G01J5/802

Planck Spectrometer
20220187134 · 2022-06-16 ·

An optical spectrometer uses broadband radiation detectors to measure thermal radiation generated by the varied heating of an object without complex mechanical mechanisms, narrowband filters, or the like. The received thermal radiation is used to deduce spectral qualities of either the thermal radiation emitter or a second object reflecting or transmitting this thermal radiation.

METHOD AND CONTROL ARRANGEMENT FOR DETECTING A HEALTH CONDITION OF AN ANIMAL
20220167594 · 2022-06-02 ·

A method, controller, computer program, and computer program product are provided for determining a health condition of an animal by capturing a thermographic image of at least one portion of the animal and capturing a visible light image of the at least one portion of the animal, the visible light image corresponding to the thermographic image. The method further includes determining at least one surface property of the at least one portion of the animal based on the visible light image, adjusting the thermographic image to compensate for impact of the determined at least one surface property, and determining the health condition of the animal based on the adjusted thermographic image.

TEMPERATURE MEASUREMENT METHOD AND HEAT TREATMENT APPARATUS
20230274959 · 2023-08-31 ·

A temperature measurement method includes: a radiation temperature measurement step for detecting a brightness temperature of a semiconductor wafer from obliquely below the semiconductor wafer; an input parameter calculation step for calculating at least two input parameters from the brightness temperature detected in the radiation temperature measurement step, the at least two input parameters including a first input parameter corresponding to an emissivity ratio of the semiconductor wafer and a second input parameter corresponding to a temperature of the semiconductor wafer; an output parameter estimation step for estimating an output parameter from the first input parameter and the second input parameter; and a temperature calculation step for calculating the temperature of the semiconductor wafer from the output parameter estimated in the output parameter estimation step and the brightness temperature detected in the radiation temperature measurement step.

Solar Radiation Heat Sensor Device and Solar Radiation Heat Measuring Method
20220146709 · 2022-05-12 ·

A solar radiation heat sensor device includes: a black plate having a black surface; a silver plate having a silvery-white surface; a casing that supports the black plate and the silver plate in such a manner as to be exposed to an outside with the black surface and the silvery-white surface facing the same direction; a thermistor which is accommodated in the casing and is configured to measure temperatures of each of the black plate and the silver plate; and a processor configured to calculate a solar radiation heat amount based on a difference between the temperature of the black plate and the temperature of the silver plate, the temperatures being measured by the thermistor.

SYSTEMS AND METHODS FOR MEASURING TEMPERATURE
20230243704 · 2023-08-03 ·

Systems and methods disclosed herein use a multi-color pyrometer configured to determine a first temperature in a high temperature range and a single-color pyrometer configured to determine second temperature in a low temperature range. The system uses information gained from determination of the first temperature in the high temperature range to facilitate later determining the second temperature in the low temperature range. The first temperature in the high temperature range and the second temperature in the low temperature range are used to monitor and control different engine operations that occur at different times.

Device and method for measuring oxide film thickness

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.

CALIBRATION METHOD FOR TEMPERATURE MEASUREMENT DEVICE, CALIBRATION DEVICE FOR TEMPERATURE MEASUREMENT DEVICE, CALIBRATION METHOD FOR PHYSICAL QUANTITY MEASUREMENT DEVICE, AND CALIBRATION DEVICE FOR PHYSICAL QUANTITY MEASUREMENT DEVICE
20220018717 · 2022-01-20 · ·

A calibration method for a temperature measurement device, the method including: measuring dispersed spectrum information of radiation energy from a black body furnace and dark current data with a first temperature measurement device and with a second temperature measurement device that is to be swapped with the first temperature measurement device, at each of a plurality of different temperatures; generating, using information thus measured, a second temperature measurement value to be measured by a second contact thermometer included in the second temperature measurement device, and a second dispersed spectrum information corresponding to the second temperature measurement value, from a first temperature measurement value measured by a first contact thermometer included in the first temperature measurement device and a first dispersed spectrum information corresponding to the first temperature measurement value; and determining, using the information thus generated, the basis spectrum and the calibration line for the second temperature measurement device.

DEVICE AND METHOD FOR MEASURING OXIDE FILM THICKNESS

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.

METHODS AND APPARATUS FOR IMPROVED THERMAL MONITORING BY CORRELATING INFRARED EMISSIVITY TO SURFACE TOPOGRAPHY
20210356325 · 2021-11-18 ·

Embodiments of the present disclosure provide an improved method and apparatus for thermal monitoring for a metal additive manufacturing system. An emissivity value of a top surface of an object to be manufactured is determined based, at least in part, on an arithmetic product of a predetermined roughness value and a predetermined slope-related value. The predetermined roughness value and slope-related values are predetermined based, at least in part, on measurements of a previously manufactured object. The system sinters a metal to form the top surface of the object to be manufactured. An infrared sensor detects radiation from at least a portion of the top surface of the object to be manufactured. A temperature is generated based, at least in part, on the detected infrared radiation and the emissivity value and the generated temperature is applied to a temperature utilization component of the system.

Contactless parameters measurement system and method

A system for measuring temperature of one or more subjects within a scene including a reference object having an unknown emissivity, having an ambient temperature, the system comprising: a visible spectrum camera capable of acquiring images of the scene comprising (a) at least a Region of Interest (RoI) of each of the subjects, and (b) the reference object; a thermal image sensor capable of acquiring images of the scene comprising (a) at least the RoI of each of the subjects, and (b) the reference object; and a processing circuitry configured to: obtain (a) a visible spectrum image captured by the visible spectrum camera, and (b) a thermal image captured by the thermal image sensor, and (c) an indication of a scene ambient temperature within the scene; register the visible spectrum image and the thermal image onto a common coordinate system; identify (a) RoI pixels, on the common coordinate system, of the RoIs of the subjects within the visible spectrum image, (b) reference object pixels, on the common coordinate system, of the reference object within the visible spectrum image and (c) a parameter correlated to an emissivity of the reference object, based on the reference temperature and on the indication of the scene ambient temperature; determine (a) RoI temperatures by analyzing respective RoIs pixels on the thermal image, and (b) a reference temperature by analyzing the reference object pixels on the thermal image; and upon existence of a difference between the reference temperature and the scene ambient temperature, correct the RoI temperatures, based on the difference and utilizing the parameter, to compensate for the difference, giving rise to corrected RoI temperatures.