The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.

The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.

A device for determining the temperature of an object includes a main body with an interior space delimited by walls for receiving an object, the temperature of which is to be determined, wherein at least one determination element configured to determine the temperature is arranged or formed within at least one wall, and also at least one thermally conductive contact element which is arranged or formed on or in the wall within which the determination element is arranged or formed.

A sensor unit disclosed herein is a temperature sensor unit to be attached to an energy storage device. The temperature sensor unit includes an FPC to be positioned on an energy storage device body, a temperature sensor connected to a detection line of the FPC, a housing disposed on the FPC and covering the temperature sensor, and a biasing member elastically and deformably held in the housing and configured to bias the lower housing of the housing toward the energy storage device body by elastic restoring force to bring the temperature sensor into contact with the energy storage device body with the FPC therebetween.

A cooktop appliance includes a gas burner, a user input configured to define a power setting of the gas burner, and a grate. The grate includes a sensor finger with a temperature sensor mounted thereto. The temperature sensor includes a first temperature probe extending above a top surface of the sensor finger and a second temperature probe positioned within the sensor finger. The cooktop appliance also includes a controller in communication with the temperature sensor. The temperature sensor is configured to transmit a first temperature measurement from the first temperature probe and a second temperature measurement from the second temperature probe to the controller. The controller is configured to determine a temperature of a cooking utensil positioned on the top surface of the sensor finger based on the power setting defined by the user input, the first temperature measurement, and the second temperature measurement.

In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.

In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.

The present disclosure relates to a coupling adapter for a measuring insert for determining and/or monitoring a temperature of a medium including a temperature sensor, which measuring insert can be introduced into a protective tube for accommodating the measuring insert. The coupling adapter includes a base body, including a bore with a diameter adapted to an outer diameter of the measuring insert, and a coupling element, which is arranged on an outer surface of the base body, which coupling element is embodied and/or dimensioned so as to serve for fixing the measuring insert inside the protective tube in a state in which the measuring insert is introduced into the protective tube. The present disclosure further includes an apparatus for determining and/or monitoring the temperature of a medium comprising such coupling adapter.

The present disclosure relates to a measuring insert for insertion into a protective tube for determining and/or monitoring a temperature of a medium in a vessel or pipe, which protective tube at least partially protrudes into an inner volume of the vessel or pipe, the measuring insert including: an elongated tube; a temperature sensor arranged inside an end region of the measuring insert; and a coupling element connected to the elongated tube in the end region in which the temperature sensor is arranged, which coupling element is embodied and/or dimensioned so as to serve for fixing the measuring insert inside the protective tube in a state in which the measuring insert is introduced into the protective tube.

A temperature sensor comprises a temperature sensing element, a protective housing, and a heat transfer element. The temperature sensing element transduces a sensed temperature into an electrical output signal. The protective housing at least partly encases the temperature sensing element. The heat transfer element has an outer surface in heat conductive contact with an inner wall of the protective housing and receives at least a part of the temperature sensing element. The heat transfer element is formed separately from the temperature sensing element.