A temperature sensor including a connection part that makes it possible to restrain a mechanical damage to an electrical wire, particularly, to an insulating covering, with little man-hours. The object is achieved by a temperature sensor including: a sensor element including a heat-sensitive body, a pair of electrical wires electrically connected with the heat-sensitive body, and a protective body covering the heat-sensitive body and a part of the pair of electrical wires; a holding body for the sensor element; and a fixing pipe covering a periphery of the pair of electrical wires and the holding body and being capable of expanding and contracting.

A sensor assembly includes a housing defining a potting chamber and arranged along a sensor axis, a mounting flange extending about the sensor axis the axially offset along the sensor axis from the housing, and one or more intermediate flange. The one or more intermediate flange is arranged between the housing and the mounting flange along the sensor axis, the one or more intermediate flange coupling the mounting flange to the housing. The one or more intermediate flange is spaced apart from mounting flange to limit thermal communication between the mounting flange and the housing. Gas turbine engines and methods of cooling sensor assemblies are also described.

A sensor assembly includes a housing defining a potting chamber and arranged along a sensor axis, a mounting flange extending about the sensor axis the axially offset along the sensor axis from the housing, and one or more intermediate flange. The one or more intermediate flange is arranged between the housing and the mounting flange along the sensor axis, the one or more intermediate flange coupling the mounting flange to the housing. The one or more intermediate flange is spaced apart from mounting flange to limit thermal communication between the mounting flange and the housing. Gas turbine engines and methods of cooling sensor assemblies are also described.

The invention of the present disclosure may be a temperature probe comprising a probe body. The probe body may comprise a tip, a tube, a sleeve configured to join the tip and the tube, the sleeve having one or more tapered ends configured to at least partially enter the tip and the tube, and an end, where a cavity may extend from the proximal end to the distal end, and where the cavity may be internal to the tip, the tube, the sleeve, and the end. The temperature probe may comprise a printed circuit board (PCB) comprising a proximal rigid PCB, a flex PCB, and a distal rigid PCB and a temperature sensor disposed within the tip. A battery may be disposed between the proximal rigid PCB and the distal rigid PCB, the battery at least partially surrounded by the flex PCB.

The invention of the present disclosure may be a temperature probe comprising a probe body. The probe body may comprise a tip, a tube, a sleeve configured to join the tip and the tube, the sleeve having one or more tapered ends configured to at least partially enter the tip and the tube, and an end, where a cavity may extend from the proximal end to the distal end, and where the cavity may be internal to the tip, the tube, the sleeve, and the end. The temperature probe may comprise a printed circuit board (PCB) comprising a proximal rigid PCB, a flex PCB, and a distal rigid PCB and a temperature sensor disposed within the tip. A battery may be disposed between the proximal rigid PCB and the distal rigid PCB, the battery at least partially surrounded by the flex PCB.

In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.

In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.

A temperature probe includes a sheath, a temperature sensitive element, and an insert. The sheath has a sidewall defining an interior space therein. The temperature sensitive element is disposed within the interior space of the sidewall and has an electrical characteristic that varies with temperature. The insert, which is formed of silicon carbide, is operably interposed between the sidewall and the temperature-sensitive element. A method of manufacturing a temperature probe is also provided. A temperature sensing system employing a temperature probe is also provided.

A vacuum heat treatment apparatus according to the embodiment comprises a chamber; a thermal insulator in the chamber; a reaction container in the thermal insulator; a heating member between the reaction container and the the thermal insulator for heating the reaction container; and a temperature measuring member in or on a surface of the reaction container, wherein the temperature measuring member comprises a thermocouple and a protective tube surrounding the thermocouple, and the protective tube comprises tungsten (W), tantalum (Ta), or silicon carbide (SiC).

A vacuum heat treatment apparatus according to the embodiment comprises a chamber; a thermal insulator in the chamber; a reaction container in the thermal insulator; a heating member between the reaction container and the the thermal insulator for heating the reaction container; and a temperature measuring member in or on a surface of the reaction container, wherein the temperature measuring member comprises a thermocouple and a protective tube surrounding the thermocouple, and the protective tube comprises tungsten (W), tantalum (Ta), or silicon carbide (SiC).