A temperature sensor device for a power distribution panel includes a Power over Ethernet (PoE) interface, a DC-to-DC step down converter, at least one infrared temperature sensor array, a microcontroller and a communication interface. The PoE interface is used to obtain a required power supply from the Ethernet network. The DC-to-DC step down converter steps down the power supply from a first voltage to a second voltage. The infrared temperature sensor array receives infrared rays radiated from a monitored area of the power distribution panel and generates a corresponding sensation signal. The microcontroller receives the sensation signal and generates an alert signal when the sensed temperature of the monitored area exceeds a preset threshold. The threshold can be dynamically adjusted according to time of day or day of months. The communication interface enables the communication between an external electronic device and the temperature sensor device for the power distribution panel.

A composite lens and a manufacturing method, and an infrared detector. The composite lens comprises a substrate (2); a lens (3) located on the first surface of the substrate (2); and a first metasurface structure array (1) that is provided on the second surface of the substrate (2) according to the surface type machining error of the lens (3), the first metasurface structure array (1) comprising a plurality of metasurface structure units. The first surface is opposite to the second surface. Because the lens (3) and the first metasurface structure array (1) are located on two different surfaces of the substrate (2), after the lens (3) is manufactured, the first metasurface structure array (1) can be set according to the surface type of the lens (3), so as to correct an aberration that is generated due to a surface type error when the lens (3) is machined; moreover, because the first metasurface structure array (1) can be set after the lens (3) is manufactured, the tolerance to a machining error is extremely high.

An integrated sensor assembly includes a housing having a rectangular shape, a front side having a length and width and including a plurality of openings, and a thickness significantly less than the length or the width of the front side. The assembly includes an infrared thermal sensor disposed in the housing and aligned with a first opening of the plurality of openings, a time-of-flight proximity sensor disposed in the housing and aligned with a second opening of the plurality of openings, and a color light sensor, disposed in the housing and aligned with the second opening of the plurality of openings, to respectively sense at least red light, green light, and blue light. The integrated sensor assembly does not include a narrowband irradiator to facilitate multispectral imaging of reflected or emitted radiation from at least one object in response to irradiation by the narrowband irradiator.

Disclosed is a short-wave infrared spectrum detector, including: a photosensitive chip, including a plurality of detection pixels; a substrate; and a wavelength division component array, including a plurality of wavelength division pixels, each of the plurality of wavelength division pixels corresponding to a narrowband transmission spectrum, wherein the photosensitive chip and the wavelength division component array are monolithically integrated on both sides of the substrate, and an orthographic projection of each of the plurality of wavelength division pixels on the substrate covers an orthographic projection of at least one detection pixel on the substrate. The wavelength division structure and the photosensitive chip are integrated, so that each pixel has the ability of frequency-selective light spectrum detection, and a short-wave infrared spectrum detector integrated with wavelength division and detection is formed, realizing the miniaturization of the short-wave infrared spectral detection system.

An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

A detector locator system comprising: an electromagnetic radiation (EMR) source array comprising a plurality of EMR sources; a detector apparatus comprising an EMR detector configured to detect an EMR signal emitted by the EMR sources, a wireless transceiver configured to transmit an ON signal responsive to the EMR detector receiving the EMR signal; a control unit configured to instruct the driver to control the EMR sources to turn on one at a time in an activation pattern, receive the ON signal, and designate, responsive to the ON signal, the EMR source that triggered the detection signal as a triggering EMR source.

A method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing with particularly small dimensions, consisting of at least two wafers, a cover wafer and a central wafer comprising multiple infrared-sensitive sensor pixels on a respective thin slotted membrane over a heat-insulating cavity is disclosed. A method for producing a high-resolution monolithic silicon micromechanical thermopile array sensor using wafer level packaging technology, wherein the sensor achieves a particularly high spatial resolution capability and a very high filling degree with very small housing dimensions, in particular a very low overall thickness, and can be inexpensively produced using standard CMOS processes. This is achieved in that the cover wafer is first rigidly mechanically connected to the provided central wafer comprising the sensor pixels with the infrared-sensitive pixels by means of wafer bonding, and the central wafer is then thinned out from the wafer rear face to a specified thickness.

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

Improved techniques for thermal imaging and gas detection are provided. In one example, a system includes a first set of filters configured to pass first filtered infrared radiation comprising a first range of thermal wavelengths associated with a background portion of a scene. The system also includes a second set of filters configured to pass second filtered infrared radiation comprising a second range of thermal wavelengths associated with a gas present in the scene. The first and second ranges are independent of each other. The system also includes a sensor array comprising adjacent infrared sensors configured to separately receive the first and second filtered infrared radiation to capture first and second thermal images respectively corresponding to the background portion and the gas. Additional systems and methods are also provided.

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.