Passive detector structures for imaging systems are provided, which are based on a coefficient of thermal expansion (CTE) framework. For example, an imaging device includes a substrate, and a photon detector disposed over a surface of the substrate. The photon detector comprises a stack of thin film layers including a resonator member and an unpowered detector member. The resonator member generates an output signal having a frequency or period of oscillation. The unpowered detector member has a CTE, which causes the unpowered detector member to expand or contract due to thermal heating resulting from photon exposure, and apply a mechanical force to the resonator member. The mechanical force causes a change in the frequency or period of oscillation of the output signal generated by the resonator member, wherein the change in the frequency or period of oscillation is utilized to determine an amount of photon exposure of the photon detector.

Passive detector structures for imaging systems are provided, which are based on a coefficient of thermal expansion (CTE) framework. With such framework, a CTE-based passive detector structure includes a detector member that is configured to expand or contract in response to thermal heating resulting from photon exposure. The expanding/contracting CTE detector structure is configured to exert mechanical forces on resistor and/or capacitor circuit elements, which are part of an oscillator circuit, to vary the resistance and capacitance of such circuit elements and change a frequency or period of oscillation of an output signal of the oscillator circuit. The change in the frequency or period of oscillation of the output signal of the oscillator circuit is utilized to determine an amount of photon exposure of the CTE-based detector.

A nano-electro-mechanical systems (NEMS) oscillator can include an insulating substrate, a source electrode and a drain electrode, a metal local gate electrode, and a micron-sized, atomically thin graphene resonator. The source electrode and drain electrode can be disposed on the insulating substrate. The metal local gate electrode can be disposed on the insulating substrate. The graphene resonator can be suspended over the metal local gate electrode and define a vacuum gap between the graphene resonator and the metal local gate electrode.

Systems and methods for an optomechanical thermal imager in accordance with embodiments of the invention are illustrated. One embodiment includes an optomechanical thermal imager. The optomechanical thermal imager includes at least one optomechanical thermal sensor, wherein the optomechanical thermal sensor includes a deformable structure configured to receive infrared radiation and undergo a mechanical deformation in response to thermal energy from the radiation, an optical resonator mechanically coupled to the deformable structure and configured to shift in resonance condition in response to the deformation, and a probe source configured to emit light toward the optical resonator at a wavelength near the resonance condition. The optomechanical thermal imager further includes a detector configured to receive light from the optical resonator and generate an output based on a shift in the resonance condition associated with the received infrared radiation.

Systems and methods for an optomechanical thermal imager in accordance with embodiments of the invention are illustrated. One embodiment includes an optomechanical thermal imager. The optomechanical thermal imager includes at least one optomechanical thermal sensor, wherein the optomechanical thermal sensor includes a deformable structure configured to receive infrared radiation and undergo a mechanical deformation in response to thermal energy from the radiation, an optical resonator mechanically coupled to the deformable structure and configured to shift in resonance condition in response to the deformation, and a probe source configured to emit light toward the optical resonator at a wavelength near the resonance condition. The optomechanical thermal imager further includes a detector configured to receive light from the optical resonator and generate an output based on a shift in the resonance condition associated with the received infrared radiation.

A light sensor includes a vibration actuator configured to generate vibration on the basis of an input signal, a resonator having a doubly-clamped beam formed in a MEMS structure using a silicon material, configured to vibrate on the basis of the vibration transmitted by the vibration actuator and having a resonant frequency that changes in response to input of light, and a vibration detector configured to detect vibration of the doubly-clamped beam.

A light sensor includes a vibration actuator configured to generate vibration on the basis of an input signal, a resonator having a doubly-clamped beam formed in a MEMS structure using a silicon material, configured to vibrate on the basis of the vibration transmitted by the vibration actuator and having a resonant frequency that changes in response to input of light, and a vibration detector configured to detect vibration of the doubly-clamped beam.

Systems and methods for measuring a temperature using an optical whispering gallery mode (WGM) resonator are disclosed. The system includes a WGM resonator operatively coupled to a tunable laser source and a detector, as well as a computing device. The computing device is configured to transform a transmission spectrum from the detector into a measured barcode that includes a matrix of values indicative of at least one characteristic of the transmission spectrum. The computing device is further configured to transform the measured barcode into a temperature based on a relative collective shift of the measured barcode from a reference barcode selected from a predetermined library of reference barcodes.

Systems and methods for measuring a temperature using an optical whispering gallery mode (WGM) resonator are disclosed. The system includes a WGM resonator operatively coupled to a tunable laser source and a detector, as well as a computing device. The computing device is configured to transform a transmission spectrum from the detector into a measured barcode that includes a matrix of values indicative of at least one characteristic of the transmission spectrum. The computing device is further configured to transform the measured barcode into a temperature based on a relative collective shift of the measured barcode from a reference barcode selected from a predetermined library of reference barcodes.