Patent classifications
G01J5/40
PASSIVE DETECTORS FOR IMAGING SYSTEMS
Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.
PASSIVE DETECTORS FOR IMAGING SYSTEMS
Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.
Micromechanical device for electromagnetic radiation sensing
Systems, methods, and apparatus for providing an improved electromagnetic radiation sensing micromechanical device to be utilized in high pixel-density pixel sensor arrays. The device includes an improved design for improved and adjustable performance through simple geometric or fabrication means. Furthermore, the design of the device lends itself to simple micromechanical manufacturing procedures. Additionally, the manufacturing procedures include a method to enable high uniformity and high yield sensor arrays. Arrays of the device can be utilized as IR imaging detectors for use in applications such as human presence detection, nonvisual environment monitoring, security and safety, surveillance, energy monitoring, fire detection and people counting.
Micromechanical device for electromagnetic radiation sensing
Systems, methods, and apparatus for providing an improved electromagnetic radiation sensing micromechanical device to be utilized in high pixel-density pixel sensor arrays. The device includes an improved design for improved and adjustable performance through simple geometric or fabrication means. Furthermore, the design of the device lends itself to simple micromechanical manufacturing procedures. Additionally, the manufacturing procedures include a method to enable high uniformity and high yield sensor arrays. Arrays of the device can be utilized as IR imaging detectors for use in applications such as human presence detection, nonvisual environment monitoring, security and safety, surveillance, energy monitoring, fire detection and people counting.
Ultrasensitive Thermo-Mechanical Bolometer
A thermo-mechanical bolometer includes a substrate and a sensing component mounted on the substrate. The sensing element comprises (a) at least one thermal-actuation component mounted in parallel with the substrate and (b) a strain sensor mounted on the at least one layer of thermal-actuation component. The at least one thermal-actuation component alone or in combination (a) absorbs electromagnetic waves and converts energy from absorbed electromagnetic waves into a change in temperature and (b) converts the change in temperature into a deformation of the at least one layer. The strain sensor comprises a layer of fragments with a gap space between the fragments, wherein the strain sensor senses the deformation or mechanical movement and exhibits a change in electrical resistance in response to the sensed deformation or mechanical movement.
Micro mirror arrays for measuring electromagnetic radiation
A radiation imaging apparatus includes an imaging surface; a light source; and an array of micro mirrors that rotate via radiation absorbed in the micro mirrors and reflect light from the light source to generate a distribution of reflected light on the imaging surface. The array first micro mirrors and second micro mirrors. The first micro mirrors have a first structure and the second micro mirrors have a second structure different than the first structure. The second structure is configured to correct for one or more environmental influences on the radiation imaging apparatus. A photodetector captures an image of the distribution of reflected light on the imaging surface. A processor is coupled to the photodetector. A communication interface is coupled with the processor; and a computing device is located separately from the radiation imaging apparatus and in communication with the communication interface.
Apparatus and method for electromagnetic radiation sensing
Systems, methods, and apparatus for providing electromagnetic radiation sensing. The apparatus includes a radiation detection sensor including a plurality of micromechanical radiation sensing pixels having a reflecting top surface and configured to deflect light incident on the reflective surface as a function of an intensity of sensed radiation. In some implementations, the apparatus has equal sensitivities for at least some of the sensing pixels. In some implementations, the apparatus can provide adjustable sensitivity and measurement range. The apparatus can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.
Apparatus and method for electromagnetic radiation sensing
Systems, methods, and apparatus for providing electromagnetic radiation sensing. The apparatus includes a radiation detection sensor including a plurality of micromechanical radiation sensing pixels having a reflecting top surface and configured to deflect light incident on the reflective surface as a function of an intensity of sensed radiation. In some implementations, the apparatus has equal sensitivities for at least some of the sensing pixels. In some implementations, the apparatus can provide adjustable sensitivity and measurement range. The apparatus can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.
Apparatus and Method to Adjust Sensitivity in Measuring Electromagnetic Radiation Using Micro Mirrors
Systems, methods, and apparatuses having an array of micro mirrors that rotate according to absorbed radiation and reflect light to generate light spots. In a first setting, a processor obtains an image of the light spots, determines positions of the light spots using a computationally efficient but less accurate method to calculate the intensities of radiation directed at the micro mirrors, and provides the calculated radiation. In a second setting, the processor does not determines the position; and the image is transmitted to a separate computing device to determine positions of the light spots using a computationally intensive but more accurate method to calculate the intensities of radiation directed at the micro mirrors. The system can dynamically switch between the first setting and second setting without a need to adjust hardware.
INFRARED PIXEL STRUCTURE, MANUFACTURING METHOD THEREOF AND HYBRID IMAGE DEVICE
The present invention provides an infrared pixel structure and a hybrid imaging device which use comb-shaped top plates and bottom plates to form capacitors. The upper electrode has a non-fixed end such that the infrared sensitive element in the upper electrode generates thermal stress and deforms when absorbing the infrared light, which changes the capacitance of the capacitors formed by the top plates and the bottom plates to achieve infrared detection and increase the device sensitivity. Furthermore, the infrared pixel structure can be used in an infrared light and visible light hybrid imaging device to achieve visible light imaging and infrared imaging in a same silicon substrate, so as to increase the imaging quality.