The present invention relates to an intelligent flame detection apparatus and method using an infrared thermogram, which combine a conventional flame detector with an infrared thermographic camera and an infrared thermogram processing technology, and which enable whether a flame signal received from a flame sensor is an allowed flame or an artificial flame to be accurately detected, thereby improving the accuracy of fire alarms.

A temperature distribution learning apparatus learns a temperature distribution including a temperature at at least a first point in air of a target space. The temperature distribution learning apparatus includes a learning model. The learning model learns the temperature distribution, which is an objective variable, and a thermal image, which is an explanatory variable and is related to the target space, in association with each other. The learning model learns based training data including the temperature distribution and the thermal image.

A method of detecting damage to a gas turbine engine, the method including observing a thermal response of the engine during a thermal transition occurring when the engine transitions between an elevated temperature and a lesser temperature; determining potential damage to the gas turbine engine based on the observed thermal response of the gas turbine engine; and generating an action in response to the determined potential damage to the gas turbine engine.

Provided is a temperature sensor configured to fit under a seat of a toilet that measures a temperature of a user of the toilet or feces expelled by the user without contacting the user or feces. Also provided is a temperature sensor configured to fit on a bathroom appliance that measures a temperature of a user of the appliance without contacting the user. Additionally provided is a temperature sensor configured to fit on a toilet seat that measures a temperature of skin contacting the seat. Further provided is a method of measuring temperature of a bathroom user, the method comprising using any of the above-described temperature sensors to measure the user's temperature.

The invention offers high resolution and accuracy for nanoscale device characterization from ultraviolet through microwave wavelengths. Instead of collecting light after emission in near-field that decays to far-field, the present invention directly couples the near-field waves to a polaritonic-coated probe. The polaritonic coating can be formed on an wavelength tuned optical fiber to receive the coupled emission and form polaritons, including plasmons, phonons, and magnons, using the polaritonic material. The polaritons propagate along the probe decay back into the fiber core without substantial losses to far-field and are transmitted to a detector, such as a spectroscope. The coupling of the near-field energy to emission detected through the tip apex of fiber can be expressed as emission spectra. Through mapping with other spatial points, multi-dimensional displays and other information can be provided. The resolution can be less than 100 nanometers, including an order of magnitude less than 100 nanometers.

A multi-sensor threat detection system and method for elevated temperature detection using commodity-based thermal cameras and mask wearing compliance using optical cameras. The proposed method does not rely on the accuracy of thermal cameras, but the combination of mathematics, statistics, machine learning, artificial intelligence, computer vision and Manifold learning to construct a classifier, or set of classifiers, that are able to, either alone or working as an ensemble, evaluate a person as being ‘normal temperature’ or ‘elevated temperature’ by virtue of ‘how they present to the camera’ vs. any absolute temperature measurements from the camera itself.

A solar module detection system is provided. The solar module detection system includes a visible light image capturing device, a thermal image capturing device, a carrier, and a host. The visible light image capturing device captures a visible light image of a solar module along a moving path. The thermal image capturing device captures a thermal image of the solar module along the moving path. The carrier carries the visible light image capturing device and the thermal image capturing device and moves the visible light image capturing device and the thermal image capturing device according to the moving path. The host identifies a thermal abnormality condition of the solar module from the thermal image, determines a defect type of the thermal abnormality condition according to the visible light image, and displays the thermal abnormality condition and the defect type.

Apparatus and methods for detecting a characteristic of a ground engaging product on earth working equipment are described. The apparatus is operable to: measure a temperature profile at a ground engaging product location; compare the measured temperature profile with an expected temperature profile for that ground engaging product; and indicate a characteristic of the ground engaging product based on the comparison. Thermal inserts for use with ground engaging products on earth working equipment are also described.

Thermal imaging systems are provided. An example thermal imaging system includes an infrared (IR) imager that acquires IR image data of a field of view of the IR imager. The thermal imaging system further includes video analysis circuitry operably coupled to the IR imager. The video analysis circuitry receives first temperature data of a first field reference within the field of view of the IR imager, receives second temperature data of a second field reference within the field of view of the IR imager, and receives IR image data from the IR imager. The video analysis circuitry calibrates the IR imager based upon the first temperature data, the second temperature data, and the IR image data. The thermal imaging system may further include a temperature control chamber enclosing the IR imager and configured to thermally isolate the IR imager and temperature sensors thermally coupled to the IR imager.

An inspection method includes applying a laser beam to a semiconductor chip to reflow a bump disposed on a surface of the semiconductor chip and included in an irradiation range of the workpiece, the laser beam being applied from an opposite surface of the semiconductor chip, capturing an image of the irradiation range with use of a thermal camera while the laser beam is applied to the semiconductor chip, and acquiring temperature information regarding the semiconductor chip from the captured image, storing in advance reference temperature information that represents temperature information obtained when the semiconductor chip and the board have normally been bonded to each other by the laser beam applied thereto, and determining whether or not the semiconductor chip and the board have normally been bonded to each other by the laser beam applied thereto, on the basis of the reference temperature information and the temperature information.