A sensor assembly has a housing for mounting on a shaft of an idler roller in a belt conveyor system. The housing has one or more sensors for detecting one or more parameters of the idler roller and a processor in communication with the sensors and a wireless communication device. The sensors transmit the detected parameter data to the processor, which causes the detected parameter data to be transmitted by the wireless communication device. A monitoring system is also provided.

An antenna device according to an exemplary embodiment includes a first metal layer, a first dielectric layer, a second metal layer, and a second dielectric layer. The first dielectric layer has a thermal conductivity and heat resistance that are higher than those of an FR-4 resin. The antenna device includes a first metal terminal and a second metal terminal, and a thermosensor. A pair of an input terminal and an output terminal of the thermosensor are electrically connected to the first metal terminal and the second metal terminal, respectively, and the second metal layer includes a first segment and a second segment. The first metal terminal is disposed above the first segment, and the second metal terminal is disposed above the second segment.

An assembly for detecting a temperature of an electrically conductive element comprises a temperature probe and a heat conductor separate from the temperature probe and made of an electrically insulating and heat-conductive material. The heat conductor surrounds the temperature probe at least in sections and has a bearing surface bearing against the electrically conductive element.

Provided herein is an apparatus and method for sensing the temperature of a tubing wall, and inferentially the temperature of a fluid within the tubing. The apparatus includes first and second clamp bodies, the first clamp body comprising a heat transfer element and a first and a second electrical connection connected thereto, the second clamp body connectable to the first clamp body to form a clamping cavity therebetween within which a clamped element having a wall is securable, the heat transfer element configured to contact an outer surface of a clamped element therebetween. The heat transfer element may include a thermally conductive compliant element extending through one of the clamp bodies and inwardly of the clamping cavity.

The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.

The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.

A temperature sensor includes a metal tube having an opening tip portion, a temperature sensing element for measuring a temperature, a pair of lead wires contacting with a surface of the temperature sensing element, an insulating support material for insulating the pair of lead wires from the metal tube, and a coating material for covering the temperature sensing element, lead tip portions of the pair of lead wires, and a tip surface of the insulating support material at the opening tip portion of the metal tube. The coating material has a property of not allowing measurement target gas to pass through and contains oxide and at least one of platinum, platinum alloy, and platinum-containing oxide that are dispersed in the oxide.

Provided is a temperature measuring device which includes: a flexible printed circuit board with wiring; a thermistor element; a heat collecting plate; and a pressing member. The flexible printed circuit board is configured to be attached to a case that is fixed to an object to be measured, the thermistor element is electrically connected to the wiring, the heat collecting plate is disposed on a side opposite to the thermistor element via the flexible printed circuit board so as to be pressed against a temperature measuring point in the object to be measured, and the pressing member is made of a foam material and is configured to be compressed when the case is fixed to the object to be measured and to press the heat collecting plate against the object to be measured.

The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.

The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.