A temperature measurement system for measuring a temperature of a measured surface includes: 1) a first temperature sensor; and 2) a reference surface including a second temperature sensor integrated therein. The first temperature sensor includes a field of view simultaneously covering both at least a portion of the measured surface and at least a portion of the reference surface, thus is configured for simultaneously taking a first measurement of both the portion of the measured surface and the portion of the reference surface. The first measurement of the reference surface taken by the first temperature sensor is compared to a second measurement taken by the second temperature sensor for use in calibrating the first temperature sensor.

FPAs on a wafer can be tested prior to dicing the wafer into individual dies. A focal plane array (FPA) can comprise an array of photodetectors, such as microbolometers, on a semiconductor substrate or die. FPAs can be manufactured on a wafer to make multiple FPAs on a single wafer that can be later diced or divided into individual FPAs. Prior to dicing the wafer, the FPAs can be tested electrically and radiometrically in bulk to characterize individual FPAs, to identify bad pixels, to identify bad chips, to calibrate individual FPAs, and the like. These test results can be used to determine acceptable FPAs and can be used to provide initial settings for imaging systems with the tested and integrated FPA.

The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

A black body radiation device is provided, which can be used as a benchmark heat source for “thermal imager” temperature detection device. The black body radiation device includes: a heat source module comprising a heater and a temperature equalizing plate, wherein the temperature equalizing plate contacts the heater; a temperature control module connected to the heater to control the heater, thereby keeping the temperature equalizing plate at a predetermined temperature; and a housing configured to accommodate the heat source module and the temperature control module, the housing having an opening, wherein the opening is configured to expose the temperature equalizing plate.

A cavity blackbody radiation source is provide. The cavity blackbody radiation source comprises a blackbody radiation cavity and a carbon nanotube composite material. The blackbody radiation cavity comprises an inner surface. The carbon nanotube composite material is located on the inner surface. The carbon nanotube composite material comprises a black lacquer and a plurality of carbon nanotubes, and the plurality of carbon nanotubes is in an upright state in the black lacquer.

A cavity blackbody radiation source is provide. The cavity blackbody radiation source comprises a blackbody radiation cavity and a carbon nanotube composite material. The blackbody radiation cavity comprises an inner surface. The carbon nanotube composite material is located on the inner surface. The carbon nanotube composite material comprises a black lacquer and a plurality of carbon nanotubes, and the plurality of carbon nanotubes is in an upright state in the black lacquer.

A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

A method and apparatus for calibration non-contact temperature sensors within a process chamber are described herein. The calibration of the non-contact temperature sensors includes the utilization of a band edge detector to determine the band edge absorption wavelength of a substrate. The band edge detector is configured to measure the intensity of a range of wavelengths and determines the actual temperature of a substrate based off the band edge absorption wavelength and the material of the substrate. The calibration method is automated and does not require human intervention or disassembly of a process chamber for each calibration.

A method and apparatus for calibration non-contact temperature sensors within a process chamber are described herein. The calibration of the non-contact temperature sensors includes the utilization of a band edge detector to determine the band edge absorption wavelength of a substrate. The band edge detector is configured to measure the intensity of a range of wavelengths and determines the actual temperature of a substrate based off the band edge absorption wavelength and the material of the substrate. The calibration method is automated and does not require human intervention or disassembly of a process chamber for each calibration.

A method of estimating non-linearity in a response of an optical detector comprises emitting optical radiation at different intensities. The method includes, at each intensity: amplitude modulating the emitted optical radiation at a modulating frequency to produce amplitude modulated optical radiation; detecting the amplitude modulated optical radiation with the optical detector to produce a detected waveform; and generating a Fourier transform of the detected waveform that includes a fundamental frequency equal to the modulating frequency and harmonics thereof. The method further includes estimating the non-linearity in the response of the optical detector based on a change in an amplitude of a second harmonic of the fundamental frequency relative to an amplitude of the fundamental frequency across the Fourier transforms corresponding to the different intensities.