(s). The calibration and build processes include a layer cycle including (i) providing a layer of particulate material defining a build bed surface; (ia) heating the surface; (ii) depositing absorption modifier over a layer-specific region and/or a surrounding area; (iii) heating the layer-specific region with the first heat source; and (iv) measuring a temperature of the surface after at least one of (i) to (iii). The layer cycle includes heating the surface of each layer with the second heat source and repeating until the calibration/build processes are complete. The outcome of each calibration routine being based on the measured temperature and being applied to the thermal control component for the subsequent layer cycle.

A method of manufacturing 3D objects in an apparatus having a thermal sensor, a stationary heat source and one or more further heat sources. The method includes a warm up and a build process; each processing multiple layers by a layer cycle. The layer cycles include (a) providing build bed surface of particulate material; (b) heating the surface using the stationary or a first moving heat source; (b1) depositing absorption modifier (absorber) over one or more layer-specific regions and/or depositing absorption modifier (inhibitor) over a surrounding area; (c) heating the surface by the first or a second moving heat source; and (d) measuring the temperature of the surface after (a) and/or (b) and/or (c). During one or more of (a) to (c), heating the surface to a target temperature, such that (c) causes the layer-specific region of each layer to melt and form a portion of the 3D object.

Provided is a long-wave infrared (LWIR) sensor including a substrate, a magnetic resistance device on the substrate, and an LWIR absorption layer on the magnetic resistance device, wherein a resistance of the magnetic resistance device changes based on temperature, and wherein the LWIR absorption layer is configured to absorb LWIR rays and generate heat.

This infrared imaging device includes: an infrared transmission lens which collects infrared light emitted from an object; an infrared imaging element having a screen in which pixels for converting infrared light collected by the infrared transmission lens to electric signals are arranged in a two-dimensional array; a signal processing unit which converts electric signals from the infrared imaging element to digital signals; an optical characteristics correction unit which performs optical characteristics correction for an output of the signal processing unit on the basis of non-image-formation information set in advance for the infrared transmission lens; a reference temperature detection unit which detects a reference temperature; and a temperature measurement unit which performs absolute temperature conversion for the object on the basis of an output of the optical characteristics correction unit and an output of the reference temperature detection unit.

A device for measuring surface temperature of a turbine blade based on a rotatable prism includes a probe, a prism rotating apparatus and an optical focusing apparatus. The prism rotating apparatus and the optical focusing apparatus are located inside the probe. The probe includes a probe outer casing, a probe inner casing, a water-cooled casing pipe, a sapphire window piece, a quartz prism, a light pipe, a collimating lens, a focusing lens and an infrared array detector. The prism rotating apparatus includes a rotary motor, a worm, a gear and a prism rotary table, the rotary motor rotates to drive the prism rotary table to rotate. The optical focusing apparatus includes a telescopic motor, a coupler, a lead screw and a drive rod, the telescopic motor rotates to drive the lead screw, so as to further drive the drive rod to move along the slot.

A proximity sensor comprising: a loop comprising an outer surface and an inner surface, at least a portion of the inner surface being a reflective surface; a light emitter positioned to emit light onto the reflective surface; a light detector positioned to preferentially receive light emitted from the light emitter and reflected from the reflective surface; and a processor that is configured, responsive to a set of instructions stored in a memory, to determine a degree of proximity of an object to the inner surface of the loop responsive to a reduction in an intensity of light emitted from the light emitter that is received by the light detector.

One or more temperature measuring devices are described that comprise; thermal imaging cameras capable of detection and provision of an exact location of at least one created dynamic image scanned by and triangulated with at least two thermal imaging cameras, and a gate that provides a constrained targeted pathway through which at least one person must travel so that dynamic thermal data of the person is captured as the person is moving through the gate and wherein thermal imaging cameras are geometrically arranged in positions such that the thermal imaging cameras field of view exist on or within the gate and wherein the person is scanned and provides targeted dynamic thermal data that is converted into one or more temperature readings that measure and transmit the temperature readings from one or more photodetectors that sense thermal radiation naturally emitted by people passing through.

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.

Photothermal imaging systems and methods are disclosed that employ truncated-correlation photothermal coherence tomography (TC-PCT). According to the example methods disclosed herein, photothermal radiation is detected with an infrared camera while exciting a sample with the chirped delivery of incident laser pulses (where the pulses have a fixed width), and time-dependent photothermal signal data is obtained from the infrared camera and processed using a time-evolving filtering method employing cross-correlation truncation. The cross-correlation truncation method results in pulse-compression-linewidth-limited depth-resolved images with axial and lateral resolution well beyond the well-known thermal-diffusion-length-limited, depth-integrated nature of conventional thermographic and thermophotonic modalities. As a consequence, an axially resolved layer-by-layer photothermal image sequence can be obtained, capable of reconstructing three-dimensional visualizations (tomograms) of photothermal features in wide classes of materials. Additional embodiments are disclosed in which the aforementioned systems and methods are adapted to photo-acoustic and acousto-thermal imaging.

Systems, methods, and apparatus for providing an improved electromagnetic radiation sensing micromechanical device to be utilized in high pixel-density pixel sensor arrays. The device includes an improved design for improved and adjustable performance through simple geometric or fabrication means. Furthermore, the design of the device lends itself to simple micromechanical manufacturing procedures. Additionally, the manufacturing procedures include a method to enable high uniformity and high yield sensor arrays. Arrays of the device can be utilized as IR imaging detectors for use in applications such as human presence detection, nonvisual environment monitoring, security and safety, surveillance, energy monitoring, fire detection and people counting.