A decoupling radiant and convective heat sensing device, and a decoupling radiant and convective heat sensing device with a means for performing calculations and then determining a heat flux and an ambient temperature using formulas or reference tables, and also with a means for alerting a person of hazardous fire conditions based on a calculated heat flux and ambient temperature.

A decoupling radiant and convective heat sensing device, and a decoupling radiant and convective heat sensing device with a means for performing calculations and then determining a heat flux and an ambient temperature using formulas or reference tables, and also with a means for alerting a person of hazardous fire conditions based on a calculated heat flux and ambient temperature.

There is provided a method for preparing an analytical sample by fusion. A mixture of a sample and flux material is heated and stirred, in a crucible, at a temperature sufficient to fuse the mixture and obtain a substantially homogeneous fused mixture; a first portion of heat radiation radiating from the crucible is reflected back to the crucible so as to provide additional heat to fuse the mixture, while heating and stirring the mixture; and the homogeneous fused mixture, is subsequently cooled, thereby forming the analytical sample.

An electronic device according to various exemplary embodiments of the present disclosure includes: a motion sensor; a temperature sensor configured to acquire temperature information on an external object; an image sensor configured to acquire an image on the external object; and a processor, and the processor is configured to: identify a motion of the electronic device and a motion of the external object using the motion sensor or the image; when the motion falls within a specified range, acquire the temperature information in a first method; when the motion falls within another specified range, acquire the temperature information in a second method; and provide an indicator corresponding to the temperature information through a display functionally connected with the electronic device.

A thermoelectric conversion material is represented by a composition formula Ag.sub.2-xα.sub.xS, where α is one selected from among Ni, V, and Ti. The value of x is greater than 0 and smaller than 0.6.

A thermoelectric conversion material is represented by a composition formula Ag.sub.2-xα.sub.xS, where α is one selected from among Ni, V, and Ti. The value of x is greater than 0 and smaller than 0.6.

A thermoelectric conversion material is represented by a composition formula Ag.sub.2S.sub.(1-x)Se.sub.x. The value of x is not smaller than 0.2 and not greater than 0.95.

A thermoelectric conversion material is represented by a composition formula Ag.sub.2S.sub.(1-x)Se.sub.x. The value of x is not smaller than 0.2 and not greater than 0.95.

A device for detecting infrared radiation emanating from a subject while not in physical contact with the subject. The device includes a body, an infrared sensor located in the body oriented to receive the infrared radiation and to generate at least one output that corresponds to the received infrared radiation, an analog to digital converter in communication with the infrared sensor to receive the at least one output, a processor in communication with the analog to digital converter or infrared sensor to process an output of the analog to digital converter or the output of the infrared sensor, into a computed temperature of the subject, wherein the processor adjusts the computed temperature based on an emissivity of the subject, a memory module to store a first plurality of computed temperatures in a predetermined sequence; and a filter module to select a first maximum from among the first plurality of computed temperatures.

Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.